• Title/Summary/Keyword: high dielectric-constant

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Study of Humidity Sensing Properties Related to Metal Content of Aerosol Deposited Ceramic/Metal Composite Films (에어로졸 증착한 세라믹/금속 복합막의 금속 함량에 따른 습도 감지 특성 연구)

  • Kim, Ik-Soo;Koo, Sang-Mo;Park, Chulhwan;Shin, Weon Ho;Lee, Dong-Won;Oh, Jong-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.5
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    • pp.314-320
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    • 2021
  • Controlling ambient humid condition through high performance humidity sensors has become important for various fields, including industrial process, food storage, and the preservation of historic remains. Although aerosol deposited humidity sensors using ceramic BaTiO3 (BT) material have been widely studied because of their longtime stability, there remain critical disadvantages, such as low sensitivity, low linearity, and slow response/recovery time in case of the sensors fabricated at room temperature. To achieve superior humidity sensing properties even at room temperature condition, BT-Cu composite films utilizing aerosol deposition (AD) process have been proposed based on the percolation theory. The BT-Cu composite films showed gradually improved sensing properties until the Cu concentration reached 15 wt% in the composite film. However, the excessive Cu (above 30 wt%) containing BT-Cu composite films showed a rapid decrease of the sensing properties. The results of observed surface morphology of the AD fabricated composite films, to figure out the metal filler effect, showed correlation between surface topography as well as size and the amount of open pores according to the metal filler content. Overall, it is very important not only dielectric constant of the humidity sensing films but also microstructures, because they affect either the variation range of capacitance by ambient humidity or adsorption/desorption of ambient humidity onto/from the humidity sensing films.

Enhanced Device Performance of IZO-based oxide-TFTs with Co-sputtered $HfO_2-Al_2O_3$ Gate Dielectrics (Co-sputtered $HfO_2-Al_2O_3$을 게이트 절연막으로 적용한 IZO 기반 Oxide-TFT 소자의 성능 향상)

  • Son, Hee-Geon;Yang, Jung-Il;Cho, Dong-Kyu;Woo, Sang-Hyun;Lee, Dong-Hee;Yi, Moon-Suk
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.6
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    • pp.1-6
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    • 2011
  • A transparent oxide thin film transistors (Transparent Oxide-TFT) have been fabricated by RF magnetron sputtering at room temperature using amorphous indium zinc oxide (a-IZO) as both of active channel and source/drain, gate electrodes and co-sputtered $HfO_2-Al_2O_3$ (HfAIO) as gate dielectric. In spite of its high dielectric constant > 20), $HfO_2$ has some drawbacks including high leakage current and rough surface morphologies originated from small energy band gap (5.31eV) and microcrystalline structure. In this work, the incorporation of $Al_2O_3$ into $HfO_2$ was obtained by co-sputtering of $HfO_2$ and $Al_2O_3$ without any intentional substrate heating and its structural and electrical properties were investigated by x-ray diffraction (XRD), atomic force microscopy (AFM) and spectroscopic ellipsometer (SE) analyses. The XRD studies confirmed that the microcrystalline structures of $HfO_2$ were transformed to amorphous structures of HfAIO. By AFM analysis, HfAIO films (0.490nm) were considerably smoother than $HfO_2$ films (2.979nm) due to their amorphous structure. The energy band gap ($E_g$) deduced by spectroscopic ellipsometer was increased from 5.17eV ($HfO_2$) to 5.42eV (HfAIO). The electrical performances of TFTs which are made of well-controlled active/electrode IZO materials and co-sputtered HfAIO dielectric material, exhibited a field effect mobility of more than $10cm^2/V{\cdot}s$, a threshold voltage of ~2 V, an $I_{on/off}$ ratio of > $10^5$, and a max on-current of > 2 mA.

A Study on the Error Rate of Non-destructive Rebar Detection Under Different Environmental Factors (환경적 요인에 따른 비파괴 철근 탐사의 오차율에 관한 연구)

  • Kang, Beom-Ju;Kim, Young-Hwan;Kim, Young-Min;Park, Kyung-Han;Oh, Hong-Seob
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.9 no.4
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    • pp.506-513
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    • 2021
  • The durability and safety of reinforced concrete structures significantly depend on the reinforcement conditions, concrete cover thickness, cracks, and concrete strength. There are two ways to accurately determine the information on reinforcing bars embedded in concrete - the local destructive method and the non-destructive rebar detection test. In general, the non-destructive rebar detection tests, such as the electromagnetic wave radar method, electromagnetic induction method, and radiation method, are adopted to avoid damage to the structural elements. The moisture content and temperature of concrete affect the dielectric constant, which is the electrical property of concrete, and cause interference in the non-destructive rebar detection test results. Therefore, in this study, the effects of the electromagnetic wave radar method and electromagnetic induction method have been analyzed according to the temperature and surface moisture content of concrete. Due to the technological advancement and development of equipment, the average error rate was less than 5% in the specimens at 24℃, irrespective of their operating principles. Among the tested methods, the electromagnetic induction method showed very high accuracy. The electromagnetic wave radar method indicated a relatively small error rate in the dry state than in the wet state, and exhibited a relatively high error rate at high temperatures. It was confirmed that the error could be reduced by applying the electromagnetic wave radar method when the temperature of the probe was low and in a dry state, and by using the electromagnetic induction method when the probe was in a wet state or at a high temperature.

High Quality Nano Structured Single Gas Barrier Layer by Neutral Beam Assisted Sputtering (NBAS) Process

  • Jang, Yun-Sung;Lee, You-Jong;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.251-252
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    • 2012
  • Recently, the growing interest in organic microelectronic devices including OLEDs has led to an increasing amount of research into their many potential applications in the area of flexible electronic devices based on plastic substrates. However, these organic devices require a gas barrier coating to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency OLEDs require an extremely low Water Vapor Transition Rate (WVTR) of $1{\times}10^{-6}g/m^2$/day. The Key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required ($1{\times}10^{-6}g/m^2$/day) is the suppression of defect sites and gas diffusion pathways between grain boundaries. In this study, we developed an $Al_2O_3$ nano-crystal structure single gas barrier layer using a Neutral Beam Assisted Sputtering (NBAS) process. The NBAS system is based on the conventional RF magnetron sputtering and neutral beam source. The neutral beam source consists of an electron cyclotron Resonance (ECR) plasma source and metal reflector. The Ar+ ions in the ECR plasma are accelerated in the plasma sheath between the plasma and reflector, which are then neutralized by Auger neutralization. The neutral beam energies were possible to estimate indirectly through previous experiments and binary collision model. The accelerating potential is the sum of the plasma potential and reflector bias. In previous experiments, while adjusting the reflector bias, changes in the plasma density and the plasma potential were not observed. The neutral beam energy is controlled by the metal reflector bias. The NBAS process can continuously change crystalline structures from an amorphous phase to nano-crystal phase of various grain sizes within a single inorganic thin film. These NBAS process effects can lead to the formation of a nano-crystal structure barrier layer which effectively limits gas diffusion through the pathways between grain boundaries. Our results verify the nano-crystal structure of the NBAS processed $Al_2O_3$ single gas barrier layer through dielectric constant measurement, break down field measurement, and TEM analysis. Finally, the WVTR of $Al_2O_3$ nano-crystal structure single gas barrier layer was measured to be under $5{\times}10^{-6}g/m^2$/day therefore we can confirm that NBAS processed $Al_2O_3$ nano-crystal structure single gas barrier layer is suitable for OLED application.

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Analysis of Parameter Characteristic of Parallel Electrodes Conduction-cooled Film Capacitor for HF-LC Resonance (고주파 LC 공진을 위한 병렬전극 전도냉각 필름커패시터의 파라메타 특성 분석)

  • Won, Seo-Yeon;Lee, Kyeong-Jin;Kim, Hie-Sik
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.6
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    • pp.155-166
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    • 2016
  • It is important to configure capacitance(C) of the capacitor and the induction coefficient(L) of the work coil on the resonant circuit design stage in order to induce heating on the object by a precise and constant frequency components in the electromagnetic induction heating equipment. Work coil conducts a direct induction heating according to heating point and area of the object which has a fixed heat factor so that work coil is designed to has fixed value. On the other hands, Capacitor should be designed to be changed in order to be the higher the utilization of the entire equipment. It is extracted the samples by variation of single electrode capacity from the selection stage of raw materials for capacity to the stage of process design for output of the high frequency LC resonance of 700kHz on 1000 VAC maximum voltage and current to $200I_{MAX}$. It is suggested fundamental experiment results in order to prove relation for the optimal design of HF-LC resonance conduction-cooled capacitor based on the response of frequency characteristics and results of output parameters according to variation of the capacitance size.

A Study on the Pyroelectric Properties of PZT(30/70) Thick film Prepared by Using 1,3 Propanediol (1,3 Propanediol을 이용해 제작된 PZT(30/70) 후막의 초전특성에 관한 연구)

  • Song, Kum-Suck;Chang, Dong-Hoon;Joung, Yang-Hee;Yoon, Yung-Sup
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.6
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    • pp.9-15
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    • 2004
  • PZT(30/70) thick film was fabricated by using 1,3 propanediol-based sol-gel method. Prepared film of pyroelectric property was investigated by Dynamic method of modulation frequency dependence. Pyroelectric coefficient was obtained about $5.0{\times}10^{-8}\;C/cm^2{\cdot}K$. The figure of merits for voltage responsively and specific detectivity were $3.4{\times}10^{-11}\;C{\cdot}cm/J$ and $5.9{\times}10^{-9}\;C{\cdot}cm/J$, respectively, because of relative high-dielectric constant and high-pyroelectric coefficient. Voltage responsively was increased at low modulation frequency and it was decreased at high modulation frequency. Voltage responsively was maximum 1.84 V/W at 10Hz. As Johnson noise is dominant, Noise voltage was increased nearly proportional to $f^{-1/2}$. Noise equivalent power and specific detectivity were $2.83{\times}10^{-7}\;W/Hz^{1/2}$ and 3.13{\times}10^5\;cm{\cdot}Hz^{1/2}/W$ the same frequency at 80Hz, respectively.

Fabrication of Lightweight Microwave Absorbers with Co-coated Hollow Silica Microspheres (저밀도 실리카 중공미세구 표면에 Co 박막의 코팅에 의한 경량 전파흡수체 제조)

  • Kim, Sun-Tae;Kim, Sung-Soo;Ahn, Jun-Mo;Kim, Keun-Hong
    • Journal of the Korean Magnetics Society
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    • v.15 no.2
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    • pp.67-75
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    • 2005
  • For th aim of lightweight microwave absorbers, conductive and magnetic microspheres are fabricated by plating of Co films on hollow ceramic microspheres of low density. Metal plating was carried out in a two-step electroless plating process (pre-treatment of activation and plating). Uniform coating of the film with about $2{\~}3{\cal}um$ thickness was identified by SEM. High-frequency magnetic and microwave absorbing properties were determined in the rubber composites containing the Co-coated microspheres. Due to conductive and ferromagnetic behavior of the Co thin films, high dielectric constant and magnetic loss can be obtained in the microwave frequencies. Due to those electromagnetic properties, high absorption rate (25 dB) and thin matching thickness ($2.0{\~}2.5{\cal}mm$) are predicted in the composite layers containing the metal-coated microspheres of low density (about 0.84 g/cc) for the electromagnetic radiation in microwave frequencies.

Surface reaction of $HfO_2$ etched in inductively coupled $BCl_3$ plasma ($BCl_3$ 유도결합 플라즈마를 이용하여 식각된 $HfO_2$ 박막의 표면 반응 연구)

  • Kim, Dong-Pyo;Um, Doo-Seunng;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.477-477
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    • 2008
  • For more than three decades, the gate dielectrics in CMOS devices are $SiO_2$ because of its blocking properties of current in insulated gate FET channels. As the dimensions of feature size have been scaled down (width and the thickness is reduced down to 50 urn and 2 urn or less), gate leakage current is increased and reliability of $SiO_2$ is reduced. Many metal oxides such as $TiO_2$, $Ta_2O_4$, $SrTiO_3$, $Al_2O_3$, $HfO_2$ and $ZrO_2$ have been challenged for memory devices. These materials posses relatively high dielectric constant, but $HfO_2$ and $Al_2O_3$ did not provide sufficient advantages over $SiO_2$ or $Si_3N_4$ because of reaction with Si substrate. Recently, $HfO_2$ have been attracted attention because Hf forms the most stable oxide with the highest heat of formation. In addition, Hf can reduce the native oxide layer by creating $HfO_2$. However, new gate oxide candidates must satisfy a standard CMOS process. In order to fabricate high density memories with small feature size, the plasma etch process should be developed by well understanding and optimizing plasma behaviors. Therefore, it is necessary that the etch behavior of $HfO_2$ and plasma parameters are systematically investigated as functions of process parameters including gas mixing ratio, rf power, pressure and temperature to determine the mechanism of plasma induced damage. However, there is few studies on the the etch mechanism and the surface reactions in $BCl_3$ based plasma to etch $HfO_2$ thin films. In this work, the samples of $HfO_2$ were prepared on Si wafer with using atomic layer deposition. In our previous work, the maximum etch rate of $BCl_3$/Ar were obtained 20% $BCl_3$/ 80% Ar. Over 20% $BCl_3$ addition, the etch rate of $HfO_2$ decreased. The etching rate of $HfO_2$ and selectivity of $HfO_2$ to Si were investigated with using in inductively coupled plasma etching system (ICP) and $BCl_3/Cl_2$/Ar plasma. The change of volume densities of radical and atoms were monitored with using optical emission spectroscopy analysis (OES). The variations of components of etched surfaces for $HfO_2$ was investigated with using x-ray photo electron spectroscopy (XPS). In order to investigate the accumulation of etch by products during etch process, the exposed surface of $HfO_2$ in $BCl_3/Cl_2$/Ar plasma was compared with surface of as-doped $HfO_2$ and all the surfaces of samples were examined with field emission scanning electron microscopy and atomic force microscope (AFM).

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Development of Compact and Lightweight Broadband Power Amplifier with HMIC Technology (HMIC 기술을 적용한 소형화 경량화 광대역 전력증폭기 개발)

  • Byun, Kisik;Choi, Jin-Young;Park, Jae Woo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.11
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    • pp.695-700
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    • 2018
  • This paper presents the development of compact and lightweight broadband power amplifier module using HMIC (Hybrid Microwave Integrated Circuit) technology that could be high-density integration for many non-packaged microwave components into the small area of a high dielectric constant printed circuit board, such as a ceramic substrate, also using the special design and fabrication schemes for the structure of minimized electromagnetic interference to obtain the homogeneous electrical performance at the wideband frequency. The results confirmed that the small signal gain has a gain flatness of ${\pm}1.5dB$ within the range of 32 to 36 dB. In addition, the output power satisfied more than 30 dBm. The noise figure was measured within 7 dB, and OIP3 (Output Third Order Intercept Point) was more than 39 dBm. The fabricated broadband power amplifier satisfied the target specification required to electrically drive the high power amplifiers of jamming generators for electronic warfare, so the actual applicability to the system was verified. Future studies will be aimed at designing other similar microwave power amplifiers in the future.

“Aluminium Nitride Technology-a review of problems and potential"

  • Dryburgh, Peter M.
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1996.06a
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    • pp.75-87
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    • 1996
  • This review is presented under the following headings: 1.Introduction 1.1 Brief review of the properties of AlN 1.2 Historical survey of work on ceramic and single crystal AlN 2.Thermochemical background 3.Crystal growth 4.Doping 5.Potential applications and future work The known properties of AlN which make it of interest for various are discussed briefly. The properties include chemical stability, crystal structure and lattice constants, refractive indices and other optical properties, dielectric constant, surface acoustic wave velocity and thermal conductivity. The history of work in single crystals, thin films and ceramics are outlined and the thermochemistry of AlN reviewed together with some of the relevant properties of aluminium and nitrogen; the problems encountered in growing crystals of AlN are shown to arise directly from these thermochemical relationships. Methods have been reported in the literature for growing AlN crystals from melts, solution and vapour and these methods are compared critically. It is proposed that the only practicable approach to the growth of AlN is by vapour phase methods. All vapour based procedures share the share the same problems: $.$the difficulty of preventing contamination by oxygen & carbon $.$the high bond energy of molecular nitrogen $.$the refractory nature of AlN (melting point~3073K at 100ats.) $.$the high reactivity of Al at high temperatures It is shown that the growth of epitactic layers and polycrystalline layers present additional problems: $.$chemical incompatibility of substrates $.$crystallographic mismatch of substrates $.$thermal mismatch of substrates The result of all these problems is that there is no good substrate material for the growth of AlN layers. Organometallic precursors which contain an Al-N bond have been used recently to deposit AlN layers but organometallic precursors gave the disadvantage of giving significant carbon contamination. Organometallic precursors which contain an Al-N bound have been used recently to deposit AlN layers but organometallic precursors have the disadvantage of giving significant carbon contamination. It is conclude that progress in the application of AlN to optical and electronic devices will be made only if considerable effort is devoted to the growth of larges, pure (and particularly, oxygen-free) crystals. Progress in applications of epi-layers and ceramic AlN would almost certainly be assisted also by the availability of more reliable data on the pure material. The essential features of any stategy for the growth of AlN from the vapour are outlined and discussed.

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