• Journal of the Korean institute of surface engineering
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• v.33 no.4
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• pp.241-250
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• 2000

Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.88-93
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• 2011

Optimal dispersion and fabrication conditions of carbon nanotube (CNT) embedded in phenolic resin were determined by electrical resistance measurement; and interfacial property was investigated between plasma treated carbon fiber and CNT-phenolic composites by electro-micromechanical techniques. Wettability of carbon fiber was improved significantly after plasma treatment. Surface energies of carbon fiber and CNT-phenolic nanocomposites were measured using Wilhelmy plate technique. Since surface activation of carbon fiber, the advancing contact angle decreased from $65^{\circ}$ to $28^{\circ}$ after plasma treatment. It was consistent with static contact angle results of carbon fiber. Work of adhesion between plasma treated carbon fiber and CNT-phenolic nanocomposites was higher than that without modification. The interfacial shear strength (IFSS) and apparent modulus also increased with plasma treatment of carbon fiber.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.158-162
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• 2001

The effects of chemical treatment on Kevlar-29 fibers have been studied in a composite system. The surface characteristics of the Kevlar-29 fibers were characterized by pH, acid-base value and X-ray photoelectron spectroscopy (XPS). The mechanical interfacial properties of final composites were studied by interlaminar shear strength (ILSS) and critical stress intensity factor ($K_{IC}$). Also, the impact properties of the composites were investigated in the differentiating studies between initiation and propagation energies, and ductile index (DI) along with maximum farce and total energy. It was found that the chemical treatment with phosphoric acid ($H_3PO_4$) solution significantly affected the degree of adhesion at interfaces between fibers and resin matrix, resulting in improving the mechanical interfacial strength of the composites. This was probably due to the presence of chemical polar groups on Kevlar surfaces, leading to an increment of interfacial binding force in a composite system.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.153-157
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• 2001

Interfacial properties and microfailure modes of electrodeposition (ED) treated carbon fiber reinforced polyetherimide (PEI) toughened epoxy composite were investigated using microdroplet test and the measurement of surface wettability. As PEI content increased, Interfacial shear strength (IFSS) increased due to enhanced toughness and plastic deformation of PEI. In the untreated case, IFSS increased with adding PEI content, and IFSS of pure PEI matrix showed the highest. On the other hand, for ED-treated case IFSS increased with PEI content with rather low improvement rate. The work of adhesion between fiber and matrix was not directly proportional to IFSS for both the untreated and ED-treated cases. The matrix toughness might contribute to IFSS more likely than the surface wettability. Interfacial properties of epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.

• Carbon letters
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• v.4 no.2
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• pp.69-73
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• 2003

In this work, the effect of a direct oxyfluorination on surface and mechanical interfacial properties of PAN-based carbon fibers is investigated. The changes of surface functional groups and chemical composition of the oxyfluorinated carbon fibers are determined by FT-IR and XPS measurements, respectively. ILSS of the composites is also studied in terms of oxyfluorination conditions. As a result, FT-IR exhibits that the carboxyl/ester groups (C=O) at 1632 $cm^{-1} and hydroxyl group (O-H) at 3450 $cm^{-1} are observed in the oxyfluorinated carbon fibers. Especially, the oxyfluorinated carbon fibers have a higher O-H peak intensity than that of the fluorinated ones. XPS result also shows that the surface functional groups, including C-O, C=O, HO-C=O, and C-$F_x$ after oxyfluorination are formed on the carbon fiber surfaces, which are more efficient and reactive to undergo an interfacial reaction to matrix materials. Moreover, the formation of C-$F_x$ physical bonding of the carbon fibers with fluorine increases the surface polarity of the fibers, resulting in increasing ILSS of the composites. This is probably due to the improvement of interfacial adhesion between fibers and matrix resins.

• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.26-31
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• 2006

In order to effectively improve interfacial adhesion strength between polypropylene (PP) and jute fiber, we particularly incorporated maleic anhydride grafted PP (MAPP) into the matrix through the environment-friendly process without an additional method of process and had better mechanical performances by providing the alignment into the natural fiber than those of the conventional fabrication technology such as an extrusion or injection molding. We also proposed hot pressing method which applied relatively low shear to the composites and confirmed the chemical bonds among the functional groups of MAPP and jute using FT-IR approach. The concentration of MAPP for maximum tensile strength and modulus was optimized at 3 wt%. Flexural properties had no noticeable tendency to increase with MAPP contents compared to tensile strength, which could probably be explained by the degree in wetting of PP/MAPP matrix.

• Composites Research
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• v.36 no.5
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• pp.377-382
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• 2023

To enhance the performance of graphene-based devices, it is of great importance to better understand the interfacial interaction of graphene with its underlying substrates. In this study, the adhesion energy of monolayer graphene placed on dielectric substrates was characterized using mode I fracture tests. Large-area monolayer graphene was synthesized on copper foil using chemical vapor deposition (CVD) with methane and hydrogen. The synthesized graphene was placed on target dielectric substrates using polymer-assisted wet transfer technique. The monolayer graphene placed on a substrate was mechanically delaminated from the dielectric substrate by mode I fracture tests using double cantilever beam configuration. The obtained force-displacement curves were analyzed to estimate the adhesion energies, showing 1.13 ± 0.12 J/m² for silicon dioxide and 2.90 ± 0.08 J/m² for silicon nitride. This work provides the quantitative measurement of the interfacial interactions of CVD-grown graphene with dielectric substrates.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.8-14
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• 2012

The effects of the alkali surface modification process on the adhesion strength between electroless-plated Cu and polyimide films were investigated. The polyimide surfaces were effectively modified by alkali surface treatments from the hydrophobic to the hydrophilic states, and it was confirmed by the results of the contact angle measurement. The surface roughness increased by alkali surface treatments and the adhesion strength was proportional to the surface roughness. The adhesion strength of Cu/polyimide interface treated by KOH + EDA (Ethylenediamine) was 874 gf/cm which is better than that treated by KOH and KOH + $KMnO_4$. The results of XPS spectra revealed that the alkali treatment formed oxygen functional groups such as carboxyl and amide groups on the polyimide films which is closely related to the interfacial bonding mechanism between electroless-plated Cu and polyimide films. It could be suggested that the species and contents of functional group on polyimide films, surface roughness and contact angle were related with the adhesion strength of Cu/polyimide in combination.

• Macromolecular Research
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• v.14 no.5
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• pp.517-523
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• 2006

The effects of particle content, size and shape on the thermal conductivity (k) and adhesion properties of thermally conductive, pressure-sensitive adhesives (PSAs) were investigated. The matrix resins were thermally crosslinkable, 2-ethylhexyl acrylic polyol and ultraviolet (UV)-curable, random copolymer consisting of acrylic oligomer and various acrylates. We found that k increased with increasing diameter and particle aspect ratio, and was further enhanced due to the reduction of the interfacial thermal barrier when the coupling agent, which increases the adhesion between particles and the matrix resin, was used. On the other hand, adhesion properties such as peel strength and tack of the thermally crosslinkable resin decreased sharply with increasing particle content. However, for UV curable resin, increased particle addition inhibited the decrease in adhesion properties.