• 대한기계학회논문집A
• /
• 제24권9호
• /
• pp.2174-2183
• /
• 2000

In this paper, the evaluation method of interfacial fracture toughness to apply the fracture toughness was investigated in adhesively bonded joints of AI/Ced./A1. Four types of adhesively bonded double-cantilever beam(DCB) joints with the interface crack were prepared for the test of interfacial fracture toughness. The experiments to measure the interfacial fracture toughness were performed under the various mixed-mode conditions. The critical energy release rate, Gc, was obtained by the experimental measurement of compliances. From the experimental results, the interfacial fracture toughness for the mixed-mode specimens is well characterized by the energy release rate, and the method of strength evaluation by the interfacial fracture toughness was discussed in adhesively bonded joints.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
• /
• pp.199-202
• /
• 2002

Interfacial properties and electrical sensing for fiber fracture in carbon and SiC fibers/epoxy composites were investigated by the electrical resistance measurement and fragmentation test. As fiber-embedded angle increased, interfacial shear strength (IFSS) of two-type fiber composites decreased, and the elapsed time was long to the infinity in electrical resistivity. The initial slope of electrical resistivity increased rapidly to the infinity at higher angle, whereas electrical resistivity increased gradually at small angle. Furthermore, both fiber composites with small embedded angle showed a fully-developed stress whitening pattern, whereas both composites with higher embedded angle exhibited a less developed stress whitening pattern. As embedded angle decreased, the gap between the fragments increased and the debonded length was wider for both fiber composites. Electro-micromechanical technique can be a feasible nondestructive evaluation to measure interfacial sensing properties depending on the fiber-embedded angle in conductive fiber reinforced composites.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1998년도 춘계학술대회 논문집
• /
• pp.220-226
• /
• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2005년도 춘계학술발표대회 논문집
• /
• pp.42-45
• /
• 2005

Interfacial evaluation of various combinations of both Flax and Hemp fibers/polypropylene were performed by using micromechanical test and nondestructive acoustic emission (AE). It can be because interfacial adhesion between the natural fiber surface and matrix plays an important role in controlling the overall mechanical properties of polymer composite materials by transferring the stress from the matrix to the fiber. It is necessary to characterize the interphase and the level of adhesion to understand the performance of the composites properly. Microfailure mechanism of single Flax fiber bundles were investigated using the combination of single fiber tensile test and nondestructive acoustic emission. Microfailure modes of the different natural fiber/polypropylene systems were observed using optical microscope and determined indirectly by AE and their FFT analysis.

• 한국복합재료학회:학술대회논문집
• /
• 한국복합재료학회 2005년도 추계학술발표대회 논문집
• /
• pp.141-144
• /
• 2005

Sensing and interfacial evaluation of Ni nanowire strands/polymer composites were investigated using Electro-micromechanical technique. Electro-micromechanical techniques can be used as sensing method for micro damage, loading, temperature of interfacial properties. Using Ni nanowire strands/silicone composites with different content, load sensing response of electrical contact resistivity was investigated under tensile and compression condition. The mechanical properties of Ni nanowire strands with different type/epoxy composites were measured using uniformed cyclic loading and tensile test. Ni nanowire strands/epoxy composites showed humidity and temperature sensing within limited ranges, 20 vol% reinforcement. Some new information on temperature and humidity sensing plus loading sensing of Ni nanowire strands/polymer composites could be obtained from the electrical resistance measurement as a new concept of the nondestructive interfacial evaluation.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 춘계학술대회
• /
• pp.36-41
• /
• 2004

A method to measure the interfacial toughness of film/substrate by nanoindenter is proposed. As the thickness of the film decreases, the measurement of the interfacial toughness requires the more sophisticated equipment such as nanoindenter. In this study, the nanoindenter is applied to the substrate near the interface of film/substrate in the direction perpendicular to the normal of the interface, causing the cohesive fracture of the substrate, followed by the interfacial cracking. The specimen of Cu($0.56 {\mu}m$)/Si(530 ${\mu}$) are made by sputtering the copper onto the silicon wafer. By scratching the copper surface, we can make the easy interfacial cracking during the nanoindentation. It is found that the averaged values of the interfacial toughness of the Cu/Si is $0.664{\pm}0.3\;J/m^2$ . The phase angle of the specimen in this study is ${\psi}{\simeq}-36.8^{\circ}$, computed by the method of Suo and Hutchinson.[1]

• 폴리머
• /
• 제27권3호
• /
• pp.189-194
• /
• 2003

Electro-micromechanical 시험법을 이용하여 탄소 섬유 강화 열경화성 수지 복합재료의 경화 방법에 따른 계면 평가와 손상 감지능 및 경화 모니터링에 대해 고찰하였다. 경화 후 잔류 응력은 전기 저항 측정을 통해 모니터링 하였으며, 경화 방법에 따라 상호 비교하였다. 기지 재료의 인장 강도, 탄성률 및 계면 전단 강도는 열 경화의 경우가 자외선 경화보다 더 크게 나타났으며, 열 경화에서 경화 수축은 열팽창 계수 차이에 의한 잔류 응력 및 기지 재료의 수축에 의해 자외선 경화와 비교하여 더 크게 나타났다. 열 경화 시의 경화 중 전기 저항은 자외선 경화보다 더 큰 범위에서 변하였으며, 기지 재료의 기계적 물성과 계면 접착력에 의해 다르게 나타나는 겉보기 탄성률 또한 더 컸고, 같은 응력까지 더 빠르게 도달하였다.

• Composites Research
• /
• 제12권2호
• /
• pp.10-25
• /
• 1999

Fragmentation 시험법에 의한 섬유상 복합재료의 계면적 특성에 대한 새로운 평가방법이, 순차적으로 섬유간의 간격이 변하게 된 단계적 다섬유 복합재료를 사용하여 제시되었다. 섬유간의 간격이 증가함에 따라, 부서진 섬유들의 형상비는 감소하였으며, 섬유와 기지간의 계면전단강도는 증가함을 보여주었다. 섬유간 거리의 역수를 취했을 때에, 형상비와 계면전단강도 모두가 포화되는 값을 보여주었다. 이것은 단계적 다섬유 복합재료가 형상비에서의 상한값을 나타내고, 계면전단강도에서 하한값을 보여준다는 것을 의미한다. 이 fragmentation 시험법은 복합재료의 평가에 새로운 방법이 될 수 있다. 왜냐하면, 이 두 한계값의 차이를 줄이는 것이 복합재료의 강화에 효과적이기 때문이다. 또한, 섬유 파괴점 부근에서의 섬유응력 분포와 위의 결과를 관련시키기 위해 탄송-소성 유한요소 해석이 행해졌다. 단계적 다섬유 복합재료 시험에서 얻어진 한계값은 그룹형태의 다 섬유 파괴에 의해 야기된 응력집중과 밀접하게 관련되어 있다는 것이 입증되었다.

• 비파괴검사학회지
• /
• 제28권6호
• /
• pp.504-511
• /
• 2008

This paper proposes an ultrasonic measurement method for measurement of linear interfacial stiffness of contacting surface between two steel plates subjected to nominal compression pressures. Interfacial stiffness was evaluated by using shear waves reflected at contact interface of two identical solid plates. Three consecutive reflection waves from solid-solid surface are captured by pulse-echo method to evaluate the state of contact interface. A non-dimensional parameter defined as the ratio of their peak-to-peak amplitudes are formulated and used to calculate the quantitative stiffness of interface. Mathematical model for 1-D wave propagation across interfaces is developed to formulate the reflection and transmission waves across the interface and to determine the interfacial stiffness. Two identical plates are fabricated and assembled to form contacting surface and to measure interfacial stiffness at different states of contact pressure by means of bolt fastening. It is found from experiment that the amplitude of interfacial stiffness is dependent on the pressure and successfully determined by employing pulse-echo ultrasonic method without measuring through-transmission waves.

• 대한기계학회논문집A
• /
• 제26권6호
• /
• pp.1187-1193
• /
• 2002

Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.