• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.580-586
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• 2002

We investigated the effect of ionic component on crystalline morphology development during isothermal annealing in a sodium neutralized sulfonated poly(ethylene terephthalate) ionomer (Ion-PET) by time-resolved small-angle x-ray scattering (TR-SAX S) using synchrotron radiation. At early stage in Ion-PET, SAXS intensity at a low annealing temperature (Ta = 120 $^{\circ}C)$ decreased monotonously with scattering angle for a while. Then SAXS profile showed a peak and the peak position progressively moved to wider angles with isothermal annealing time. Finally, the peak intensity decreased, shifting the peak angle to wider angle. It is revealed that ionic aggregates (multiplets structure) of several nm, calculated by Debye-Bueche plot, are formed at early stage. They seem to accelerate the crystallization rate and make fine crystallites without spherulite formation (supported by optical microscopy observation). From decrease of peak intensity in SAXS,it is suggested that new lamellae are inserted between the preformed lamellae so that the concentration of ionic multiplets in amorphous region decreases to lower the electron density difference between lamellar crystal and amorphous region. In addition, analysis on the annealing at a high temperature (Ta = 210 $^{\circ}C)$ by optical microscopy, light scattering and transmission electron microscopy shows a formation of spherulite, no ionic aggregates, the retarded crystallization rate and a high level of lamellar orientation.

• Journal of Welding and Joining
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• v.25 no.5
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• pp.51-57
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• 2007

The present work was aimed to examine the variation of microstructure and mechanical properties by annealing($100{\sim}620^{\circ}C$, $2{\sim}8hr$) in A3003 Al alloy welded pipes. The A3003 Al alloy pipes with 34 mm in external diameter and 1.3 mm in thickness were manufactured by high frequency induction welding with the V shaped convergence angle $6.7^{\circ}$ and power input 50 kW. The tensile and yield strength decreased with increasing the annealing temperature remarkably, but elongation increased remarkably. Vickers hardness in welds decreased with increasing the annealing temperature remarkably. The primary intermetallic compound of $Al_{12}(Fe,\;Mn)_2Si$ was precipitated in welds as the same base metal. In a certain experimental condition, the welds line in A3003 alloys disappeared at $450^{\circ}C$ for 2 hr because of the same mechanical property and structure between welds and base metal.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.8
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• pp.72-79
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• 1996

In a BAF(Batch Annealing Furnace), various studies have been pursued in order to reduce energy consumption rate to improve productivity and to stabilize the properties of products. The purpose of this study was to investigate the effects of both the atmospheric gas and convector plate shapes on the augmentation of heat transfer. The use of hydrogen instead of nitrogen as an atmospheric gas, combined with high convection in the BAF, has shown that considerable increases in furnace out put and significantly improved material quality are attainable. Because convector plate shapes make the atmosheric gas easily flow density, high diffusivity and reducing character of hydrogen, a better heat transfer rates resulting in uniform material temperature distribution and improved coil surface quality can be achieved. Also, it was found that the closed convector plate took more time for the annealing cycle time than the other plate type(open-type)by about ten hours.

• Journal of Magnetics
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• v.11 no.3
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• pp.111-114
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• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.760-763
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• 2004

We studied the nematic liquid crystaL(NLC) aligning capabilities using the new alignment material of a nitrogenated diamond-like carbon(NDLC) thin film. The NDLC thin film exhibits high electrical resistivity and thermal conductivity that are similar to the properties shown by diamond-like carbon (DLC) thin films. The diamond-like properties and nondiamond-like bonding make NDLC an attractive candidate for applications. A high pretilt angle of about 9.9$^{\circ}$ by ion beam(IB) exposure on the NDLC thin film surface was measured. A good LC alignment is achieved by the IB alignment method on the NDLC thin films surface at annealing temperature of 200 $^{\circ}C$. The alignment defect of the NLC was observed above annealing temperature of 250 $^{\circ}C$. Consequently, the high pretilt angle and the good LC alignment by the IB alignment method on the NDLC thin film surface can be achieved.

• Korean Journal of Metals and Materials
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• v.50 no.6
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• pp.413-418
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• 2012

This study was carried out to investigate the effect of reverse transformation on the mechanical properties in high manganese austenitic stainless steel. Over 95% of the austenite was transformed to deformation-induced martensite by 70% cold rolling. Reverse transformation became rapid above an annealing temperature of $550^{\circ}C$, but there was no significant transformation above $700^{\circ}C$. In addition, with an increasing annealing time at $700^{\circ}C$, reverse transformation was induced rapidly, but the transformation was almost completed at 10 min. There was a rapid decrese in strength and hardness with annealing at temperature above $550^{\circ}C$, while elongation increased rapidly above $600^{\circ}C$. At $700^{\circ}C$, hardness and strength decreased rapidly, and elongation increased steeply with an increasing reverse treatment time up to 10 min, whereas there were no significant change with a treatment time after 10 min. The reverse-transformed austenite showed an ultra-fine grain size less than $0.2{\mu}m$, which made it possible to strengthen the high manganese austenitic stainless steel.

• Transactions of Materials Processing
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• v.22 no.5
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• pp.264-268
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• 2013

Aluminum clad sheets for brazing materials in the automotive heat exchangers are required to exhibit both high strength and excellent erosion resistance. In this study, the effects of microstructural changes on the property of clad sheets due to thermomechanical treatment were investigated. The clad sheets were fabricated by roll bonding of twin-roll-cast AA3527 and AA4343 alloys followed by cold rolling down to a thickness of 0.22mm. Partial or full annealing was conducted at the final thickness in order to improved the erosion resistance while keeping the proper strength. Since full annealing was achieved for a temperature of $400^{\circ}C$, annealing treatments were performed at 360, 380, and $400^{\circ}C$, respectively. The tensile strength of 3527/4343 clad material was found to be inversely proportional to the annealing temperature before the brazing heat treatment. After this latter treatment, however, the tensile strength of the clad material was about 195~200MPa regardless of the annealing temperature. The erosion depth ratio of the clad annealed at $400^{\circ}C$ was 8.8% (the lowest), while that of the clad annealed at $380^{\circ}C$ was 17% (the highest). The effect of annealing temperature on the tensile and erosion properties of 3527/4343 aluminum clad sheets was elucidated by means of microstructural analyses.

• Korean Journal of Materials Research
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• v.14 no.6
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• pp.389-393
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• 2004

The silicide layer used as a diffusion barrier in microelectronics is typically required to be below 50 nm-thick and, the same time, the silicides also need to have low contact resistance without agglomeration at high processing temperatures. We fabricated Si(100)/15 nm-Ni/15 nm-Co samples with a thermal evaporator, and annealed the samples for 40 seconds at temperatures ranging from $700^{\circ}C$ to $1100^{\circ}C$ using rapid thermal annealing. We investigated microstructural and compositional changes during annealing using transmission electron microscopy and auger electron spectroscopy. Sheet resistance of the annealed sample stack was measured with a four point probe. The sheet resistance measurements for our proposed Co/Ni composite silicide was below 8 $\Omega$/sq. even after annealing $1100^{\circ}C$, while conventional nickel-monosilicide showed abrupt phase transformation at $700^{\circ}C$. Microstructure and auger depth profiling showed that the silicides in our sample consisted of intermixed phases of $CoNiSi_{x}$ and NiSi. It was noticed that NiSi grew rapidly at the silicon interface with increasing annealing temperature without transforming into $NiSi_2$. Our results imply that Co/Ni composite silicide should have excellent high temperature stability even in post-silicidation processes.

• Korean Journal of Materials Research
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• v.13 no.4
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• pp.233-238
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• 2003

Ferromagnetic tunnel junctions, Ta/Cu/Ta/NiFe/Cu/$Mn_{75}$ $Ir_{25}$ $Co_{70}$ $Fe_{30}$/Al-oxide, were fabricated by do magnetron sputtering and plasma oxidation process. The effect of annealing temperature on the local transport properties of the ferromagnetic tunnel junctions was studied using contact-mode Atomic Force Microscopy (AFM). The current images reflected the distribution of the barrier height determined by local I-V analysis. The contrast of the current image became more homogeneous and smooth after annealing at $280^{\circ}C$. And the average barrier height $\phi_{ave}$ increased and its standard deviation $\sigma_{\phi}$ X decreased. For the cases of the annealing temperature more than $300^{\circ}C$, the contrast of the current image became large again. And the average barrier height $\phi_{ave}$ decreased and its standard deviation $\sigma_{\phi}$ increased. Also, the current histogram had a long tail in the high current region and became asymmetric. This result means the generation of the leakage current that is resulted from the local generation of a low barrier height region. In order to obtain the high tunnel magnetoresistance(TMR) ratio, the increase of the average barrier height and the decrease of the barrier height fluctuation must be strictly controlled.led.

• Korean Journal of Materials Research
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• v.30 no.11
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• pp.615-620
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• 2020

Oxide semiconductor, represented by a-IGZO, has been commercialized in the market as active layer of TFTs of display backplanes due to its various advantages over a-Si. a-IGZO can be deposited at room temperature by RF magnetron sputtering process; however, additional thermal annealing above 300℃ is required to obtain good semiconducting properties and stability. These temperature are too high for common flexible substrates like PET, PEN, and PI. In this work, effects of microwave annealing time on IGZO thin film and associated thin-film transistors are demonstrated. As the microwave annealing time increases, the electrical properties of a-IGZO TFT improve to a degree similar to that during thermal annealing. Optimal microwave annealed IGZO TFT exhibits mobility, SS, V_th, and V_H of 6.45 ㎠/Vs, 0.17 V/dec, 1.53 V, and 0.47 V, respectively. PBS and NBS stability tests confirm that microwave annealing can effectively improve the interface between the dielectric and the active layer.