• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.874-877
• /
• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.3
• /
• pp.283-288
• /
• 2004

We have fabricated MIM capacitors for MMIC applications, with capacitances as high as 600pF/$\textrm{mm}^2$ and excellent electrical properties of the insulator layer. Silicon nitride thin film is the desirable material for MMIC capacitor fabrication. Standard MIM capacitance in MMIC is 300pF/$\textrm{mm}^2$ with an insulator layer thickness of more than 2000$\AA$. However, capacitors with thin insulator layers have breakdown voltages as low as 20V. We have deposited insulator layers by PECVD in our MIM structure with an air bridge between the top metal and the contact pad. The PECVD process was optimized for fabricating the desired capacitors to be used in MMIC. Silicon nitride(Si$_{x}$N$_{y}$) thin films of about 1000$\AA$ thick show capacitances of about 600pF/$\textrm{mm}^2$, and breakdown voltages above 70V at 100nA.A.A.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.160-161
• /
• 2006

To Improve the mean-life and the reliability of power cable, we have investigated thermal conductivity of XLPE insulator and semiconducting materials in l54[kV] underground power transmission cable. Specimens were made of sheet form with the nine of specimens for measurement. Thermal conductivity were measured by Nano Flash Diffusivity thermal conductivity measurement temperature ranges of XLPE insulator were from 20[$^{\circ}C$] to 90[$^{\circ}C$], and the heating rate was 1[$^{\circ}C$/mm]. In case of semiconducting materials. the measurement temperature ranges of thermal conductivity were from 20[$^{\circ}C$] to 60[$^{\circ}C$], and the heating rate was 1[$^{\circ}C$/min].

• Proceedings of the KIEE Conference
• /
• 2001.07c
• /
• pp.1667-1669
• /
• 2001

The clack of Insulator, which results from internal or external surges such as electrical, mechanical, and thermal stress, might cause ground fault and a power failure without proper repairs. In order to minimize losses caused by a short-term or long-term power failure, it is necessary to detect the deteriorated insulator as early as possible. To do so, we will develop a new device, which can detect and trace an deteriorated insulator by monitoring its physical change the variation of frequency spectrum. This device will do so by finding a Periodic wave sharp (120 Hz), a peculiar wave generated by defused electricity.

• 제어로봇시스템학회:학술대회논문집
• /
• 1999.10a
• /
• pp.157-160
• /
• 1999

A prediction method of conditional event matching pre-diction (EMP) for a purpose of predicting nonlinear phenomena of insulator pollution was proposed in this paper. The EMP was used if the conditional probability for increase of insulator pollution exceeded a threshold value. A performance of the EMP was strongly related to selection of database of events and a closeness function. By use of the prediction of the insulator pollution based on the conditional EMP, reliable decision making for the washing timing of the polluted insulators was e-valuated based on actual data in Kasatsu substation, Japan.

• Proceedings of the KIEE Conference
• /
• 1996.07c
• /
• pp.1920-1922
• /
• 1996

After determining the type and string condition of conductor of 765kV transmission lines, we studied the mechanical strength system of insulator strings to support conductors and insulate conductors from towers. In this paper, for the insulator strings which will be used in 765kV transmission lines, we're going to optimally determine the mechanical strength system and supporting method in the consideration of the reliability, economics and the survey data of T/L routes, and also suggest the calculation method to stipulate for the application limits of suspension and strain insulator strings according to the loadspan and height difference of tower.

• Proceedings of the KIEE Conference
• /
• 1997.11a
• /
• pp.245-249
• /
• 1997

A feasibility study on the characterization of incipient insulator failure for distribution fault prediction is presented. In this study, real distribution data was collected and analyzed to isolate incipient failure signatures or parameters which were expected to show distinct behaviors before and after failure incident. Several signal analysis methods were applied to isolate the parameters and a new strategy of analysis, the event-date concept, was also applied to find a relationship between non-harmonic and high frequency signal activities and imminent insulator failures.

• 한국컴퓨터산업교육학회:학술대회논문집
• /
• 2003.11a
• /
• pp.79-82
• /
• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2$ and $Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability.

• Proceedings of the KSME Conference
• /
• 2000.04b
• /
• pp.367-372
• /
• 2000

By the means of microcellular (earning, we can make polymers with $10{\mu}m$ sized gas bubbles. After the $CO_2$ gas bubbles solve, diffuse and leave the polymer matrix, the thermal properties of polymer matrix are changed. Expecially, thermal conductivity becomes low. So, the polymer matrixes with gas bubbles can be used as insulator In this paper, we make model after microcellular foamed polymer matrix to know the change of thermal properties. Most of all, the purpose of this paper is the mlcrocellular foamed polymer matrix's availability as a insulator Beside of thermal properties the surface of microcellular foamed polymer is polished and easy to be colored. Above all the mechanical properties are better than the other insulator. So, microcellular foamed polymer can be used as exterior of building or it can be replaced as a tile.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.575-578
• /
• 2002

In this work, the electrical characteristics of organic thin film transistors with the surface-treated organic gate insulator have been studied. For the surface treatment, the photoalignment technique was used. The field effect mobilities of the devices with PVP gate insulator was improved about ten times as high as those of TFTs without the insulator surface treatment.