• Title/Summary/Keyword: interface adhesion

Search Result 887, Processing Time 0.025 seconds

Effects of Plasma Pretreatment of the Cu Seed Layer on Cu Electroplating (Cu seed layer 표면의 플라즈마 전처리가 Cu 전기도금 공정에 미치는 효과에 관한 연구)

  • O, Jun-Hwan;Lee, Seong-Uk;Lee, Jong-Mu
    • Korean Journal of Materials Research
    • /
    • v.11 no.9
    • /
    • pp.802-809
    • /
    • 2001
  • Electroplating is an attractive alternative deposition method for copper with the need for a conformal and conductive seed layer In addition, the Cu seed layer should be highly pure so as not to compromise the effective resistivity of the filled copper interconnect structure. This seed layer requires low electrical resistivity, low levels of impurities, smooth interface, good adhesion to the barrier metal and low thickness concurrent with coherence for ensuring void-free fill. The electrical conductivity of the surface plays an important role in formation of initial Cu nuclei, Cu nucleation is much easier on the substrate with higher electrical conductivities. It is also known that the nucleation processes of Cu are very sensitive to surface condition. In this study, copper seed layers deposited by magnetron sputtering onto a tantalum nitride barrier layer were used for electroplating copper in the forward pulsed mode. Prior to electroplating a copper film, the Cu seed layer was cleaned by plasma H$_2$ and $N_2$. In the plasma treatment exposure tome was varied from 1 to 20 min and plasma power from 20 to 140W. Effects of plasma pretreatment to Cu seed/Tantalum nitride (TaN)/borophosphosilicate glass (BPSG) samples on electroplating of copper (Cu) films were investigated.

  • PDF

Influence of Allylamine Plasma Treatment Time on the Mechanical Properties of VGCF/Epoxy

  • Khuyen, Nguyen Quang;Kim, Jin-Bong;Kim, Byung-Sun;Lee, Soo
    • Advanced Composite Materials
    • /
    • v.18 no.3
    • /
    • pp.221-232
    • /
    • 2009
  • The allylamine plasma treatment is used to modify the surface properties of vapor grown carbon fibers (VGCF). It is to improve the interfacial bonding between the VGCF and epoxy matrix. The allylamine plasma process was performed by batch process in a vacuum chamber, using gas injection followed by plasma discharge for the durations of 20, 40 and 60 min. The interdependence of mechanical properties on the VGCF contents, treatment time and interfacial bonding between VGCF/ep was investigated. The interfacial bonding between VGCF and epoxy matrix was observed by scanning electron microscopy (SEM) micrographs of nanocomposites fracture surfaces. The changes in the mechanical properties of VGCF/ep, such as the tensile modulus and strength were discussed. The mechanical properties of allylamine plasma treated (AAPT) VGCF/ep were compared with those of raw VGCF/ep. The tensile strength and modulus of allyamine plasma treated VGCF40 (40 min treatment)/ep demonstrated a higher value than those of other samples. The mechanical properties were increased with the allyamine plasma treatment due to the improved adhesion at VGCF/ep interface. The modification of the carbon nanofibers surface was observed by transmission electron microscopy (TEM). SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

Interface Chemical and Hydrodynamic Aspects of Deinking Process Using Flotation for Waste paper Recycling(II) (부유선별법을 적용한 탈묵공정의 계면화학적 및 수력학적 원리(II) -수력학적 원리를 중심으로-)

  • Sun-Young Park
    • Resources Recycling
    • /
    • v.5 no.4
    • /
    • pp.11-16
    • /
    • 1996
  • In the flotation system for deinking process, the ink partcles musl collidc with the air bubbles for adhesion The probability of bubble-particle collision is largely dependent on the hydrodynamic conditions The main reason for the very small ink particles not to be able to float easily may be tound in the hydrodynamic effects, which make small ink particlcs move following the slreamlines around the bubbles rather than achually collide with bubbles. Also. the low floatabdily of the large and heavy ink particles is due to the gravity force and viscous drag which affect uprising molinn of particles through the liquid. Therefore, it is vely important to control not only the surface chemical conditions but the hydrodynamic conditions in practical floialion system

  • PDF

Effect of Atmospheric Plasma Treatments on Mechanical Properties of VGCF/Epoxy

  • Khuyen, Nguyen Quang;Kim, Jin-Bong;Kim, Byung-Sun;Lee, Soo
    • Advanced Composite Materials
    • /
    • v.17 no.2
    • /
    • pp.167-175
    • /
    • 2008
  • Vapor grown carbon fibers (VGCF) were treated with atmospheric plasma enhancing the surface area in order to improve the bonding to the matrix in epoxy composites. The changes in the mechanical properties of VGCF/epoxy nanocompostes, such as tensile modulus and tensile strength were investigated in this study. VGCF with and without atmospheric plasma treatment for surface modification were used in this investigation. The interdependence of these properties on the VGCF contents and interfacial bonding between VGCF/epoxy matrix were discussed. The mechanical properties of atmospheric plasma treated (APT) VGCF/epoxy were compared with raw VGCF/epoxy. The tensile strength of APT VGCF/epoxy nanocomposites showed higher value than that of raw VGCF. The tensile strength was increased with atmospheric plasma treatment, due to better adhesion at VGCF/epoxy interface. The tensile modulus of raw VGCF and APT VGCF/epoxy matrix were of the similar value. The dispersion of the VGCF was investigated by scanning electron microscopy (SEM), SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.

Thermal Stability of the Interface between TaN Deposited by MOCVD and Electroless-plated Cu Film (MOCVD 방법으로 증착된 TaN와 무전해도금된 Cu박막 계면의 열적 안정성 연구)

  • 이은주;황응림;오재응;김정식
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.12
    • /
    • pp.1091-1098
    • /
    • 1998
  • Thermal stability of the electroless deposited Cu thin film was investigated. Cu/TaN/Si multilayer was fabricated by electroless-depositing Cu thin layer on TaN diffusion barrier layer which was deposited by MOCVD on the Si substrate, and was annealed in $H_2$ ambient to investigate the microstructure of Cu film with a post heat-treatment. Cu thin film with good adhesion was successfully deposited on the surface of the TaN film by electroless deposition with a proper activation treatment and solution control. Microstructural property of the electroless-deposited Cu layer was improved by a post-annealing in the reduced atmosphere of $H_2$ gas up to $600^{\circ}C$. Thermal stability of Cu/TaN/Si system was maintained up to $600^{\circ}C$ annealing temperature, but the intermediate compounds of Cu-Si were formed above $650^{\circ}C$ because Cu element passed through the TaN layer. On the other hand, thermal stability of the Cu/TaN/Si system in Ar ambient was maintained below $550^{\circ}C$ annealing temperature due to the minimal impurity of $O_2$ in Ar gas.

  • PDF

Electrical Properties of Organic/Inorganic Hybrid Composites for Insulation Materials

  • Kim, Sang-Cheol;Ok, Jeong-Bin;Aho, Myeong-Jin;Park, Do-Hyun;Lee, Gun-Joo
    • Transactions on Electrical and Electronic Materials
    • /
    • v.3 no.1
    • /
    • pp.9-13
    • /
    • 2002
  • In this work, the surface of inorganic fillers were modified with some functional groups such as stearic acid, aliphatic long chain, vinylsilane and aminosilane to control the interaction between inorganic fillers and polymer matrix. Ethylene-vinyl acetate copolymers (EVA) with various amount of vinyl-acetate and copolyether-ester elastomer were used as polymer matrix. The addition of inorganic fillers increases flame retardancy, but results in steep drop of electrical and mechanical properties, which may be caused by the defects in the interface between organic/inorganic hybrid composites. The hybrid composites are found to show better mechanical properties and higher volume resistivities as inorganic fillers are well dispersed and have good adhesion with polymer matrix. Also, the most effective type of functional group coated on fillers depends on the chemical structure of polymer.

Effect of CrN barrier on fuel-clad chemical interaction

  • Kim, Dongkyu;Lee, Kangsoo;Yoon, Young Soo
    • Nuclear Engineering and Technology
    • /
    • v.50 no.5
    • /
    • pp.724-730
    • /
    • 2018
  • Chromium and chromium nitride were selected as potential barriers to prevent fuel-clad chemical interaction (FCCI) between the cladding and the fuel material. In this study, ferritic/martensitic HT-9 steel and misch metal were used to simulate the reaction between the cladding and fuel fission product, respectively. Radio frequency magnetron sputtering was used to deposit Cr and CrN films onto the cladding, and the gas flow rates of argon and nitrogen were fixed at certain values for each sample to control the deposition rate and the crystal structure of the films. The samples were heated for 24 h at 933 K through the diffusion couple test, and considerable amount of interdiffusion (max. thickness: $550{\mu}m$) occurred at the interface between HT-9 and misch metal when the argon and nitrogen were used individually. The elemental contents of misch metal were detected at the HT-9 through energy dispersive X-ray spectroscopy due to the interdiffusion. However, the specimens that were sputtered by mixed gases (Ar and $N_2$) exhibited excellent resistance to FCCI. The thickness of these CrN films were only $4{\mu}m$, but these films effectively prevented the FCCI due to their high adhesion strength (frictional force ${\geq}1,200{\mu}m$) and dense columnar microstructures.

Failure Path of the Brown-oxide-coated Copper-based Leadframe/EMC Interface under Mixed-Mode Loading (혼합하중 조건하에서 갈색산화물이 입혀진 구리계 리드프레임/EMC 계면의 파손경로)

  • 이호영
    • Journal of the Korean institute of surface engineering
    • /
    • v.36 no.6
    • /
    • pp.491-499
    • /
    • 2003
  • Copper-based leadframe sheets were oxidized in a hot alkaline solution to form brown-oxide layer on the surface and molded with epoxy molding compound (EMC). The brown-oxide-coated leadframe/EMC joints were machined to form sandwiched double-cantilever beam (SDCB) specimens and sandwiched Brazil-nut (SBN) specimens for the purpose of measuring the fracture toughness of leadframe/EMC interfaces. The SDCB and the SBN specimens were designed to measure the fracture toughness of the leadframe/EMC interfaces under nearly mode-I loading and mixed-mode (mode I + mode II) loading conditions, respectively. Fracture surfaces were analyzed by various equipment such as glancing-angle XRD, SEM, AES, EDS and AFM to elucidate failure path. Results showed that failure occurred irregularly in the SDCB specimens, and oxidation time of 2 minutes divided the types of irregular failures into two classes. The failure in the SBN specimens was quite different from that in the SDCB specimens. The failure path in the SBN specimens was not dependent on the phase angle as well as the distance from tips of pre-cracks.

Finite element parametric study of RC beams strengthened with carbon nanotubes modified composites

  • Irshidat, Mohammad R.;Alhusban, Rami S.
    • Computers and Concrete
    • /
    • v.27 no.2
    • /
    • pp.131-141
    • /
    • 2021
  • This paper aims at investigating the capability of different FRP/concrete interface models to predict the effect of carbon nanotubes on the flexural behavior of RC beams strengthened with CFRP. Three different interfacial bond models are proposed to simulate the adhesion between CFRP composites and concrete, namely: full bond, nonlinear spring element, and cohesive zone model. 3D Nonlinear finite element model is developed then validated using experimental work conducted by the authors in a previous investigation. Cohesive zone model (CZM) has the best agreement with the experimental results in terms of load-deflection response. CZM is the only bond model that accurately predicted the cracks patterns and failure mode of the strengthened RC beams. The FE model is then expanded to predict the effect of bond strength on the flexural capacity of RC beams strengthened with externally bonded CNTs modified CFRP composites using CZM bond model. The results reveal that the flexural capacity of the strengthened beams increases with increasing the bond strength value. However, only 23% and 22% of the CFRP stress and strain capacity; in the case of full bond; can be utilized before failure.

Preparation of silver stabilizer layer on coated conductor by continuous dip coating method using organic silver complexes (유기 은 착체 화합물을 코팅용액으로 사용하여 연속적인 담금코팅방법에 의한 은 안정화층 제조)

  • Lee, Jong-Beom;Kim, Ji-Cheol;Park, Sin-Keun;Kim, Byeong-Joo;Kim, Jae-Geun;Lee, Hee-Gyoun;Hong, Gye-Won
    • Progress in Superconductivity and Cryogenics
    • /
    • v.12 no.1
    • /
    • pp.1-5
    • /
    • 2010
  • Silver stabilizing layer of coated conductor has been prepared by dip coating method using organic silver complexes containing 10 wt% silver as a starting material. Coated silver complex layer was dried in situ with hot air and converted to crystalline silver by post heat treatment in flowing oxygen atmosphere. A dense continuous silver layer with good surface coverage and proper thickness of 230 nm is obtained by multiple dip coatings and heat treatments. The film heat treated at $500^{\circ}C$ showed good mechanical adhesion and crystallographic property. The interface resistivity between superconducting YBCO layer and silver layer prepared by dip coating was measured as $0.67\;{\times}\;10^{-13}\;{\Omega}m^2$. Additional protecting copper layer with the thickness of $20\;{\mu}m$ was successfully deposited by electroplating. The critical current measured with the specimen prepared by dip coating and sputtering on same quality YBCO layer showed similar value of ~140 A and proved its ability to replace sputtering method for industrial production of coated conductor.