• Title/Summary/Keyword: interface delamination

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Evaluation and monitoring of degradation mechanism of Li-ion battery for portable electronic device (휴대전자기기용 저용량 리튬이온 배터리의 충방전 열화 기구 분석 및 모니터링)

  • Byeon, Jai Won
    • Journal of Applied Reliability
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    • v.13 no.2
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    • pp.129-140
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    • 2013
  • As a fundamental experimental study for reliability improvement of lithium ion secondary battery, degradation mechanism was investigated by microscopic observation and acoustic emission monitoring. Microstructural observation of the decomposed battery after cycle test revealed mechanical and chemical damages such as interface delamination, microcrack of the electrodes, and solid electrolyte interphase (SEI). Acoustic emission (AE) signal was detected during charge and discharge of lithium ion battery to investigate relationships among cumulative count, discharge capacity, and microdamages. With increasing number of cycle, discharge capacity was decreased and AE cumulative count was observed to increase. Observed damages were attributed to sources of the detected AE signals.

A Study on the Influence of Stacking Sequences using CFRP Laminate Plates by Falling Weight Impact (탄소섬유복합평판에 낙추충격을 가할 때 적층구성에 미치는 영향에 관한 연구)

  • 임광희;박노식;양인영
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.106-109
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    • 2000
  • Impact tester was build up to evaluate the characterization of CFRP laminate plates under the low velocity impact. The tests were conducted on several laminates of different ply orientation A system was budded for the impact strength of CFRP laminates in consideration of stress wave propagation theory using drop-weight impact tester as one of impact test. Results indicate that absorbed energy of quasi-isotropic specimen having four interfaces is higher than that of orthotropic laminates with two interfaces. Also the damage area was measured with ultrasonic C-scanner on some samples. In the specimens the relationship was linear between damaged area and absorbed energy to some degree. Absorbed energy in the specimen that ply number, interface number and fiber stacking sequences is same but having hybrid is higher than that of orthotropic laminates without hybrid.

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Prediction of Mechanical Properties of Honeycomb Core Materials and Analysis of Interlaminar Stress of Honeycomb Sandwich Composite Plate (하니컴코어 재료의 기계적 물성 예측과 하니컴 샌드위치 복합재료 평판의 층간응력 해석)

  • 김형구;최낙삼
    • Composites Research
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    • v.17 no.1
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    • pp.29-37
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    • 2004
  • Honeycomb sandwich composite(HSC) structures have been widely used in aircraft and military industry owing to their light weight and high stiffness. Mechanical properties of honeycomb core materials are needed for accurate analysis of the sandwich composites. In this study. theoretical formula for effective elastic modulus and Poisson's ratio of honeycomb core materials was established using an energy method considering the bending, axial and shear deformations of honeycomb core walls. Finite-element analysis results obtained by using commercial FEA code, ABAQUS 6.3 were comparable to the theoretical ones. In addition, we performed tensile test of HSC plates and analyzed deformation behaviors and interlaminar stresses through its FEA simulation. An increased shear stress along the interface between surface and honeycomb core layers was shown to be the main reason for interfacial delamination in HSC plate under tensile loading.

Prevention of thin film failures for 5.0-inch TFT arrays on plastic substrates

  • Seo, Jong-Hyun;Jeon, Hyung-Il;Nikulin, Ivan;Lee, Woo-Jae;Rho, Soo-Guy;Hong, Wang-Su;Kim, Sang-Il;Hong, Munpyo;Chung, Kyuha
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.700-702
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    • 2005
  • A 5.0-inch transmissive type plastic TFT arrays were successfully fabricated on a plastic substrate at the resolution of $400{\times}3{\times}300$ lines (100ppi). All of the TFT processes were carried out below $150^{\circ}C$ on PES plastic films. After thin film deposition using PECVD, thin film failures such as film delamination and cracking often occurred. For successful growth of thin films (about 1um) without their failures, it is necessary to solve the critical problem related to the internal compressive stress (some GPa) leading to delamination at a threshold thickness value of the films. The Griffith's theory explains the failure process by looking at the excess of elastic energy inside the film, which overcomes the cohesive energy between film and substrate. To increase the above mentioned threshold thickness value there are two possibilities: (i) the improvement of the interface adhesion (for example, through surface micro-roughening and/or surface activation), and (ii) the reduction of the internal stress. In this work, reducing a-Si layer film thickness and optimizing a barrier SiNx layer have produced stable CVD films at 150oC, over PES substrates

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The Evaluation of the thermal degradation and the degree of cure of glass/epoxy composite by ultrasonic technique (복합재료의 열화도 및 경화도에 따른 초음파 특성 연구)

  • 강길호;최원종;박상윤
    • Composites Research
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    • v.16 no.6
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    • pp.33-40
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    • 2003
  • The initial thermal degradation of polymer matrix composite is not observed easily. At the beginning of thermal degradation of polymer matrix composites, phase transformation such as chain scission, oxidation occur, and then micro delamination is produced in matrix and interface between matrix and fiber before blistering. Initial heat damage deteriorate mechanical properties of composites. We presented the detection method of the initial heat damage of composites conveniently using ultrasonic technique. Absorption coefficient and material velocity was measured with thermal degradation and degree of cure. The more thermal degradation was progressed, the more absorption coefficient was increased. When the cure temperature is more high, the absorption coefficient of cured composite is increased and material velocity is decreased. We concluded that cure temperature is more high, the defects such as void is increased and molecular structure cured at high temperature has cross-linking structure which is more absorb the ultrasonic waves.

Two-Dimensional Analysis of Cross-ply Laminates with Transverse Cracks Based on the Assumed Crack Opening Deformation (균열열림변형을 고려한 모재균열이 있는 직교적층판의 2차원 해석)

  • 이재화;홍창선;한영명
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.15 no.6
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    • pp.2002-2014
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    • 1991
  • A refined two-dimensional analysis method, taking into account the crack opening deformation, is proposed for the evaluation of stress distributions in transverse cracked cross-ply laminates. The interlaminar stresses which play an important role in laminate failure are evaluated using the concept of interface layer. A series expansion of the displacements is employed and the thermal residual stresses and Poisson's effects in the laminated are taken into consideration in the formulation. The stress distributions are compared with finite element results. The proposed method represents well the characteristics of the stress distributions. The through-the-thickness variation of the stress distribution is remarkable near the transverse crack due to the crack opening deformation. The interlaminar stresses have significant values at the transverse crack tip and the proposed analysis can be applied as a basis for the prediction of the induced delamination onset by using appropriate failure criteria.

Effects of Intermetallic Compounds Formed during Flip Chip Process on the Interfacial Reactions and Bonding Characteristics (플립칩 공정시 반응생성물이 계면반응 및 접합특성에 미치는 영향)

  • Ha, Jun-Seok;Jung, Jae-Pil;Oh, Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.2
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    • pp.35-39
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    • 2012
  • We studied interfacial reaction and bonding characteristics of a flip chip bonding with the viewpoint of formation behavior of intermetallic compounds. For this purpose, Sn-0.7Cu and Sn-3Cu solders were reflowed on the Al/Cu and Al/Ni UBMs. When Sn-0.7Cu was reflowed on the Al/Cu UBM, no intermetallic compounds were formed at the solder/UBM interface. The $Cu_6Sn_5$ intermetallic compounds formed by reflowing Sn-3Cu solder on the Al/Cu UBM were spalled from the interface, resulting in delamination of the solder/UBM interface. On the other hand, the $(Cu,Ni)_6Sn_5$ intermetallic compounds were formed by reflowing of Sn-0.7Cu and Sn-3Cu on the Al/Ni UBM and the interfacial bonding between the Sn-Cu solders and the Al/Ni UBM was kept stable.

The effect of powder characteristics on the behavior of Co-firing of ferrite and varistor (Ferrite/varistor의 동시소성 거동에 대한 분체특성의 영향)

  • Han, Ik-Hyun;Lee, Yong-Hyun;Myoung, Seong-Jae;Chun, Myoung-Pyo;Cho, Jeong-Ho;Kim, Byung-Ik;Choi, Duck-Kyun
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.17 no.2
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    • pp.63-68
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    • 2007
  • A number of process problems should be solved in the multi-layered ceramic devices such as EMI filter. In particular, it is essential to control the sintering shrinkage in co-firing of different materials for obtaining defect-free samples such as crack, camber, and delamination which usually occur near the surface and interface. We studied the effect of the powder properties of ferrite on the co-firing behavior of green ceramic layers composed of ferrite and varistor. Three kind of ferrite powder samples as a function of milling time (24, 48, and 72 hr) were prepared. Varistor and ferrite ceramic green sheet were made by means of doctor blade process using slurry (ceramic powder and binder solution). Here, slurry was prepared by mixing 55 wt% powder with 45wt% binder solution. Varistor and ferrite green sheets were laminated at $80 kg/cm^2$, and co-fired at $900^{\circ}C$ and $1000^{\circ}C$ for 3 hr. We obtained the camber-free and co-fired ferrite/varistor layer structure by controlling the milling time and sintering temperature.

The Study on the Characteristics of Mode I Crack for Cross-ply Carbon/Epoxy Composite Laminates Based on Stress Fields (응력장을 이용한 직교적층 탄소섬유/에폭시 복합재 적층판의 모드 I 균열 특성 연구)

  • Kang, Min-Song;Jeon, Min-Hyeok;Kim, In-Gul;Woo, Kyeong-Sik
    • Composites Research
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    • v.32 no.6
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    • pp.327-334
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    • 2019
  • The delamination is a special mode of failure occurring in composite laminates. Several numerical studies with finite element analysis have been carried out on the delamination behavior of unidirectional composite laminates. On the other hand, the fracture for the multi-directional composite laminates may occur not only along the resin-fiber interface between plies known as interply or interlaminar fracture but also within a ply known as interyarn or intralaminar fracture accompanied by matrix cracking and fiber bridging. In addition, interlaminar and intralaminar cracks appear at irregular proportions and intralaminar cracks proceeded at arbitrary angle. The probabilistic analysis method for the prediction of crack growth behavior within a layer is more advantageous than the deterministic analysis method. In this paper, we analyze the crack path when the mode I load is applied to the cross-ply carbon/epoxy composite laminates and collect and analyze the probability data to be used as the basis of the probabilistic analysis in the future. Two criteria for the theoretical analysis of the crack growth direction were proposed by analyzing the stress field at the crack tip of orthotropic materials. Using the proposed method, the crack growth directions of the cross-ply carbon/epoxy laminates were analyzed qualitatively and quantitatively and compared with experimental results.

Evaluation of Thermal Durability for Thermal Barrier Coatings with Gradient Coating Thickness (경사화 두께를 갖는 열차폐 코팅의 열적 내구성 평가)

  • Lee, Seoung Soo;Kim, Jun Seong;Jung, Yeon-Gil
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.8
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    • pp.248-255
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    • 2020
  • The effects of the coating thickness on the thermal durability and thermal stability of thermal barrier coatings (TBCs) with a gradient coating thickness were investigated using a flame thermal fatigue (FTF) test and thermal shock (TS) test. The bond and topcoats were deposited on the Ni-based super-alloy (GTD-111) using an air plasma spray (APS) method with Ni-Cr based MCrAlY feedstock powder and yttria-stabilized zirconia (YSZ), respectively. After the FTF test at 1100 ℃ for 1429 cycles, the bond coat was oxidized partially and the thermally grown oxide (TGO) layer was observed at the interface between the topcoat and bond coat. On the other hand, the interface microstructure of each part in the TBC specimen showed a good condition without cracking or delamination. As a result of the TS test at 1100 ℃, the TBC with gradient coating thickness was initially delaminated at a thin part of the coating layer after 37 cycles, and the TBC was delaminated by more than 50% after 98 cycles. The TBCs of the thin part showed more oxidation of the bond coat with the delamination of topcoat than the thick part. The thick part of the TBC thickness showed good thermal stability and oxidation resistance of the bond coat due to the increased thermal barrier effect.