• 한국세라믹학회지
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• 제55권3호
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• pp.244-260
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• 2018

Issues in the electrical characterization of semiconducting photoanodes in a photoelectrochemical (PEC) cell, such as the cell geometry dependence, scan rate dependence in DC measurements, and the frequency dependence in AC measurements, are addressed, using the example of a $TiO_2$ photoanode. Contrary to conventional constant phase element (CPE) modeling, the capacitive behavior associated with Mott-Schottky (MS) response was successfully modeled by a Havriliak-Negami (HN) capacitance function-which allowed the determination of frequency-independent Schottky capacitance parameters to be explained by a trapping mechanism. Additional polarization can be successfully described by the parallel connection of a Bisquert transmission line (TL) model for the diffusion-recombination process in the nanostructured $TiO_2$ electrode. Instead of shunt CPEs generally employed for the non-ideal TL feature, TL models with ideal shunt capacitors can describe the experimental data in the presence of an infinite-length Warburg element as internal interfacial impedance - a characteristic suggested to be a generic feature of many electrochemical cells. Fully parametrized impedance spectra finally allow in-depth physicochemical interpretations.

• Korea-Australia Rheology Journal
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• 제19권4호
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• pp.233-242
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• 2007

We performed a numerical investigation to find out the optimal choice of the spatial discretization in the distributed-Lagrangian-multiplier/fictitious-domain (DLM/FD) method for the solid/fluid interaction problem. The elastic solid bar attached on the bottom in a pressure-driven channel flow of a Newtonian fluid was selected as a model problem. Our formulation is based on the scheme of Yu (2005) for the interaction between flexible bodies and fluid. A fixed regular rectangular discretization was applied for the description of solid and fluid domain by using the fictitious domain concept. The hydrodynamic interaction between solid and fluid was treated implicitly by the distributed Lagrangian multiplier method. Considering a simplified problem of the Stokes flow and the linearized elasticity, two numerical factors were investigated to clarify their effects and to find the optimum condition: the distribution of Lagrangian multipliers and the solid/fluid interfacial condition. The robustness of this method was verified through the mesh convergence and a pseudo-time step test. We found that the fluid stress in a fictitious solid domain can be neglected and that the Lagrangian multipliers are better to be applied on the entire solid domain. These results will be used to extend our study to systems of elastic particle in the Stokes flow, and of particles in the viscoelastic fluid.

• Steel and Composite Structures
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• 제42권3호
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• pp.407-426
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• 2022

Superior to traditional welded studs, high strength friction-grip bolted shear connectors facilitate the assembling and demounting of the composite members, which maximizes the potential for efficiency in the construction and retrofitting of new and old structures respectively. Hence, it is necessary to investigate the structural properties of high strength friction-grip bolts used in steel concrete composite beams. By means of push-out tests, an experimental study was conducted on post-installed high strength friction-grip bolts, considering the effects of different bolt size, concrete strength, bolt tensile strength and bolt pretension. The test results showed that bolt shear fracture was the dominant failure mode of all specimens. Based on the load-slip curves, uplifting curves and bolt tensile force curves between the precast concrete slab and steel beam obtained by push-out tests, the anti-slip performance of steel-concrete interface and shear behavior of bolt shank were studied, including the quantitative analysis of anti-slip load, and anti-slip stiffness, frictional coefficient, shear stiffness of bolt shank and ultimate shear capacity. Meanwhile, the interfacial anti-slip stiffness and shear stiffness of bolt shank were defined reasonably. In addition, a total of 56 push-out finite element models verified by the experimental results were also developed, and used to conduct parametric analyses for investigating the shear behavior of high-strength bolted shear connectors in steel-concrete composite beams. Finally, on ground of the test results and finite element simulation analysis, a new design formula for predicting shear capacity was proposed by nonlinear fitting, considering the bolt diameter, concrete strength and bolt tensile strength. Comparison of the calculated value from proposed formula and test results given in the relevant references indicated that the proposed formulas can give a reasonable prediction.

• 한국전기전자재료학회논문지
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• 제28권11호
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• pp.683-689
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• 2015

For the formation of $N^+$ doping, the antimony ions are mainly used for the fabrication of a BJT (bipolar junction transistor), CMOS (complementary metal oxide semiconductor), FET (field effect transistor) and BiCMOS (bipolar and complementary metal oxide semiconductor) process integration. Antimony is a heavy element and has relatively a low diffusion coefficient in silicon. Therefore, antimony is preferred as a candidate of ultra shallow junction for n type doping instead of arsenic implantation. Three-dimensional (3D) profiles of antimony are also compared one another from different tilt angles and incident energies under same dimensional conditions. The diffusion effect of antimony showed ORD (oxygen retarded diffusion) after thermal oxidation process. The interfacial effect of a $SiO_2/Si$ is influenced antimony diffusion and showed segregation effects during the oxidation process. The surface sputtering effect of antimony must be considered due to its heavy mass in the case of low energy and high dose conditions. The range of antimony implanted in amorphous and crystalline silicon are compared each other and its data and profiles also showed and explained after thermal annealing under inert $N_2$ gas and dry oxidation.

• 대한기계학회논문집
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• 제15권1호
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• pp.163-168
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• 1991

본 연구에서는 여러가지의 성형조건에서 미끄름을 지배하는 상수를 측정하고, 유동 선단(flow front)에 미치는 이 상수의 영향을 검토한다. 또 측정된 상수를 가 지고 사각형 및 중공 원형 평판 압축성형에 대해서 2차원 유한 요소해석을 하고 실험 결과와 비교 검토한다.

• 대한기계학회논문집
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• 제18권8호
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• pp.2139-2157
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• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Structural Engineering and Mechanics
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• 제72권5호
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• pp.557-568
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• 2019

Accurate modeling of contact interface in bolted joints is crucial in predicting the dynamic behavior for bolted assemblies under external load. This paper presents a contact pressure distribution based non-uniform virtual material method to describe the joint interface of assembly structure, which is connected by sparsely distributed multi-bolts. Firstly, the contact pressure distribution of bolted joints is obtained by the nonlinear static analysis in the finite element software ANSYS. The contact surface around bolt hole is divided into several sub-layers, and contact pressure in each sub-layer is thought to be evenly. Then, considering multi-asperity contact at the micro perspective, the relationship between contact pressure and interfacial virtual material parameters for each sub-layer is established by using the fractal contact theory. Finally, an experimental platform for the dynamic characteristics testing of a beam lap structure with double-bolted joint is constructed to validate the efficiency of proposed method. It is found that the theoretical results are in good agreement with experimental results by impact response in both time- and frequency-domain, and the relative errors of the first four natural frequencies are less than 1%. Furthermore, the presented model is used to examine the effect of rough contact surface on dynamic characteristics of bolted joint.

• 대한기계학회논문집A
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• 제30권12호
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• pp.1543-1550
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• 2006

Since the performance of joints usually determines the structural efficiency of composite structures, an extensive knowledge of the behavior of adhesive joints and the related effect on joint strength is essential for design purposes. In this study, the torque capacity of adhesive joints was predicted using the combined thermal and mechanical analyses when the adherend was a composite tube. A finite element analysis was performed to evaluate residual thermal stresses developed in the joint, and mechanical s stresses in the adhesive were calculated including both the nonlinear adhesive behavior and the behavior of composite tubes. Three different joint failure modes were considered to predict joint failure: interfacial failure, adhesive bulk failure, and adherend failure. The influence of the composite adherend stacking angle on the residual thermal stresses was investigated, and how the residual thermal stresses affect the joint strength was also discussed. Finally, the predicted results were compared with experimental results available in literature.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.382.1-382.1
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• 2014

Graphene field-effect transistors (GFET) is one of candidates for future high speed electronic devices since graphene has unique electronic properties such as high Fermi velocity (vf=10^6 m/s) and carrier mobility ($15,000cm^2/V{\cdot}s$) [1]. Although the contact property between graphene and metals is a crucial element to design high performance electronic devices, it has not been clearly identified. Therefore, we need to understand characteristics of graphene/metal contact in the GFET. Recently, it is theoretically known that graphene on metal can be doped by presence of interface dipole layer induced by charge transfer [2]. It notes that doping type of graphene under metal is determined by difference of work function between graphene and metal. In this study, we present the GFET fabricated by contact metals having high work function (Pt, Ni) for p-doping and low work function (Ta, Cr) for n-doping. The results show that asymmetric conductance depends on work function of metal because the interfacial dipole is locally formed between metal electrodes and graphene. It induces p-n-p or n-p-n junction in the channel of the GFET when gate bias is applied. In addition, we confirm that charge transfer regions are differently affected by gate electric field along gate length.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.