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http://dx.doi.org/10.6117/kmeps.2017.24.2.023

Reliability Assessment and Prediction of Solder Joints in High Temperature Heaters  

Park, Eunju (UNIST)
Kwon, Daeil (UNIST)
Sa, Yoonki (SEMES Co., Ltd.)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.2, 2017 , pp. 23-27 More about this Journal
Abstract
This paper proposes an approach to predict the reliability of high temperature heaters by identifying their primary failure modes and mechanisms in the field. Test specimens were designed to have the equivalent stress conditions with the high temperature heaters in the field in order to examine the effect of stress conditions on the solder joint failures. There failures often result from cracking due to intermetallic compound (IMC) or void formation within a solder joint. Aging tests have been performed by exposing the test specimens to a temperature of $170^{\circ}C$ in order to reproduce solder joint failures in the field. During the test, changes in IMC formation were investigated by scanning electron microscopy (SEM) on the cross-sections of the test specimens, while changes in void formation were monitored both by resistance spectroscopy and by micro-computed tomography (microCT), alternately. The test results demonstrated the void volume within the solder increased as the time at the high temperature increased. Also, the phase shift of high frequency resistance was found to have high correlation with the void volume. These results implied the failure of high temperature heaters can be non-destructively predicted based on the correlation.
Keywords
Solder joint; reliability; resistance spectroscopy; high temperature heaters; computed tomography;
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Times Cited By KSCI : 2  (Citation Analysis)
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