• 제목/요약/키워드: interfacial crack

검색결과 179건 처리시간 0.024초

Three-dimensional numerical simulation and cracking analysis of fiber-reinforced cement-based composites

  • Huang, Jun;Huang, Peiyan
    • Computers and Concrete
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    • 제8권3호
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    • pp.327-341
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    • 2011
  • Three-dimensional graphic objects created by MATLAB are exported to the AUTOCAD program through the MATLAB handle functions. The imported SAT format files are used to produce the finite element mesh for MSC.PATRAN. Based on the Monte-Carlo random sample principle, the material heterogeneity of cement composites with randomly distributed fibers is described by the WEIBULL distribution function. In this paper, a concept called "soft region" including micro-defects, micro-voids, etc. is put forward for the simulation of crack propagation in fiber-reinforced cement composites. The performance of the numerical model is demonstrated by several examples involving crack initiation and growth in the composites under three-dimensional stress conditions: tensile loading; compressive loading and crack growth along a bimaterial interface.

Effect of Atmospheric Plasma Treatment of Carbon Fibers on Crack Resistance of Carbon Fibers-reinforced Epoxy Composites

  • Park, Soo-Jin;Oh, Jin-Seok;Rhee, Kyong-Yop
    • Carbon letters
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    • 제6권2호
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    • pp.106-110
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    • 2005
  • In this work, the effects of atmospheric oxygen plasma treatment of carbon fibers on mechanical interfacial properties of carbon fibers-reinforced epoxy matrix composites was studied. The surface properties of the carbon fibers were determined by acid/base values, Fourier-transform infrared spectrometer (FT-IR), and X-ray photoelectron spectroscopy (XPS) analyses. Also, the crack resistance properties of the composites were investigated in critical stress intensity factor ($K_{IC}$), and critical strain energy release rate mode II ($G_{IIC}$) measurements. As experimental results, FT-IR of the carbon fibers showed that the carboxyl/ester groups (C=O) at 1632 $cm^{-1}$ and hydroxyl group (O-H) at 3450 $cm^{-1}$ were observed for the plasma treated carbon fibers, and the treated carbon fibers had the higher O-H peak intensity than that of the untreated ones. The XPS results also indicated that the $O_{1S}/C_{1S}$ ratio of the carbon fiber surfaces treated by the oxygen plasma led to development of oxygen-containing functional groups. The mechanical interfacial properties of the composites, including $K_{IC}$ (critical stress intensity factor) and $G_{IIC}$ (critical strain energy release rate mode II), were also improved for the oxygen plasma-treated carbon fibersreinforced composites. These results could be explained that the oxygen plasma treatment played an important role to increase interfacial adhesions between carbon fibers and epoxy matrix resins in our composite system.

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반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴역학적 연구 (1) -층간박리- (A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(l) -Delamination-)

  • 박상선;반용운;엄윤용
    • 대한기계학회논문집
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    • 제18권8호
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    • pp.2139-2157
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    • 1994
  • In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

Mechanical Behaviors of CFRP Laminate Composites Reinforced with Aluminum Oxide Powder

  • Kwon, Oh-Heon;Yun, Yu-Seong;Ryu, Yeong-Rok
    • 동력기계공학회지
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    • 제18권6호
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    • pp.166-173
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    • 2014
  • In this study, a laminated composite material with dispersing aluminum oxide powder between the CFRP laminate plies, and also CFRP composites without aluminium oxide powder were fabricated for Mode I experiments using the DCB specimen and a tensile test. The behavior of the crack and the change of the interfacial fracture toughness were evaluated. Also in order to evaluate the damage mechanism for the crack extension, the AE sensor on the surface of the DCB test specimen was attached. AE amplitude was estimated for CFRP-alumina and CFRP composite. And the fracture toughness was evaluated by the stress intensity factor and energy release rate. The results showed that an unstable crack was propagated rapidly in CFRP composite specimen along with the interface, but crack propagation in CFRP-alumina specimen was relatively stable. From results, we show that aluminium oxide powder spreaded uniformly in the interface of the CFRP laminate carried out the role for preventing the sudden crack growth.

알루미나 장섬유 강화 복합금속재의 피로균열성장거동 (Fatigue Crack Growth Behavior of a Continuous Alumina Fiber Reinforced Metal Matrix Composite Materials)

  • 김두환;박희정;박희정
    • 대한토목학회논문집
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    • 제11권1호
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    • pp.29-36
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    • 1991
  • 장섬유 강화 마그네슘 복합제(FP/ZE41A)의 피로 균열 성장 거동에 대한 열처리 효과를 규명한 것으로 TEM관측에 의해 알루미나 섬유와 마그네슘 복합 매트릭스간의 상호 접변을 완화시키기 위하여 풀림을 실시하였다. 피로 균열 성장 방향에 수직한 섬유와 평행한 섬유들에 대한 피로 균열 성장 거동에 관한 실험을 실시 한 바, 피로 균열 성장 방향에 수직한 시험편의 경우 열처리를 실시한 시험편은 잔류 응력을 제거시키지 않은 시험편에 비해 피로 균열 성장에 대한 더 많은 저항성을 갖고 있음을 알수 있었다. 그러나, 이에 반해 피로 균열 성장 방향에 평행한 시험편의 경우는 잔류 응력을 제거시키지 않은 시험편 이 열처리를 실시한 시험편에 비해 더 많은 피로 균열 성장 저항성을 내포하고 있다는 피로 균열 성장 거동에 대한 차이점을 발견할 수 있었다. 피로 파괴 표면에 대한 연성 파열과 섬유 박리를 SEM관찰한 결과 열처리는 피로균열 성장 거동에서 지적된 바와 같이 섬유와 매트릭스 상호면의 강도를 약화시킨다는 것을 알 수 있었다.

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20 nm 두께의 ITO층이 코팅된 ITO/PET Sheet의 저항 및 균열형성 특성 연구 (A Study on the Resistance and Crack Propagation of ITO/PET Sheet with 20 nm Thick ITO Film)

  • 김진열;홍순익
    • 한국세라믹학회지
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    • 제46권1호
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    • pp.86-93
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    • 2009
  • The crack formation and the resistance of ITO film on PET substrate with a thickness of 20 nm were investigated as a function of strain. The onset strain for the increase of resistance increased with increasing strain rate, suggesting the crack initiation is dependent on the strain rate. Electrical resistance increased at the strain of 1.6% at the strain rates below $10^{-4}/sec$ while it increased at ${\sim}2%$ at the strain rates above $10^{-3}/sec$. The critical strain at which the cracks were formed is close to the proportional limit. Upon loading, the initial cracks perpendicular to the tensile axis were observed and propagated the whole sample width with increasing strain. The spacing between horizontal cracks is thought to be determined by the fracture strength and the interfacial strength between ITO and PET. The crack density increased with increasing strain. However, the effect of the strain rate on the crack density was less pronounced in ITO/PET with 20 nm ITO thickness than ITO/PET with 125 nm ITO thickness, the strength of ITO film is thought to increase as the thickness on ITO film decreases. The absence of cracks on ITO film at a strain as close as 1.5% can be attributed to the compressive residual stress of ITO film which was developed during cooling after the coating process. The higher critical strain for the onset of the resistance increase and the crack initiation of ITO/PET with a thinner ITO film (20 nm) can be linked with the higher strength of the thinner ITO film.

열처리 방법에 따른 SOI 기판의 스트레스변화 (Stress Evolution with Annealing Methods in SOI Wafer Pairs)

  • 서태윤;이상현;송오성
    • 한국재료학회지
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    • 제12권10호
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    • pp.820-824
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    • 2002
  • It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

Interfacial degradation of thermal barrier coatings in isothermal and cyclic oxidation test

  • Jeon, Seol;Lee, Heesoo;Choi, Youngkue;Shin, Hyun-Gyoo;Jeong, Young-Keun
    • 한국결정성장학회지
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    • 제24권4호
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    • pp.151-157
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    • 2014
  • The degradation mechanisms of thermal barrier coatings (TBCs) were investigated in different thermal fatigue condition in terms of microstructural analyses. The isothermal and cyclic oxidation tests were conducted to atmospheric plasma sprayed-TBCs on NIMONIC 263 substrates. The delamination occurred by the oxide layer formation at the interface, the Ni/Cr-based oxide was formed after Al-based oxide layer grew up to ${\sim}10{\mu}m$ in the isothermal condition. In the cyclic oxidation with dwell time, the failure occurred earlier (500 hr) than in the isothermal oxidation (900 hr) at same temperature. The thickness of Al-based oxide layer of the delaminated specimen in the cyclic condition was ${\sim}4{\mu}m$ and the interfacial cracks were observed. The acoustic emission method revealed that the cracks generated during the cooling step. It was considered that the specimens were prevented from the formation of the Al-based oxide by cooling treatment, and the degradation mode in the cyclic test was dominantly interfacial cracking by the difference of thermal expansion coefficients of the coating layers.

SiC 휘스커 강화 Al2O3 복합재료의 고인화 (Toughening of SiC Whisker Reinforced Al2O3 Composite)

  • 김연직;송준희
    • 한국재료학회지
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    • 제14권9호
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    • pp.649-654
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    • 2004
  • In this paper, the fracture toughness and mechanisms of failure in a random SiC-whisker/$Al_{2}O_3$ ceramic composite were investigated using in situ observations during mode I(opening) loading. $SiC_{w}/Al_{2}O_3$ composite was obtained by hot press sintering of $Al_{2}O_3$ powder and SiC whisker as the matrix and reinforcement, respectively. The whisker and powder were mixed using a turbo mill. The composite was produced at SiC whisker volume fraction of $0.3\%$. Compared with monolithic $Al_{2}O_3$, fracture toughness enhancement was observed in $SiC_{w}/Al_{2}O_3$ composite. This improved fracture toughness was attributed to SiC whisker bridging and crack deflection. $SiC_{w}/Al_{2}O_3$ composite exhibited typically brittle fracture behavior, but a fracture process zone was observed in this composite. This means that the load versus load-line displacement curve of $SiC_{w}/Al_{2}O_3$ composite from a fracture test may involve a small non-linear region near the peak load.

A Cohesive Surface Separation Potential

  • Lee, Youngseog;Kim, Kwang-Soo
    • Journal of Mechanical Science and Technology
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    • 제16권11호
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    • pp.1435-1439
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    • 2002
  • This paper presents a form of the cohesive surface separation potential, which can produce potential curves by varying a single dimensionless parameter. Results show that a partial modification of Xu and Needleman's (1994) cohesive surface separation potential makes it possible to present the other potential corves as a special case as long as the normal separation is concerned. The proposed potential may describe interfacial debonding-crack initiation and growth-character of materials and, through numerical simulation, provide an insight for the effect of different cohesive surface separation potentials on the interfacial debonding.