• Proceedings of the Korea Technology Innovation Society Conference
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• 2000.05a
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• pp.483-492
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• 2000

In this paper, we explore the economic principle behind the revenue-sharing rule for interconnection charges. First, we assert that firms can collude by splitting tile revenues equally i.e., choosing the revenue-sharing ratio equal to l/2. Also, we characterize the optimal revenue-sharing ratio in a model of horizontal interconnection and discuss the relation between the optimal ratio and the optimal access price.

• Journal of The Korea Institute of Healthcare Architecture
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• v.8 no.1
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• pp.13-20
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• 2002

Large hospital designs try to accommodate functional needs and spatial organization. The purpose of this study is to propose an effective compositional method by horizontal interconnection of public circulation spaces with 'hospital street'. 'Hospital street' and network of public circulation spaces are major elements of consideration for the design of large hospitals, which not only connect functional components but also provide satisfying environment, amenity and patients' life.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.2
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• pp.140-150
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• 1995

A symbolic layout generator, called Flexible Module Generator (FMG), has been developed for transgorming a given CMOS circuit netlist into an optimized symbolic layout. Contrary to other conventional module generators which place transistors either in horizontal or in vertical direction, FMG places transittors in any hence can multiples of 90$^{\circ}$. This flexible layout style can maximize the diffusion sharing and hence can reduce the wire-length for both of area minimization and performance improvement. In FMG, transistors are initially randomly placed and then selected transistors are iteratively replaced using an optimization technique based on simulated evolution. Whenever a transistor is replaced, the affected nets are rerouted. Constraints on the shape, aspect ratio, and critical path delays are considered during the optimization process. Routing is performed by using a modified maze router on polysilicon, metal 1, and metal 2 interconnection layers. additional routing grids are added, if necessary, for complete routing. Unused rows or columns are removed after routing for area minimization. Experimental reasults show that FMG synthesizes satisfactory layouts.

• Proceedings of the Optical Society of Korea Conference
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• 1989.02a
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• pp.180-184
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• 1989

Overviews of vertical and horizontal GaAs/AlGaAs OEIC are shown. Researching double Zn diffusion process, we obtain Xj=At1/2-Bd1, where A=2.5${\mu}{\textrm}{m}$/[hr]1/2, B=0.625, of which process is recommended for exact diffusion interface area control of GaAs/AlGaAs. It is proved to be 100A/100A AlAs/GaAs using MOCVD by measurement of photo-luminescence which shows a luminescence peak corresponding to the 798.4nm wavelength calculated values of 38meV ground state above GaAs conduction band.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.18-18
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• 2008

3차원 패키징 System In Package (SIP)구조에서 Chip to Chip 단위 Interconnection 역할을 하는 Through Silicon Via(TSV)를 형성하기 위하여 Pulsating RF bias가 장착된 Inductively Coupled Plasma Etcher 장비를 이용하였다. 이 Pulsating 플라즈마 공정 방법은 주기적인 펄스($50{\sim}500Hz$)와 듀티($20{\sim}99%$) cycle 조절이 가능하며, 플라즈마 에칭특성에 영향을 주는 플라즈마즈마 발생 On/Off타임을 조절할 수 있다. 예를 들면, 플라즈마 발생 Off일 경우에는 이온(SFx+, O+)과 래디컬(SF*, F*, O*)의 농도 및 활성도를 급격하게 줄이는 효과를 얻을 수가 있는데, 이러한 효과는 식각 에칭시, 이온폭격의 손상을 급격하게 줄일 수 있으며, 실리콘 표면과 래디컬의 화학적 반응을 조절하여 에칭 측벽 식각 보호막 (SiOxFy : Silicon- Oxy- Fluoride)을 형성하는데 영향을 미친다. 그리고, TSV 형성에 있어서 큰 문제점으로 지적되고 있는 언더컷과 수평에칭 (Horizontal etching)을 개선하기 위한 방법으로, Black-Siphenomenon을 이번 실험에 적용하였다. 이 Black-Si phenomenon은 Bare Si샘플을 이용하여, 언더컷(Undercut) 및 수평 에칭 (Horizontal etching)이 최소화 되는 공정 조건을 간편하게 평가 할 수 있는 방법으로써, 에칭 조건 및 비율을 최적화하는 데 효율적이었다. 결과적으로, Pulsating RF bias가 장착된 Inductively Coupled Plasma Etcher 장비를 이용한 에칭실험은 펄스 주파수($50{\sim}500Hz$)와 듀티($20{\sim}99%$) cycle 조절이 가능하여, 이온(SFx+, O+)과 래디컬(SF*, F*, O*)의 농도와 활성화를 조절 하는데 효과적이었으며, Through Silicon Via (TSV)를 형성 하는데 있어서 Black-Si phenomenon 적용은 기존의 Continuous 플라즈마 식각 결과보다 향상된 에칭 조건 및 에칭 프로파일 결과를 얻는데 효과적이었다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of Families and Better Life
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• v.26 no.2
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• pp.115-127
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• 2008

The purpose of this study was to examine the characteristics of change in the composition of indoor spaces in Korean-style houses which have been repaired and improved extensively through the 'Bukchon Improvement Project' and are being utilized for public purposes. For this, we conducted a field survey through visiting the house sites from the 5th to the 26th of May, 2006. Conclusions drawn from this study are as follows. Bukchon Korean-style houses maintain centripetal space composition, in which the rooms surround the court. Centering on the court, the hierarchy of spaces is determined, and the hierarchy of spaces and the composition of internal layout are restructured centering on the court and the main hall without change in direction and position. The main hall is sometimes converted to a room, but it maintains an open space relation with other spaces centering on the court, and therefore, even after its use has been changed, it is still the most Korean-style space. In addition, with floor heating, the common sitting-style life is maintained continuously although the rooms have been converted and standing-style furniture is used. In this way, publicly promoted policies for Korean-style houses are allowed within the limit that the appearance is maintained and the internal spaces do not change the overall structure. However, in order to maintain the tradition of Korean-style houses and utilize them as various spaces, the following supplementations are necessary. First, the main hall and the inner court of a Koreanstyle house should be utilized actively. The court sometimes keeps individuals' privacy or expands the space by extending the view to outdoor spaces, and is sometimes used as an open space through interconnection between the inside and the outside of the house. Second, consideration should be given to vertical spaces. Horizontal expansion causes a change of floor plan. Thus, space should be secured using various cross-sectional changes, such as a kitchen and a loft over the kitchen. Third, structure should be changeable in order to adjust the size of spaces. Thus, through research on traditional windows, we need to develop changeable walls that can be installed and removed easily according to the use of spaces.