• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.688-696
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• 2014

A slew-rate control method of LCD driver ICs is introduced to increase uniformity between adjacent driver ICs and reduce power consumption. The slew rate of every voltage follower is calibrated by a feedback algorithm during the non-displaying period. Under normal operation mode, the slew rate is dynamically controlled for improving power efficiency. Experimental results show that the power consumption is reduced by 16% with a white pattern and by 10% with a black pattern, and display defects are successfully eliminated.

• Journal of Welding and Joining
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• 제27권5호
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• pp.68-73
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• 2009

The bar horn is designed to increase uniformity of the displacement on the output face through simulation and experiments. Three-dimensional modal analysis is conducted using the finite element method to calculate the vibration mode and displacement on the output face, and the design of experiment (DOE) technique is employed to determine the optimum dimensions of the groove and slot so that the high amplitude uniformity of the bar horn is produced. Displacement of the bar horn was measured using the Laser Doppler Vibrometer (LDV), and the experimental results show good agreements with the predicted results. High uniformity of the bar horn is achieved with the dimensions of the groove and slot determined using the design equations.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1068-1071
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• 2001

Recently, the minimum line width shows a tendancy to decrease and the multi-level to increase in semiconductor. Therefore, a planarization technique is needed, which chemical polishing(CMP) is considered as one of the most important process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as microscratches, abrasive contaminations, and non-uniformity of polished wafer edges. Spin Etching can improve the defects of CMP. It uses abrasive-free chemical solution instead of slurry. Wafer rotates and chemical solution is simultaneously dispensed on a whole surface of the wafer. Thereby chemical reaction is occurred on the surface of wafer, material is removed. On this study, TEOS film is removed by CMP and Spin Etching, the results are estimated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.935-938
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• 1997

Recently, the minimum line width shows a tendency to decrease and the multi-level increase in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as micro-scratches, abrasive contaminations, and non-uniformity of polished wafer edges. Wet etching include of Spin-etching can improve he defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(INterlayer-Dielectric) was removed by CMP and wet-etching methods in order to investigate the superiority of wet etching mechanism. In the thin film wafer, the results were evaluated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And pattern step height was also compared for planarization characteristics of the patterned wafer.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.728-731
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• 2002

For the evaporation process, thickness uniformity is of great practical importance. And, it is commercially significant to improve the efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. To achieve the better thickness uniformity and the higher evaporating efficiency, Samsung SDI has introduced the new concept of the asymmetric evaporation technology for depositing evener and cheaper organic layers. Based on the developed method, the uniformity of the organic layer thickness can be successfully controlled. Furthermore, the very high efficiency may allow the OLED displays be manufactured with the lower cost.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 E
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• pp.1764-1766
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• 1997

In this paper, the illuminance distribution of blackboards on classroom in elementary, junior, and senior high school was measured and analyzed. Generally, average illuminance and uniformity of illuminance was 519[lx] and 0.543 (elementary: 389[lx], 0.387; junior: 632[lx], 0.570; senior: 527[lx], 0.608) respectively. When all lighting fixtures in each classroom were turned on, average illuminance was higher about 65% than lights-out, and, in case that local lighting fixtures exist, was higher 27% than absence, but uniformity of illuminance turned bad on the contrary ($0.462{\rightarrow}0.676$). According to classification into direction of windows on classroom. facing north, both were bad. In case of classroom to slant to east or west, the difference of illuminance at the forenoon and afternoon was big, and uniformity of illuminance was also bad.

• 산업경영시스템학회지
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• 제38권3호
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• pp.21-28
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• 2015

As film products are increasingly used in a wide range of areas, from producing traditional flexible packaging to high-tech electronic products, a higher level of quality is demanded. Most film products are made in the form of rolled finished goods, therefore, various quality issues related to their shape characteristics must be addressed. The thickness of the film products is one of the most common and important critical-to-quality attributes (CTQs). Particularly, the degree of thickness uniformity is more important than other thickness parameters, because it will be potential causes of many secondary thickness-related quality problems, such as wrinkles or faulty windings. To control the degree of thickness uniformity, the fixed bending region is oneof the most important CTQs to manage. Fixed bending regions are special points in the transverse direction of a rolled product with consistent minute variations of the thickness gap. This paper describes the measurement and analysis of thickness uniformity data, which were performed in a real manufacturing field of biaxial oriented polypropylene (BOPP) film. In previous researches, quality function deployment (QFD) or fault tree analysis were used to find the most critical process attributes out to controlthe CTQ of thickness uniformity. Whereas, this paper uses traditional control charts to find the most critical process attributes out in this problem. In addition, the selection of one of the major critical process attributes (CTPs) that is expected to affect the CTQ of thickness uniformity is also described. The selected critical-to-process attributes are the controlled temperatures along the transverse direction. A dramatic improvement in thickness uniformity was observed when the selected CTPs were controlled.

• Journal of Magnetics
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• 제22권2호
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• pp.315-325
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• 2017

Magnetically suspended sensitive gyroscopes (MSSGs) provide an interesting alternative for achieving precious attitude angular measurement. To effectively reduce the measurement error caused by the non-uniformity of the air-gap flux density in a MSSG, this paper proposes a novel compensation method based on measuring and modeling of the air-gap flux density. The angular velocity measurement principle and the structure of the MSSG are described, and then the characteristic of the air-gap flux density has been analyzed in detail. Next, to compensate the flux density distribution error and improve the measurement accuracy of the MSSG, a real-time compensation method based on the online measurement with hall probes is designed. The common issues caused by the non-uniformity of the air-gap flux density can be effectively resolved by the proposed method in high-precision magnetically suspended configurations. Comparative simulation results before and after compensation have verified the effectiveness and superiority of the proposed compensation method.

• 반도체디스플레이기술학회지
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• 제9권4호
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• pp.39-43
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• 2010

According to recent changes in industry for the semiconductor device, a gap between patterns in wafer is getting narrow. And this narrow gap makes a failure of uniform deposition between center and edge on the wafer. In this paper, for solving this problem, we analyze and manipulate the gas flow inside of the HDP CVD chamber by using CFD(Computational Fluid Dynamics). This simulation includes design manipulations in heights of the chamber and shape of center nozzle in the upper side of the chamber. The result of simulation shows 1.28 uniformity which is lower 3% than original uniformity.

• 한국군사과학기술학회지
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• 제27권2호
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• pp.230-237
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• 2024

Dispersion munitions are often equipped with dispersive submunitions used to scatter bombs over a wide area, and one of the types of dispersive submunitions is the Magnus rotor, commonly referred to as a self-rotating flying body. The Magnus rotor is designed to be dispered over a wide area by utilizing the principle of the Magnus effect through self-rotation, and has various trajectories depending on the initial conditions from the mother dispersion munition. In this paper, an index to evaluate the dispersion uniformity of footprint of the dispersive submunition is presented and the dispersion uniformity according to various initial release conditions is evaluated, and it is getting larger with high incidence angle and get max value at certain initial angular velocity.