• Title/Summary/Keyword: interconnect testing

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Implementation of High Speed Serial interface for testing LCD module by using the MDDI (MDDI방식 LCD모듈의 테스트하기 위한 고속직렬통신 인터페이스 구현)

  • Kim, Sang-Mok;Kang, Chang-Hun;Park, Jong-Sik
    • Proceedings of the KIEE Conference
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    • 2005.05a
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    • pp.212-214
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    • 2005
  • The MDDI(Mobile Digital Display Interface) standard is an optimized high-speed serial interconnection technology developed by Qualcomm and supports the VESA(Video Electronics Standard Association). It increases reliability and reduces power consumption in clamshell phones by decreasing the number of wires to interconnect with the LCD display. In this paper, the MDDI host is designed using VHDL and implemented on FPGA. We demonstrates that the MDDI host is connected with S3CA460 LCD controller is designed by Samsung Electronics Co. and display a steal image to the LCD.

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The Design of Integrated Flying Vehicle Model for Engagement Analyses of Missiles

  • Ha, Sue Hyung
    • Journal of Korea Multimedia Society
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    • v.22 no.8
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    • pp.930-939
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    • 2019
  • High-Level Architecture(HLA)/Run-Time Infrastructure(RTI) are standards for distributed simulation systems and offer a technology to interconnect them and form one single simulation system. In defense domain, M&S is the only way to prove effectiveness of weapon systems except for Live Fire Testing (LFT). This paper focuses on guided missile simulations in weapon systems for engagement analyses and proposes the integrated flying vehicle model that is based on HLA/RTI. There are a lot of missiles in real world; therefore, we should develop each missile models in M&S in order to apply battlefield scenarios. To deal with the difficulties, in this paper, firstly, I classify these missiles into three models: ballastic, cruise, and surface-to-air missile models, and then I design each missile model and integrates them into a single model. This paper also offers a case study with my integrated flying vehicle model. At the conclusion, this paper presents contributions of this paper.

The Dynamics of Noise and Vibration Engineering Vibrant as ever, for years to come

  • Leuridan, Jan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2010.05a
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    • pp.47-47
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    • 2010
  • Over the past 20 years, constant progress in noise and vibration (NVH) engineering has enabled to constantly advance quality and comfort of operation and use of really any products - from automobiles to aircraft, to all kinds of industrial vehicles and machines - to the extend that for many products, supreme NVH performance has becomes part of its brand image in the market. At the same time, the product innovation agenda in the automotive, aircraft and really many other industries, has been extended very much in recent years by meeting ever more strict environmental regulations. Like in the automotive industry, the drive towards meeting emission and CO2 targets leads to very much accelerated adoption of new powertrain concepts (downsizing of ICE, hybrid-electrical...), and to new vehicle architectures and the application of new materials to reduce weight, which bring new challenges for not only maintaining but further improving NVH performance. This drives for innovation in NVH engineering, so as to succeed in meeting a product brand performance for NVH, while as the same time satisfying eco-constraints. Product innovation has also become increasingly dependent on the adoption of electronics and software, which drives for new solutions for NVH engineering that can be applied for NVH performance optimization of mechatronic products. Finally, relentless pressure to shorten time to market while maintaining overall product quality and reliability, mandates that the practice and solutions for NVH engineering can be optimally applied in all phases of product development. The presentation will first review the afore trends for product and process innovation, and discuss the challenges they represent for NVH engineering. Next, the presentation discusses new solutions for NVH engineering of products, so as to meet target brand values, while at the same time meeting ever more strict eco constraints, and this within a context of increasing adoption of electronics and controls to drive product innovation. NVH being very much defined by system level performance, these solutions implement the approach of "Model Based System Engineering" to increase the impact of system level analysis for NVH in all phases of product development: - At the Concept Phase, to be able to do business case analysis of new product concepts; to arrive at an optimized and robust product architecture (e.g. to hybrid powertrain lay-out, to optimize fuel economy); to enable target cascading, to subsystem and component level. - In Development Phase, to increase realism and productivity of simulation, so as to frontload virtual validation of components and subsystems and to further reduce reliance on physical testing. - During the final System Testing Phase, to enable subsystem testing by a combination of physical testing and simulation: using simulation models to simulate the final integration context when testing a subsystem, enabling to frontload subsystem testing before final system integration is possible. - To interconnect Mechanical, Electronical and Controls engineering, in all phases of development, by supporting model driven controls engineering (MIL, SIL, HIL). Finally, the presentation reviews examples of how LMS is implementing such new applications for NVH engineering with lead customers in Europe, Asia and US, with demonstrated benefits both in terms of shortening development cycles, and/or enabling a simulation based approach to reduce reliance on physical testing.

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A Comparative Study of the Fatigue Behavior of SnAgCu and SnPb Solder Joints (무연솔더(SnAgCu)와 유연솔더(SnPb)의 피로 수명 비교 연구)

  • Kim, Il-Ho;Park, Tae-Sang;Lee, Soon-Bok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.12
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    • pp.1856-1863
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    • 2004
  • In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

IEEE 1500 Wrapper Design Technique for Pre/Post Bond Testing of TSV based 3D IC (TSV 기반 3D IC Pre/Post Bond 테스트를 위한 IEEE 1500 래퍼 설계기술)

  • Oh, Jungsub;Jung, Jihun;Park, Sungju
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.1
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    • pp.131-136
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    • 2013
  • TSV based 3D ICs have been widely developed with new problems at die and IC levels. It is imperative to test at post-bond as well as pre-bond to achieve high reliability and yield. This paper introduces a new testable design technique which not only test microscopic defects at TSV input/output contact at a die but also test interconnect defects at a stacked IC. IEEE 1500 wrapper cells are augmented and through at-speed tests for pre-bond die and post-bond IC, known-good-die and defect free 3D IC can be massively manufactured+.

Mechanical Reliability Issues of Copper Via Hole in MEMS Packaging (MEMS 패키징에서 구리 Via 홀의 기계적 신뢰성에 관한 연구)

  • Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.29-36
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    • 2008
  • In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

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Traceability Number-Driven Livestock Inventory Management IoT System Utilizing Electronic Scale Access Control Technology (전자저울 접근제어 기술을 통한 이력번호 기반의 재고관리 IoT 시스템)

  • Youchan Jeon
    • Smart Media Journal
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    • v.12 no.10
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    • pp.85-92
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    • 2023
  • In December 2014, Livestock and Livestock Products Traceability Act was established, allowing consumers to receive livestock traceability information. While the Livestock Traceability System provides consumers with transparent and fair information about their food, it has brought increased workload and penalty burdens to stakeholders in the livestock industry. In this paper, we propose an IoT system for inventory management based on traceability numbers to enable sellers to conveniently provide livestock traceability information to consumers. We analyzed the protocol for managing data from electronic scales and conducted functional testing and verification on mobile devices. Furthermore, we implemented the design and system functionality, taking into account UI/UX on Android OS-based devices to synchronize and interconnect traceability and product information with electronic scales. We anticipate that the proposed approach will minimize user inconvenience and raise production efficiency in the existing market.