• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.9-13
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• 2002

In this work, the surface of inorganic fillers were modified with some functional groups such as stearic acid, aliphatic long chain, vinylsilane and aminosilane to control the interaction between inorganic fillers and polymer matrix. Ethylene-vinyl acetate copolymers (EVA) with various amount of vinyl-acetate and copolyether-ester elastomer were used as polymer matrix. The addition of inorganic fillers increases flame retardancy, but results in steep drop of electrical and mechanical properties, which may be caused by the defects in the interface between organic/inorganic hybrid composites. The hybrid composites are found to show better mechanical properties and higher volume resistivities as inorganic fillers are well dispersed and have good adhesion with polymer matrix. Also, the most effective type of functional group coated on fillers depends on the chemical structure of polymer.

• Nuclear Engineering and Technology
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• v.50 no.5
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• pp.724-730
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• 2018

Chromium and chromium nitride were selected as potential barriers to prevent fuel-clad chemical interaction (FCCI) between the cladding and the fuel material. In this study, ferritic/martensitic HT-9 steel and misch metal were used to simulate the reaction between the cladding and fuel fission product, respectively. Radio frequency magnetron sputtering was used to deposit Cr and CrN films onto the cladding, and the gas flow rates of argon and nitrogen were fixed at certain values for each sample to control the deposition rate and the crystal structure of the films. The samples were heated for 24 h at 933 K through the diffusion couple test, and considerable amount of interdiffusion (max. thickness: $550{\mu}m$) occurred at the interface between HT-9 and misch metal when the argon and nitrogen were used individually. The elemental contents of misch metal were detected at the HT-9 through energy dispersive X-ray spectroscopy due to the interdiffusion. However, the specimens that were sputtered by mixed gases (Ar and $N_2$) exhibited excellent resistance to FCCI. The thickness of these CrN films were only $4{\mu}m$, but these films effectively prevented the FCCI due to their high adhesion strength (frictional force ${\geq}1,200{\mu}m$) and dense columnar microstructures.

• Journal of the Korean institute of surface engineering
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• v.36 no.6
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• pp.491-499
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• 2003

Copper-based leadframe sheets were oxidized in a hot alkaline solution to form brown-oxide layer on the surface and molded with epoxy molding compound (EMC). The brown-oxide-coated leadframe/EMC joints were machined to form sandwiched double-cantilever beam (SDCB) specimens and sandwiched Brazil-nut (SBN) specimens for the purpose of measuring the fracture toughness of leadframe/EMC interfaces. The SDCB and the SBN specimens were designed to measure the fracture toughness of the leadframe/EMC interfaces under nearly mode-I loading and mixed-mode (mode I ＋ mode II) loading conditions, respectively. Fracture surfaces were analyzed by various equipment such as glancing-angle XRD, SEM, AES, EDS and AFM to elucidate failure path. Results showed that failure occurred irregularly in the SDCB specimens, and oxidation time of 2 minutes divided the types of irregular failures into two classes. The failure in the SBN specimens was quite different from that in the SDCB specimens. The failure path in the SBN specimens was not dependent on the phase angle as well as the distance from tips of pre-cracks.

• Computers and Concrete
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• v.27 no.2
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• pp.131-141
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• 2021

This paper aims at investigating the capability of different FRP/concrete interface models to predict the effect of carbon nanotubes on the flexural behavior of RC beams strengthened with CFRP. Three different interfacial bond models are proposed to simulate the adhesion between CFRP composites and concrete, namely: full bond, nonlinear spring element, and cohesive zone model. 3D Nonlinear finite element model is developed then validated using experimental work conducted by the authors in a previous investigation. Cohesive zone model (CZM) has the best agreement with the experimental results in terms of load-deflection response. CZM is the only bond model that accurately predicted the cracks patterns and failure mode of the strengthened RC beams. The FE model is then expanded to predict the effect of bond strength on the flexural capacity of RC beams strengthened with externally bonded CNTs modified CFRP composites using CZM bond model. The results reveal that the flexural capacity of the strengthened beams increases with increasing the bond strength value. However, only 23% and 22% of the CFRP stress and strain capacity; in the case of full bond; can be utilized before failure.

• Progress in Superconductivity and Cryogenics
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• v.12 no.1
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• pp.1-5
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• 2010

Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at $500^{\circ}C$ showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as $0.67\;{\times}\;10^{-13}\;{\Omega}m^2$. Additional protecting copper layer with the thickness of $20\;{\mu}m$ was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ~140 A and proved its ability to replace sputtering method for industrial production of coated conductor.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Journal of the Korea Concrete Institute
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• v.23 no.3
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• pp.339-346
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• 2011

The effects of mineral admixtures on the bonding properties of cement mortar to polyolefin based synthetic fiber were evaluated. The mineral admixtures consisted of 0%, 5%, 10%, and 15% fly ash, blast furnace slag, and metakaolin in cement. Bond interactions between the cement mortar and the polyolefin based synthetic fiber were determined by Dog-bone bond tests. Bond tests of the polyolefin based synthetic fiber showed an increase in pullout load with the strength of the cement mortar. Also, the interface toughness of polyolefin based synthetic fiber in cement mortar increased as the fly ash, blast furnace slag, and metakaolin contents increased. The microstructure of polyolefin based synthetic fiber surface was examined after the pullout test to analyze the frictional resistant force according to the replacement ratio of fly ash, blast furnace slag, and metakaolin during the pullout process of polyolefin based synthetic fiber in cement mortar. The scratched of polyolefin based synthetic fibers increased with the replacement ratio of fly ash, blast furnace slag, and metakaolin. Also, the interface toughness was enhanced by adhesion forces induced by the fly ash, blast furnace slag, and metakaolin.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Journal of the Korean Recycled Construction Resources Institute
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• v.8 no.4
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• pp.498-505
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• 2020

Aggregate occupies about 70-85% of the concrete volume and is an important factor in reducing the drying shrinkage of concrete. However, when constructing high-rise buildings, it acts as a problem due to the high load of natural aggregates. If the load becomes large during the construction of a high-rise building, creep may occur and the ground may be eroded. Material costs increase and there are financial problems. In order to reduce the load on concrete, we are working to reduce the weight of aggregates. However, artificial lightweight aggregates affect the interface between the aggregate and the paste due to its higher absorption rate and lower adhesion strength than natural aggregates, affecting the overall strength of concrete. Therefore, in this study, in order to grasp the interface between natural aggregate and lightweight aggregate by type, we adopted a method of measuring electrical resistance using an EIS measuring device, which is a non-destructive test, and lightweight bone. The change in the state of the interface was tested on the outside of the material through a blast furnace slag coating. As a result of the experiment, it was confirmed that the electric resistance was about 90% lower than that in the air-dried state through the electrolyte immersion, and the electric resistance differs depending on the type of aggregate and the presence or absence of coating. As a result of the experiment, the difference in compressive strength depending on the type of aggregate and the presence or absence of coating was shown, and the difference in impedance value and phase angle for each type of lightweight aggregate was shown.