• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.467-470
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• 2007

Ultrafine Indium tin oxide (ITO) nanoparticle was successfully fabricated by low temperature synthetic method (LTSM). Mean size of ITO nanoparticle is 5 nm, and uniformly dispersed with (222) orientated cubic structure. Using the nanoparticle, ITO thin film with good optical and electrical properties was fabricated by inkjet printing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.81-81
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• 2009

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

• Journal of Sensor Science and Technology
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• v.27 no.6
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• pp.421-426
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• 2018

To develop a piezoelectric inkjet printhead for high-resolution and high-speed printing, we studied the characteristics of an inkjet printhead by analyzing the major design parameters. An analytical model for the inkjet printhead was established, and numerical analysis of the coupled first-order differential equation for the defined state variables was performed using state equations. To design the dimension of the inkjet printhead with a driving frequency of 100 kHz, the characteristics of the flow rate and discharge pressure of the nozzle were analyzed with respect to design variables of the flow chamber, effective sound wave velocity, driving voltage, and voltage waveform. It was predicted that the change in the height of the flow chamber does not significantly affect the Helmholtz resonance frequency and discharge speed of the nozzle. From the analysis of change in flow chamber width, it is observed that as the width of the flow chamber increases, the ejection speed greatly increases and the Helmholtz resonance frequency decreases considerably, thereby substantially affecting the performance of the inkjet printhead.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.179-181
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• 2008

Major display equipment suppliers introduced equipment using inkjets for manufacturing steps such as printing polyimide alignment layers and color filters. This paper discusses how inkjets can be used in the development of flexible displays and materials printing systems designed to meet the challenges of fluids and process development.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.192-192
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• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.97-103
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• 2007

A novel selective metallization process to fabricate the fine conductive line based on inkjet printing has been investigated. Recently, Inkjet printing has been widely used in flat panel display, electronic circuits, biochips and bioMEMS because direct inkjet printing is an alternative and cost-effective technology for patterning and fabricating objects directly from design without masks. The photosensitive etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity at ambient temperature. A piezoelectric-driven inkjet printhead is used to dispense 20-30 ${\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. Repeatability of circuitry fabrication is closely related to the formation of steady droplets, adhesion between etching resist and copper substrate. Therefore, the ability to form small and stable droplets and surface topography of the copper surface and chemical attack must be taken into consideration for fine and precise patterns. In this study, factors affecting the pattern formation such as adhesion strength, etching mechanism, UV curing have been investigated. As a result, microscale copper patterns with tens of urn high have been fabricated.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.4.1-4.1
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• 2011

Recently, circuit printing technology has been considered as a promising alternative to conventional PCB fabrication, for it can greatly reduce the manufacturing costs. Even though printed circuit has many advantages over typical subtractive technology such as fewer processes, it has some disadvantages. The major problems are low adhesion and poor resolution. Efforts to overcome these problems have been mainly focused on ink developments with a limited success. And surface treatments showed some improvements. Therefore, various plasma treatments and primer coatings on plastic substrates have been tested. Plasma treatments using hydrocarbon gases including methane and propane improved the pattern quality of the inkjet printed circuit, which are further improved upon heating of substrate. On the other hand, there is little effect on the adhesion, which is improved only by a special primer coating. The adhesion of inkjet printed circuit has been increased more than 10 times upon treatment. As for the screen printed circuits, the overall effects are less significant since there is some organic binder in the ink. Nonetheless, the treatment has strong positive effects on pattern quality and adhesion. The adhesion of 1 kgf/cm2, which is comparable with those of the conventional PCB circuits, is possible through primer coating for both screen and inkjet printed circuits. The resulting circuit also showed good thermal, mechanical and electrical properties.

• Current Photovoltaic Research
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• v.2 no.4
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• pp.173-176
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• 2014

We have investigated the seed layer formation of front side contact using the inkjet printing process. Conductive silver ink was printed on textured Si wafers with 80 nm thick $SiN_x$ anti reflection coating (ARC) layers and thickened by light induced plating (LIP). The inkjet printable sliver inks were specifically formulated for inkjet printing on these substrates. Also, a novel method to prepare nano-sized glass frits by the sol-gel process with particle sizes around 5 nm is presented. Furthermore, dispersion stability of the formulated ink was measured using a Turbiscan. By implementing these glass frits, it was found that a continuous and uniform seed layer with a line width of $40{\mu}m$ could be formed by a inkjet printing process. We also investigated the contact resistance between the front contact and emitter using the transfer length model (TLM). On an emitter with the sheet resistance of $60{\Omega}/sq$, a specific contact resistance (${\rho}_c$) below $10m{\Omega}{\cdot}cm^2$ could be achieved at a peak firing temperature around $700^{\circ}C$. In addition, the correlation between the contact resistance and interface microstructures were studied using scanning electron microscopy (SEM). We found that the added glass particles act as a very effective fire through agent, and Ag crystallites are formed along the interface glass layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.2
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• pp.147-151
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• 2011

We were analyzed the piezoelectric characteristic for electronics printing to inkjet printing system. These applications were possible use to Actuator, MEMS, FPCB, RFID, Solar cell and LCD color filter etc. Piezoelectric print head is firing from ink droplet control consideration ink viscosity properties. At this time, micro pattern for PCB metal printing was possible by droplet control of piezoelectric driving. These driving characteristics are variable voltage pulse waveform. We are used the piezoelectric analysis software of Finite Element Method (FEM), Piezoelectric design parameters are acquired from piezoelectric analysis, and measurement of piezoelectric. It designed for piezoelectric head to possible electric print pattern of inkjet printing system. For this validity we were established through in comparison with simulation and measurement. Designed piezoelectric specification obtained voltage 98V, firing frequency 10 kHz, resolution 360dpi, drop volume 20pl, nozzle number 256, and nozzle pitch 0.33 mm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.272-272
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• 2010

We have fabricated alumina thick films by inkjet printing technology. Two different types of ink system were formulated in order to understand their evaporation behaviors and their evaporation effects on the powder distribution on, the surface during inkjet-printed alumina thick films. Single solvent system was formulated with N,N-dimethylformamide(DMF), which led to coffee ring effects which non-uniformly distributed alumina particles on the substrate during the ink evaporation. However, Co-solvent system which consists of both Water and DMF produced relatively uniform distribution of the particles on the substrate. We believe that these two different distributions of alumina particles are attributed to the ink fluid flow directions in the ink droplets ejected from the different ceramic ink system. We have modulated inkjet parameters such as dot-to-dot distance, line-to-line distance, jetting velocity and jetting drop size in order to find out the optimum condition for the printing of alumina thick films from two different ink systems. The surface roughness, microstructures and dielectric properties of these inkjet-printed alumina thick films were investigated.