• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2418-2420
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• 2005

In this paper, parameters of electron temperature and density for the mercury-free lighting-source were measured to diagnosis and analyze in Xe based inductively coupled plasma(ICP). In results at several dependences of $20{\sim}100mTorr$ Xenon pressure, $50{\sim}200W$ RF power and horizontal distribution were especially mentioned. When Xe pressure was 20mTorr and RF power was 200W, the electron temperature and density were respectively 3.58eV and $3.56{\times}10^{12}cm^{-3}$. The key parameters of Xe based ICP depended on Xe pressure more than RF power that could be verified. A high electron temperature and low electron density with a suitable Xe pressure are indispensible parameters for Xe based ICP lighting-source.

• Journal of The Korea Institute of Healthcare Architecture
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• v.9 no.2
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• pp.43-50
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• 2003

This paper try to provide basic and universal concept of the architectural planning for the barrier-free environment. To accomplish this purpose this study has analyzed inductively the architectural requirements for all kinds of people with disabilities. The Analysis showed a safety, an accessibility and a distinguishment as the concept of architectural planning for the people with disabilities. Based on the findings of the study have been researched the general cases done for the barrier-free architectural environment. As the result, it has been proved that the design concept for the disabled person should be regarded as the basic concept of the general architectural planning.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.279-281
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• 1997

The properties of Platinum dry etching were investigated in MICP(Magnetized Inductively Coupled Plasma). The problem with Platinum etching is the redeposition of sputtered Platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned Platinum structure produce feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape.[1] Generally, $Cl_2$ plasma is used for the fence-free etching.[1][2][3] The main object of this study was to investigate a new process technology for the fence-free Pt etching. Platinum was etched with Ar plasma at the cryogenic temperature and with Ar/$SF_6$ plasma at room temperature. In cryogenic etching, the height of fence was reduced to 20% at $-190^{\circ}C$ compared with that of room temp., but the etch profile was not fence-free. In Ar/$SF_6$ Plasma, chemical reaction took part in etching process. The trend of properties of Ar/$SF_6$ Plasma etching is similar to that of $Cl_2$ Plasma etching. Fence-free etching was possible, but PR selectivity was very low. A new gas chemistry for fence-free Platinum etching was proposed in this study.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.6
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• pp.451-455
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• 1999

The highest etch rate of Pt film was obtained at 10% $Cl_2$/90% Ar gas mixing ratio in our previous investigation. However, the problems such as the etch residues(fence) remained on the pattern sidewall, low selectivity to oxide as mask and low etch slope were presented. In this paper, the etching by additive $O_2$ gas to 10% $Cl_2$/90% Ar gas base was examined. As a result, the fence-free pattern and higher etch slope as about 60$^{\circ}$was observed and the selectivity to oxide increased to 2.4 without decreasing of the etch rate $1500{\AA}$/min. XPS surface analysis proved that a only little $O_2$ gas removes the Pt-CI compounds as residues on the etched surface.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.387-394
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• 2013

As the feature size of integrated circuits continues to decrease, the challenge of achieving an oxidation-free exposed layer after photoresist (PR) stripping is becoming a critical issue for semiconductor device fabrication. In this article, the hydrogen plasma characteristics in direct plasma and the PR stripping rate in remote plasma were studied using a $120{\Phi}$ cylindrical inductively coupled plasma source. E mode, H mode and E-H mode transitions were observed, which were defined by matching the $V_{rms}$ and total impedance. In addition, the dependence of the E-H mode transition on pressure was examined and the corresponding plasma instability regions were identified. The plasma density and electron temperature increased gradually under the same process conditions. In contrast, the PR stripping rate decreased with increasing proportion of $H_2$ gas in mixed $H_2/N_2$ plasma. The decrease in concentration of reactive radicals for the removal of PR with increasing $H_2$ gas flow rate suggests that NH radicals have a dominant effect as the main volatile product.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.3
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• pp.156-160
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• 2006

In whole world consciousness of environment maintenance have increased very quickly for the end of the 20th century. To use and disuse toxic substances have been controled at the field of industry. Also the field of lighting source belong to environmental control. And in the future the control will be strong. In radiational mechanism of fluorescence lamp mercury is the worst environmental problem and root. In the mercury free lighting source system the Xe gas lamp is one type. And the Ne:Xe and Ne:Ar mixed gas lamp improve firing voltage of Xe gas lamp. Purpose of this study is to understand ideal mixing-ratio of Ne:Xe and Ne:Ar gas by electron temperature and electron density for mercury free lamp. Before ICP was designed, basic parameters of plasma, which are electron temperature and electron density, were measured and calculated by single-Langmuir probe. Property of electron temperature and electron density were confirmed by changing ratio of Ne:Xe and Ne:Ar.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.91-95
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• 2006

In whole world consciousness of environment maintenance have increased very quickly for the end of the 20th century. To use and disuse toxic substances have been controled at the field of industry. Also the field of lighting source belong to environmental control. And in the future the control will be strong. In radiational mechanism of fluorescence lamp mechanism is the worst environmental problem. In radiational mechanism of fluorescence lamp mercury is the worst environmental problem root. In the mercury free lighting source system the Xe gas lamp is one type. And the Ne:Xe mixing gas lamp improvements firing voltage of Xe gas lamp. Purpose and subject of this study are understand, efficiency, ideal of Ne:Xe plasma which mercury free lamp. Before ICP was designed, basic parameters of plasma, which are electron temperature and electron density, were measured and calculated by Langmuir probe data. Property of electron temperature and electron density were confirmed by changing ratio of Ne:Xe.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.233-233
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• 2010

Magnetic random access memory (MRAM), based on magnetic tunnel junction (MTJ) and CMOS, is a prominent candidate among prospective semiconductor memories because it can provide nonvolatility, fast access time, unlimited read/write endurance, low operating voltage and high storage density. The etching of MTJ stack with good properties is one of a key process for the realization of high density MRAM. In order to achieve high quality MTJ stack, the use of CoFeB and IrMn magnetic films as free layers was proposed. In this study, inductively coupled plasma reactive ion etching of CoFeB and IrMn thin films masked with Ti hard mask was investigated in a $Cl_2$/Ar gas mix. The etch rate of CoFeB and IrMn films were examined on varying $Cl_2$ gas concentration. As the $Cl_2$ gas increased, the etch rate monotonously decreased. The effective of etch parameters including coil rf power, dc-bais voltage, and gas pressure on the etch profile of CoFeB and IrMn thin film was explored, At high coil rf power, high dc-bais voltage, low gas pressure, the etching of CoFeB and IrMn displayed better etch profiles. Finally, the clean and vertical etch sidewall of CoFeB and IrMn free layers can be achieved by means of thin Ti hard mask in a $Cl_2$/Ar plasma at the optimized condition.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.4
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• pp.1-6
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• 2000

Recently, SrBi$_{2}$Ta$_{2}$ $O_{9}$(SBT) and Pb(Zr,Ti) $O_{3}$(PZT) were much attracted as materials of capacitor for ferroelectric random access memory(FRAM) with higher read/ write speed, lower power consumption and nonvolartility. SBT thin film has appeared as the most prominent fatigue free and low operation voltage. To highly integrate FRAM, SBT thin film has to be etched. A lot of papers have been reported over growth of SBT thin film and its characteristics. However, there are few reports about etching SBT thin film owing to difficult of etching ferroelectric materials. SBT thin film was etched in CF$_{4}$Ar plasma using magnetically enhanced inductively coupled plasma (MEICP) system. In order to investigate the chemical reaction on the etched surface of SBT thin films, X-ray Photoelecton spectrosocpy (XPS) and Secondary ion mass spectroscopy(SIMS) was performed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.125-125
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• 2018

반도체 소자의 미새화에 따라 선폭이 10nm 이하로 줄어듦에 따라, 금속 배선의 저항이 급격하게 상승하고 있다. Cu는 낮은 저항과 높은 전도도를 가지고 있어 현재 배선물질로써 가장 많이 사용되고 있지만, 소자가 미세화됨에 따라 Cu를 미래의 배선물질로써 계속 사용하기에는 몇 가지 문제점이 제기되고 있다. Cu는 electron mean free path (EMFP)가 39 nm로 긴 특성을 가지기 때문에, 선폭이 줄어듦에 따라 surface 및 grain boundary scattering이 증가하여 저항이 급격하게 증가한다. 또한, technology node에 따른 소자의 operating temperature와 current density의 증가로 인해 Cu의 reliability가 감소하게 된다. 텅스텐은 EMFP가 19 nm로 짧은 특성을 가지고 있어, 소자의 크기가 줄어듦에 따라 Cu보다 낮은 저항 특성을 가질 수 있으며, 녹는점이 3695K로 1357K인 Cu보다 높으므로 배선물질로써 Cu를 대체할 가능성이 있다. 본 연구에서는 Inductively Coupled Plasma (ICP) assisted magnetron sputtering을 통해 매우 얇은 텅스텐 박막을 증착하여 저항을 낮추고자 하였다. 고밀도 플라즈마의 방전을 위해, internal-type coil antenna를 사용하였으며 텅스텐 박막의 증착을 위해 DC sputter system이 사용되었다. 높은 에너지를 가진 텅스텐 이온을 이용하여 낮은 온도에서 고품위 박막을 증착할 수 있었으며, dense한 구조의 박막 성장이 가능하였다. ICP assisted를 이용하여 증착했을 때와, 그렇지 않을 때를 비교하여 ICP 조건에 따라서 박막의 저항이 감소함을 확인할 수 있었을 뿐만 아니라 최대 약 65% 감소함을 확인할 수 있었다. XRD를 이용하여 ICP power를 인가했을 때, 높은 저항을 갖는 A-15 구조를 가진 ${\beta}$ peak의 감소와 낮은 저항을 갖는 BCC 구조를 가진 ${\alpha}$ peak의 증가를 상온과 673K에서 증착한 박막 모두에서 확인하였으며, 이를 통해 ICP power가 저항 감소에 영향을 미친다는 것을 확인하였다. 또한, 두 온도 조건에서 grain size를 계산하여 ICP power를 인가함에 따라 두 조건 모두 grain size가 증가하였음을 조사하였다. 또한, XPS 분석을 통해 ICP power를 인가하였을 때 박막의 저항에 많은 영향을 끼치는 O peak이 감소하는 것을 통해 ICP assisted의 효과를 확인하였다. 이를 통해, ICP assisted magnetron sputtering을 통해 텅스텐 박막을 증착함으로써 차세대 배선물질로써 텅스텐의 가능성을 확인할 수 있었다.