• Journal of the Korean Society of Clothing and Textiles
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• v.17 no.3
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• pp.380-390
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• 1993

Effect of interfacial electrical conditions on adhesion of ${\alpha}-Fe_2O_3$ particles to PET fabric and the removal of ${\alpha}-Fe_2O_3$ particles from PET fabric, were investigated as functions of pH, electrolyte and ionic strength. The ${\zeta}$ potential of PET fiber and ${\alpha}-Fe_2O_3$ particles in the electrolyte solution were measured by streaming potential and microelectrophoresis methods respectively. The potential energy of interaction between ${\alpha}-Fe_2O_3$ particles and PET fabric were calculated by using the heterocoagulation theory for a sphere-plate model. The negative ${\zeta}$ potential of ${\alpha}-Fe_2O_3$ particle and PET fiber increased with pH, and then decreased certain pH and isoelectric points of ${\alpha}-Fe_2O_3$ particles and PET fiber were pH 6.5 and pH 3.5, respectively. The negative ${\zeta}$ potential of ${\alpha}-Fe_2O_3$ particle and PET fiber affected by electrolytes, were relatively high with polyanion electrolytes in solutions and were low with neutral salts. However, at surfactant solution, ${\zeta}$ potential was levelled off. The influence of the ionic strength on the ${\zeta}$ potential of ${\alpha}-Fe_2O_3$ particle was small but the negative ${\zeta}$ potential of PET fiber increased with the ionic strength. In the presence of anionic surfactant, the ${\zeta}$ potential of ${\alpha}-Fe_2O_3$ particle and PET fiber increased regardless of solution conditions. The interaction energy between ${\alpha}-Fe_2O_3$ particle and PET fabric increased with pH. The interaction energy was relatively high with polyanion electrolytes in solution, and the influence of ionic strength on the interaction energy was small, and the effective thickness of electrical double layer increased with decreasing the ionic strength.

• Applied Chemistry for Engineering
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• v.10 no.8
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• pp.1141-1146
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• 1999

Melt blend of PA6/PP-g-MA system containing SEBS-g-MA as a compatible impact modifier was prepared to investigate the change of mechanical properties and morphologies. The tensile strength slightly decreased, but the elongation at break increased with increasing content of SEBS-g-MA in the blend. Also the notched izod impact strength increased with increasing the content of PP-g-MA and SEBS-g-MA. It is attributed to improved compatibilization and interfacial adhesion by reaction of the amide of PA6 with maleic anhydride of SEBS-g-MA and PP-g-MA. The result of dynamic mechanical analysis(DMA) showed a typical behavior of the compatibilization in the polymer blends. Finally, in the phase structure observed by the use of SEM, we confirmed improvement of the compatibilization and interfacial adhesion with increasing the content of SEBS-g-MA and PP-g-MA.

• Polymer(Korea)
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• v.36 no.5
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• pp.573-578
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• 2012

In general, most physical properties of wood/polyvinyl chloride (PVC) composites are lower than those of corresponding neat PVC resin because of poor interfacial adhesion between the hydrophilic wood flour and hydrophobic PVC. Therefore, in this study, we treated wood flour with three aminosilanes to improve wood/PVC interfacial adhesion strength, and eco-friendly wood/PVC/nanoclay composites were prepared by melt blending the aminosilane-treated wood flour, a heavy metal free PVC compound, and a type of nanoclay. The effects of treating wood flour with the aminosilanes and adding the nanoclay on the mechanical properties of the composites were investigated. Mechanical properties of the composites were investigated by universal testing machine (UTM), izod impact tester, dynamic mechanical analyzer (DMA), and thermomechanical analyzer (TMA). The tensile properties of the composites with the aminosilane-treated wood flour were considerably higher than those of the composites with neat wood flour. Furthermore, a small amount of the nanoclay improved mechanical properties of the composites. The performance of the wood/PVC composites was considerably improved by using the aminosilane-treated wood flour and the nanoclay.

• Elastomers and Composites
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• v.46 no.3
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• pp.204-210
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• 2011

In this study, Jute fibers reinforced polypropylene (JFRP) composites were manufactured by injection molding technique. In order to improve the affinity and adhesion between fibers and thermoplastic matrices during manufacturing, Maleic anhydride (MA) as a coupling agent have been employed. Untreated and treated surfaces of jute fibers were characterized using SEM and Fourier transform infrared (FTIR). Physical properties like water absorption rate were studied. Tensile and flexural tests were carried out to evaluate the composite mechanical properties. Tensile test and bending test indicated that JFRP composites show higher strength and modulus than pure PP. In addition, strength and modulus were found to be influenced by the variation of MAPP content (1%, 2%, and 3%). Tensile fracture surfaces were examined using scanning electron microscope. It ensures better interfacial adhesion between fibers and matrix by increasing the percentage of MAPP.

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Journal of Adhesion and Interface
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• v.2 no.3
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• pp.1-8
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• 2001

Epoxy composites filled with natural zeolite was prepared to investigate the effects of silane coupling agent, ${\gamma}$-APS (${\gamma}$-aminopropyltriethoxysilane)on the surface free energy, tensile properties and interfacial morphology. The value of Lifshitz-van der Waals component, ${\gamma}{\frac{LW}{SV}}$ for polar was $19.22mJ/m^2$ and increased, while that of Lewis acid-base component, ${\gamma}{\frac{AB}{SV}}$ for polar was $15.27mJ/m^2$ and decreased with the increasing content of ${\gamma}$-APS treatment. It is due that the surface of the zeolite is more coated by hydrophobic of alkyl group than hydrophilic amine or hydroxyl group. The tensile strength and Young's modulus of epoxy system were improved by the treatment with ${\gamma}$-APS due to the strong interface bonding, which was confirmed by SEM.

• Journal of Adhesion and Interface
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• v.18 no.1
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• pp.1-7
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• 2017

This study is about basic sensor experiment using PDPS by common pencil. 20 mm length, 3 mm thickness of line using 4B pencil is optimum condition. In order to be stable at point of contact between pencil line and copper wire, silver paste is needed. At using the PDPS, thermal detecting is able and thermal properties is inversely proportional to electrical resistance in the based on empirical formula. The sensor can be also used in the composites mold via the empirical formula by the relationship between thermal impact and electrical resistance. The change of electrical resistance relates the interfacial property of composites. It leads to expectation of properties.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Korean Journal of Metals and Materials
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• v.47 no.10
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• pp.675-680
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• 2009

Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.

• Journal of Adhesion and Interface
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• v.23 no.2
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• pp.17-24
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• 2022

Colloidal quantum dots (QDs) have gained attention for applications in quantum dot light emitting diodes (QLEDs) due to their high photoluminescence quantum yield, narrow emission spectra, and tunable bandgap. Nevertheless, non-radiative recombination induced by electron and hole imbalance deteriorates the device efficiency and stability. To overcome the problem, researchers have been trying to enhance hole transport properties of hole transporting layers (HTL) and/or slow down the electron injection in electron transport layer (ETL). Here, we summarize two approaches: i) development of interfacial materials between QD and ETL (or HTL); ii) engineering of HTL by blending or multi-layer approaches.