Effects of Oxidizer Additive on the Performance of Copper-Chemical Mechanical Polishing using Tungsten Slurry (텅스텐 슬러리를 사용한 Cu-CMP 특성에서 산화제 첨가의 영향)
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- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.17 no.2
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- pp.156-161
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- 2004