• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.3
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• pp.284-291
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• 2011

Numerical experiments on biological interfacial layer, DEJ by finite element software ABAQUS have been conducted to study its fracture behavior including crack bridging / arresting characteristics in the model. Crack growth simulation has been carried out by numerical tool, XFEM, devoted to study cracks and discontinuities. The fracture toughness of DEJ has been estimated before and after crack bridging. The implications of bridging in numerical study of fracture behavior of DEJ-like biological interface have been discussed. It has been observed that the results provided by the numerical studies without proper accommodation of bridging phenomenon can mislead. This study can be helpful for understanding the DEJ-like biological interface in terms of its fracture toughness, an important material characteristics. This property of the material is an important measure that has to be taken care during design and manufacturing processes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.9-12
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• 2000

Insulators for high-voltage and large-power should be endured mechanically the weight of mold bushing itself and the force of pushed from contact with circuit breaker and conductor. But dielectric breakdown could be occurred result from the external circumstances and internal factors such as chemical reaction, partial discharge, change of temperature and the relation of temperature-time in process of casting. Therefore, to get rid of external and internal factors of dielectric breakdown. Furthermore, to prevent the internal cracks, void, cavity which resulted from the contraction originated on the interface between copper and epoxy resin, formed semi-conductive layer with partially carbon painted on copper bar. The PD properties and the insulation qualities of epoxy molded insulators were improved by roles of cushions for the direction of diameter and natural sliding effects as like separated from conductor for the direction of length.

• Korean Journal of Materials Research
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• v.22 no.3
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• pp.123-129
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• 2012

The microstructures and mechanical properties of friction stir welded lap joints of Inconel 600 and SS 400 were evaluated; friction stir welding was carried out at a tool rotation speed of 200 rpm and welding speed of 100 mm/min. Electron back-scattering diffraction and transmission electron microscopy were introduced to analyze the grain boundary characteristics and the precipitates, respectively. Application of friction stir welding was notably effective at reducing the grain size of the stir zone. As a result, the reduced average grain size of Inconel 600 ranged from $20{\mu}m$ in the base material to $8.5{\mu}m$ in the stir zone. The joint interface between Inconel 600 and SS 400 showed a sound weld without voids and cracks, and MC carbides with a size of around 50 nm were partially formed at the Inconel 600 area of lap joint interface. However, the intermetallic compounds that lead to mechanical property degradation of the welds were not formed at the joint interface. Also, a hook, along the Inconel 600 alloy from SS 400, was formed at the advancing side, which directly brought about an increase in the peel strength. In this study, we systematically discussed the evolution of microstructures and mechanical properties of the friction stir lap joint between Inconel 600 and SS 400.

• Journal of the Korean Society of Propulsion Engineers
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• v.12 no.2
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• pp.40-47
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• 2008

It is known that the adhesive interface testing of the rocket motor using the ultrasonic wave is superior to the other testing methods about the ability to economical detect the defects. But, the signal analysis of the ultrasonic wave takes a lot of time and efforts because the time interval of the transmitted pulse and the received pulse is too short to separate the reflected signals due to the multi-layers of the rocket motor. The ultrasonic testing of rocket motor have only applied to the automatic system about extremely limited areas like the debond in adhesive interface between the motor case and the insulator. In this study the new technique to detect the debond between the liner and the propellant using the property of the resonance and the lamb waves instead of the existing ultrasonic testing was described.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.12
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• pp.755-760
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• 1999

Various fluoride films were investigated for a gate insulator of thin film transistor application. Conventional oxide containing materials like $SiO_2\;Ta_2O_5\; and \; Al_2O_3$ exhibited high interface states which lead to an increased threshold voltage and poor stability of TFT. In this paper, we investigated gate insulators using a binary matrix system of fluoride such as $CaF_2,\; SrF_2\; MgF_2,\; and\; BaF_2$. These materials exhibited an improvement in lattice mismatch, interface state and electrical stability. MIM and MIS devices were employed for an electrical characterization and structural property examination. Among the various fluoride materials, $CaF_2$ film showed an excellent lattice mismatch of 5%, breakdown electric field higher than 1.2MV/cm and leakage current density of $10^{-7}A/cm^2$. MIS diode having $Ca_2$ film as an insulation layer exhibited the interface states as low as $1.58\times10^{11}cm^{-2}eV^{-1}$. This paper probes a possibility of new gate insulator materials for TFT applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.859-863
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• 2007

Aluminum oxide films were deposited on n-type 6H-SiC(0001) substrates by RF magnetron sputtering technique for MIS devices applications. Well-behaved C-V characteristics were obtained measured in MIS capacitors structures. The calculated interface trap density measured at $300^{\circ}C$ was about $4.6{\times}10^{10}/cm^2\;eV$ in the upper half of the bandgap. The gate leakage current densities of the MIS structures were about $10^{-8}A/cm^2$ and about $10^{-6}A/cm^2$ measured at room temperature and at $300^{\circ}C$ for a ${\pm}1\;MV/cm$, respectively These results indicate that the interface property of this structure is enough quality to MIS devices applications.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.11a
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• pp.55-59
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• 2007

It is known that the adhesive interface testing of the rocket motor which using the ultrasonic wave iS superior to the other testing methods about the economically detectable abiliη of the defects. But, the signal analysis of the ultrasonic wave takes too much time and effort that the time interval of the transmitted pulse and the received pulse is too short to be separated the reflected signals because the structure of the rocket motor is multi-layers. The ultrasonic testing of rocket motor have been only applied with automatic system about extremely limited area like the debond in adhesive interface between the motor case and insulator. In this study the new technique to detect the debond between the liner and the propellant using the property of the resonance and Lamb waves was described as comparing the existence ultrasonic testing.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.197-203
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• 2004

A full finite element (FE)-based approach is presented for the precision analysis of the strip profile in flat rolling. Basic FE models for the analysis of the mechanical behavior of the strip and of the rolls are described in detail. Also described is an iterative strategy for a rigorous treatment of the mechanical contact occurring at the roll-strip interface and at the roll-roll interface. Then, presented is an integrated FE process model for the coupled analysis of the mechanical behavior of the strip, work roll, and backup roll in four-high mill. A series of process simulation are conducted and the results are compared with the measurements made in hot and cold rolling experiments.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1993.11a
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• pp.3-3
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• 1993

In mechanical testing of W-Ni-Pe heavy alloys, the cracks nucleate at W/W interface and propagate through W/ Imatrix interface or through matrix phase together with the cleavage of W grains. The mechanical properties can therefore be improved by control of the interfacial strength and area. In this presentation, some experimental result and techniques on this subject will be reviewed and discussed. The hydrogen embrittlement caused by the hydrogen segregation at interfaces during sintering in an hydrogen atmosphere can be removed by an heat-treattnent in vacuum or in an inert atmosphere. The heat-treatment condition can be estimated by using a diffusion equation for a cylindrical shape. The mechanical properties, in particular the impact property, are degraded by the segregation of non-metallic impurities, such as Sand P. The degradation can be prevented by adding a fourth element, such as La or Ca, active with the non-metallic impurities. The cyclic heat-treatment at usual heat-treattnent tempemture causes the penetration of matrix between W/W grain boundaries and results in remarkable increase in impact energy. This is due to an increase in the area of ductile failure during the impact test. The instability of W/matrix interface casued by addition of Mo or Re can be controlled by using W powders of different size. The increase in the interfacial area in found to be related to the presence of non-equilibrium pure W gmins among W(Mo or Re) solid solution gmins.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.329-334
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• 2008

Aluminum oxide films were deposited on n-type GaN substrates by RF magnetron sputtering technique for MIS devices applications using optimized conditions, Well-behaved C - V characteristics were obtained measured in MIS capacitors structures. The calculated interface trap density measured at $300^{\circ}C$ was about $9\times10^{10}/cm^2$ eV in the upper bandgap. The gate leakage current densities of the MIS structures were about $10^{-9}A/cm^2$ and about $10^{-4}A/cm^2$ measured at room temperature and at $300^{\circ}C$ for $a{\pm}1MV/cm$, respectively. These results indicate that the interface property of this structure is enough quality to MIS devices applications.