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Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion of Electroless-plated Ni on Polyimide  

Min, Kyoung-Jin (The Center for Green Materials Technology, School of Material Science and Engineering, Andong National University)
Jeong, Myeong-Hyeok (The Center for Green Materials Technology, School of Material Science and Engineering, Andong National University)
Lee, Kyu-Hwan (Department of Surface Technology, Korea Institute of Materials Science)
Jeong, Yong-Soo (Department of Surface Technology, Korea Institute of Materials Science)
Park, Young-Bae (The Center for Green Materials Technology, School of Material Science and Engineering, Andong National University)
Publication Information
Korean Journal of Metals and Materials / v.47, no.10, 2009 , pp. 675-680 More about this Journal
Abstract
Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.
Keywords
adhesion; temperature/humidity; peel test; alkali surface pretreatment; electroless-plated Ni; polyimide;
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