• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.1
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• pp.39-44
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• 1999

The dielectric layers in AC plasma display panel(PDP) are essential to the discharge cell structure, because they protect metal electrodes from sputtering by positive ion bombarding in discharge plasma and form a sheath of wall charges which are essential to memory function of AC PDP. This layer should have high dielectric breakdown voltage, and also be transparent because the luminance of PDP is strongly correlated this layer. In this paper, we discussed the dielectric breakdown voltage and transparency of the dielectric layer under various conditions. As a result, on the $15\mum$ thickness, the minimum dielectric breakdown voltage was 435V and the transmission coefficient was about 80% after $570^{\circ}C$ firing process. It can be proposed that the resonable dielectric thickness in AC PDP is $15\mum$ because it has about 75V margin on the maximum applied voltage.

• Journal of electromagnetic engineering and science
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• v.11 no.1
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• pp.11-15
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• 2011

Preserving high-order accuracy in high-order FDTD solutions across dielectric interfaces is very important for practical time-domain electromagnetic simulations. This paper presents a fourth-order accurate numerical boundary scheme for the planar dielectric interface to be used in the fourth-order FDTD method proposed earlier by the author. The interface scheme for the two-dimensional (2-D) transverse magnetic (TM) polarization case is derived and validated by monitoring the $L_2$ norm errors in the numerical solutions of a partially-filled cavity demonstrating its fourth-order convergence and long-time numerical stability in the presence of the planar dielectric interface.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1266-1268
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• 2005

The influence of the grooved dielectric layer on discharge and luminous characteristics has been investigated for various depths of the groove to achieve a high luminance efficiency AC-PDP operated at a lower voltage. We use the voltagethreshold curve technique and address delay jitters to explain the discharge characteristics. It shows that the surface discharge voltage rely on the depth of the grooved dielectric layer. Vertical discharge voltage remains almost the same as the groove depth increases. The influence of the grooved dielectric layer on discharge and luminous characteristics has been investigated for various depths of the groove to achieve a high luminance efficiency AC-PDP operated at a lower voltage. We use the voltagethreshold curve technique and address delay jitters to explain the discharge characteristics. It shows that the surface discharge voltage rely on the depth of the grooved dielectric layer. Vertical discharge voltage remains almost the same as the groove depth increases.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.163-166
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• 2002

We investigated structural and electrical properties of Metal-Oxide-Semiconductor(MOS) structure using Hafnium $oxide(HfO_{2})$ as high-k gate dielectric material. $HfO_{2}$ films are ultrathin gate dielectric material witch have a thickness less than 2.0nm， so it is spotlighted to be substituted $SiO_{2}$ as gate dielectric material. In this paper We have grown $HfO_{2}$ films with pt electrode on P-type Silicon substrate by RF magnetron sputtering system using $HfO_{2}$ target and oserved the property of semiconductor-oxide interface. Using pt electrode, it is necessary to be annealed at ${300^{\circ}C}$. This process is to increase an adhesion ratio between $HfO_{2}$ films with pt electrode. In film deposition process, the deposition time of $HfO_{2}$ films is an important parameter. Structura1 properties are invetigated by AES depth profile, and electrical properties by Capacitance-Voltage characteristic. Interface trap density are measured to observe the interface between $HfO_{2}$ with Si using High-frequency(1MHz) C-V and Quasi - static C-V characteristic.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.35-40
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• 2010

The variations of dielectric properties of $Ta_2O_5-SiO_2$ continuous composition spread thin films prepared by off-axis radio-frequency magnetron sputtering were investigated. The dielectric maps of dielectric constant and loss were plotted via 1500 micron-step measuring. The specific points showing superior dielectric properties of high dielectric constant (k~19.5) and loss (tan${\delta}$<0.05) at 1 MHz were found in area of the distance of 16 mm and 22 mm apart from $SiO_2$ side in $75{\times}25mm^2$ sized Pt/Ti/$SiO_2$/Si(100) substrates.

• Journal of Microbiology and Biotechnology
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• v.15 no.3
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• pp.587-594
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• 2005

The contribution of electrostriction of water molecules to the stabilization of the negatively charged tetrahedral transition state of a lipase-catalyzed reaction was examined by means of kinetic studies involving high-pressure and solvent dielectric constant. A good correlation was observed between the increased catalytic efficiency of lipase and the decreased solvent dielectric constant. When the dielectric constant of solvents was lowered by 5.00 units, the losses of activation energy and free energy of activation were 7.92 kJ/mol and 11.24 kJ/mol, respectively. The activation volume for $k_{cat}$ decreased significantly as the dielectric constant of solvent decreased, indicating that the degree of electrostriction of water molecules around the charged tetrahedral transition state has been enhanced. These observations demonstrate that the increase in the catalytic efficiency of the lipase reaction with decreasing dielectric constant resulted from the stabilization of electrostatic energy for the formation of an oxyanion hole, and that this stabilization was caused by the increase of electrostricted water around the charged tetrahedral transition state. Therefore, we conclude that the control of solvent dielectric constant can stabilize the tetrahedral transition state, thus lowering the activation energy.

• Progress in Superconductivity
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• v.13 no.3
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• pp.189-194
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• 2012

Studies on the development of high voltage superconducting apparatuses, such as transmission superconducting fault current limiters (SFCLs) and superconducting cables, have been performed worldwide. In this paper, a study on the electrical insulation characteristics of electro negative gas according to various pressures and utilization factors was conducted as a part of developing a high voltage superconducting coil with a sub-cooled nitrogen cooling system. Some gases such as helium (He), nitrogen ($N_2$), and sulfur hexafluoride ($SF_6$) are considered for pressurizing the sub-cooled nitrogen cooling system of high voltage SFCLs and superconducting cables. $SF_6$ is used to pressurize and enhance the dielectric performance of a superconducting system of a sub-cooled nitrogen cooling system for superconducting cables being developed in the Republic of Korea. In this paper, dielectric experiments on AC voltage, as well as lightning impulse voltage of $SF_6$, are conducted according to various utilization factors by using several kinds of sphere-to-plane electrode systems. As results, it is known that the empirical formulae of $SF_6$, known as an electro negative gas, are derived according to various pressures and utilization factors. Also, the appropriate pressure condition for designing a high voltage superconducting coil is found from the viewpoint of dielectric performance.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.12
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• pp.673-678
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• 2000

The dielectric barrier discharge(DBD) is a common method to create a nonthermal plasma in which electrical energy is used to create electrons with a high average kinetic energy. The unique aspect of dielectric barrier discharges is the large array of short lifetime(10ns) silent discharges created over the surface of the dielectric. A silent discharge is generated when the applied voltage exceeds the breakdown voltage of the carrier gas creating a conduction path between the applied electrode and grounded electrode. As charge accumulates on the dielectric, the electric field is reduced below the breakdown field of the carrier gas and the silent discharge self terminates preventing the DBD cell from producing a thermal arc. In fact, the most significant application of dielectric barrier discharges is to generate ozone for contaminated water treatment. Therefore, experiments were perfomed at 1∼2[bar] pressure using a coaxial geometry single dielectric barrier discharge for ozone concentrations and energy densities. The main result show that the concentration and efficiency of ozone are influenced by gas nature, gas quantity, gas pressure, supplied voltage and frequency.

• Macromolecular Research
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• v.17 no.10
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• pp.785-790
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• 2009

In this paper, the relaxation behavior of the regenerated silk fibroin (SF) films was investigated using dielectric thermal analysis (DETA), and compared with the dynamic mechanical behavior obtained from dynamic mechanical thermal analysis (DMTA), in order to gain a better understanding of the characteristics of dielectric behavior of SF film and identify the differences between the two analyses. Compared to DMTA, DETA exhibited a higher sensitivity on the molecular relaxation behaviors at low temperature ranges that showed a high $\gamma$-relaxation peak intensity without noise. However, it was not effective to examine the relaxation behaviors at high temperatures such as $\alpha-$ and ${\alpha}_c$-relaxations that showed a shoulder peak shape. On the contrary, DMTA provided more information regarding the relaxation behaviors at high temperatures, by exhibiting the changes in width, intensity and temperature shift of the $\alpha$-relaxation peak according to various crystallinities. Conclusively, DETA and DMTA can be utilized in a complementary manner to study the relaxation behavior of SF over a wide temperature range, due to the different sensitivity of each technique at different temperatures.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.154-155
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• 2012

In this work, we report the comprehensive study of performance enhancement of InGaAs n-MOSFET by plasma $PH_3$ p assivation. The calibrated plasma $PH_3$ passivation of the InGaA ssurface before CVD high-k dielectric deposition significantly improves interface quality, resulting in suppressed frequency dispersion in C-V, increase in drive-current with high electron mobility, and excellent thermal stability.