• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.4
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• pp.167-172
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• 2023

A low-noise phase-locked loop(PLL) with three negative feedback loops has been proposed. It is not easy to improve noise characteristics with a conventional PLL. The added negative feedback loops reduce the input voltage magnitude of voltage controlled oscillator which determines the jitter characteristics, enabling the improvement of noise characteristics. Simulation results show that the jitter characteristics are improved as a negative feedback loop is added. In the case of power consumption, it slightly rises by about 10%, but jitter characteristics are improved by about two times. The proposed PLL was simulated with Hspice using a 1.8V 180nm CMOS process.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.9
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• pp.54-65
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• 1999

As the integration ratio and operating speed increase, it has become an important problem to estimate the dissipated power during the design procedure to reduce th TTM(time to market). This paper proposed a prediction model for the maximum dissipated power of a CMOS logic gate. This model uses a calculating method. It was constructed by including the characteristics of MOSFETs, the operational characteristics of the gate, and the characteristics of the input signals. As the construction procedure, a maximum power estimation model for CMOS inverter was formed first, And then, a conversion model to convert a multiple input CMOS gate into a corresponding CMOS inverter was proposed. Finally, the power model for inverter was applied to the converted result so that the model could be applied to a general CMOS gate. We designed several CMOS gates in layout level with $0.6{\mu}m$ design rule to apply both to HSPICE simulation and to the proposed models. The comparison between the two results showed that the gate conversion model and the power estimation model had within 5% and 10% of the relative errors, respectively. Those values show that the proposed models have sufficient accuracies. Also in calculation time, the proposed models were more than 30 times faster than HSPICE simulation. Consequently, it can be said that the proposed model could be used efficiently to estimate the maximum dissipated power of a CMOS logic gate during the design procedure.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.646-649
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• 2002

In this paper, a low-voltage CMOS squarer and a four-quadrant analog multiplier are presented. It is based on a source-coupled pair and a scaled-floating voltage generator which are modified to work as a voltage squaring and a sum/difference circuits. The proposed squarer/multiplier have been simulated with HSPICE, where -3㏈ bandwidth of 10MHz is achieved. The power consumption is about 0.6㎽, from a ${\pm}$1.5V supply, and the total harmonic distortion is less than 0.7%, with a 1.2V peak-to-peak 1MHz input signal.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.209-212
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• 2000

Charge pump based upon a phase locked loop(PLL) is described. This charge pump show that it is possible to overcome the issue of charge pump current mismatch by using a current subtraction circuit. Also, this charge pump can suppress reference spurs and disturbance of the VCO control voltage. HSPICE simulations are performed using 0.25$\mu\textrm{m}$ CMOS process.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.565-568
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• 2004

This paper proposes effective method for delay estimation in RLC interconnects. This method is simple, but precise. The results using the proposed method for RLC circuits show that absolute average relative error is within $7\%$ with the exception of first node in comparison with HSPICE results.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.629-631
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• 2004

The proposed output buffer is presented for driving large-size LCD panels. This output buffer is designed by adding some simple circuitry to the conventional two-stage operational amplifier. The proposed circuit is simulated in a high-voltage 0.35um CMOS process with HSPICE. The simulated result is more improved settling time than that of conventional one.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1141-1144
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• 1998

A new design methodology for the shortchannel CMOS IC-package is presented. It is developed by representing the package inductance with an effective lumpedinductance. The worst case maximum-simultaneous-switching noise (SSN) and gate propagation delay due to the package are modeled in terms of driver geometry, the maximum number of simultaneous switching drivers, and the effective inductance. The SSN variations according to load capacitances are investigated with this model. The package design techniques based on the proposed guidelines are verified by performing HSPICE simulations with the $0.35\mu\textrm{m}$ CMOS model parameters.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.5
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• pp.55-55
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• 2001

개의 N과 P채널 EEPROM을 이용하여 A/D 변환기를 설계하였다. 프로그래밍 모드에서 EEPROM의 선형적 저장능력을 관찰하기 위해 MOSIS의 1.2㎛ double-poly CMOS 공정을 이용하여 셀이 제작되었다. 그 결과 1.25V와 2V구간에서 10㎷ 미만의 오차 내에서 셀이 선형적으로 프로그램 되는 것을 보았다. 이러한 실험 결과를 이용하여 프로그램 가능한 A/D 변환기의 동작이 Hspice에서 시뮤레이션 되었으며, 그 결과 A/D 변환기가 37㎼의 전력을 소모하고 동작주파수는 333㎒ 정도인 것으로 관찰되었다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.355-358
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• 2003

본 문서는 백프레인(backplane)에서 프로세서 HSTL(High-speed Transceiver Logic)의 데이터 전송 및 수신 특성을 알아보기 위해 HSPICE를 사용하여 시뮬레이션을 하였으며 Xilinx Virtex II XC2V FF896 FPGA를 이용하여 직접 제작 신호 전달특성을 분석하였다. PCB(Printed Circuit Board)는 FR-4를 사용하였으며 point to point 배선 길이에 대해 데이터 전송속도 특성을 시험하였고 구현 가능한 데이터 전송 및 수신 한계 속도에 대해 검토하였다. 시험결과 point to point 접속 신호 전송 및 수신 한계속도에 영향을 주는 것이 배선 길이와 주변 전기적 잡음이 중요한 역할을 함을 알 수 있었다.