• 비파괴검사학회지
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• 제13권3호
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• pp.31-38
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• 1993

포항가속기 저장링 진공챔버는 진공도가 $10^{-10}Torr$로 유지될 수 있도록 설계되었고, 초고진공에 적합하도록 TIG용접을 하여 헬륨에 대한 누설률이 $1{\times}10^{-10}Torr{\cdot}{\ell}/sec$ 이하의 기밀성이 요구되고 있다. 저장링 진공챔버에 적용된 TIG용접방법과 결함에 대해 논하고 누설검사에 사용된 헬륨누설검사기의 원리 및 검사방법에 대해서 보고하고자 한다.

• 한국유체기계학회 논문집
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• 제19권4호
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• pp.39-42
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• 2016

A PFA lined ball valve, which is machined with fluorinated resin PFA to its inner part for improving corrosion resistance, non-stickness, heat-resistance, has been widely used to the chemical/pharmaceutical industries, the semiconductor/LCD manufacturing processes, etc. with the high purity chemicals as working fluid. EPA stated that 60% of all fugitive emissions come from the valve stem packing in a typical petroleum or chemical processing plant. They monitor regulated components for leaks and maintain seal performance at acceptable levels. Korean industrial standards only deals with the bubble test for in-line leakage of valves, which has the detectable leak rate of $10^{-4}$ [$mbar{\cdot}L{\cdot}s^{-1}$], therefore, it is not sufficient to check fugitive emissions. In this study, we conducted Helium leak detection from a PFA lined ball valve and evaluated fugitive emissions according to ISO 15848-1, which has the detectable leak rate of $10^{-9}$ [$mbar{\cdot}L{\cdot}s^{-1}$], for manufacturing the high-reliable PFA lined ball valves against fugitive emissions.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1464-1465
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• 2008

In this paper, we compared the mechanical characteristics between LTCC-based RF MEMS packaging structures fabricated using two different types of bonding materials; BCB and gold-tin. The BCB-based packages showed an average shear strength of 32.1 MPa and helium leak rate of $1.76{\times}10^{-8}atm{\cdot}cc/sec$ for a cavity volume of $0.45\times10^{-3}cc$, while the packages bonded by gold-tin layer (80 wt.% gold, 20 wt.% tin) showed an average shear strength of 42.70 MPa and helium leak rate $1.38{\times}10^{-8}atm{\cdot}cc/sec$ for a cavity volume of $1.21{\times}10^{-3}cc$.

• 한국초전도ㆍ저온공학회논문지
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• 제2권1호
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• pp.7-13
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• 2000

A rotating cryogenic system was designed similar to the cooling system for the rotor of a superconducting generator. The experimental rotor has an inner vessel which simulates the winding space of an actual superconducting rotor, and a torque tube of comparable design. This paper describes the evaluation of the total heat leak into the inner vessel that leads to the study of the heat transfer characteristic of the rotating cryogenic system. To examine the insulation performance of the experimental rotor. temperature was measured at each part of the system at various rotaing speeds from 0 rpm to 600 rpm. Total heat leak into the inner vessel was calculated by measuring the boil-off rate of liquid helium. Conduction heat leak to the inner vessel was obtained by the vent tube, and radiation heat leak was calculated by subtracting the conduction heat lent from the total heat leak. There seemed to be no rotaional dependency of total heat leak at least up 600 rpm.

• 한국진공학회지
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• 제16권2호
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• pp.153-159
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• 2007

KSTAR 장치의 저온 component에 헬륨을 공급하기 위한 헬륨라인은 크게 두 가지로 이루어져 있다. 냉동기에서 KSTAR 저온용기 외부까지의 트랜스퍼 라인과, 저온용기 내부의 헬륨라인이다. KSTAR 장치는 3가지 종류의 헬륨을 사용하여 각 저온 component를 냉각하는데, 초전도 자석 시스템과 버스라인에는 초임계 헬륨, 전류인입장치에는 액체 헬륨, 열차폐체에는 가스 헬륨을 공급한다. 저온용기 내부의 헬륨라인은 냉동기에서 저온용기 근처까지 연결된 배관을 저온용기 내부의 각 장치에 최단거리로 열손실 없이 설치하여 각 장치가 정상 작동하도록 하는데 그 목적이 있다. 저온용기 내부의 헬륨라인은 최대 20bar로 가압되는 운전시간 동안에 헬륨누설 없이 설치되어야 한다. 그리고 상온으로 부터의 복사열을 차단하기 위하여 다층절연제로 배관을 감싸주어야 하고 고전압 부분은 프리프레그 테잎으로 절연되어야 한다. 전기절연체는 세라믹과 스테인레스 스틸 튜브를 브레이징 접합 방법으로 연결하여 만들어진 것으론 배관과 배관, 배관과 저온 component간의 절연을 위해 사용되고, 헬륨라인과 동일하게 4.5K 초임계 헬륨온도에서 누설이 없어야 한다. 따라서 모든 전기절연체는 액체질소에 침전시켜 열충격을 가하고, 내부에 30 bar를 가압하여 진공 누설시험을 한다. 그리고 초전도 자석과 배관의 절연체로 사용되므로 15kV 고전압 절연 검사를 한다. 전기절연체의 세라믹 부분은 구조적 보강을 위하여 추가적으로 표면에 절연 작업을 한다. 현재 대부분의 저온용기 내부의 헬륨 라인은 설치 완료되어 있으며, 최종 검사가 진행 중이다.

• Journal of Radiation Protection and Research
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• 제28권4호
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• pp.291-298
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• 2003

The KN-12 transport cask has been designed to transport 12 PWR spent nuclear fuel assemblies and to comply with the regulatory requirements for a Type B(U) package. The containment boundary of the cask is defined by a cask body, a cask lid, lid bolts with nuts, O-ring seals and a bolted closure lid. The containment vessel for the cask consists of a forged thick-walled carbon steel cylindrical body with an integrally-welded carbon steel bottom and is closed by a lid made of stainless steel, which is fastened to the cask body by lid bolts with nuts and sealed by double elastomer O-rings. In the cask lid an opening is closed by a plug with an O-ring seal and covered by the bolted closure lid sealed with an O-ring. The cask must maintain a radioactivity release rate of not more than the regulatory limit for normal transport conditions and for hypothetical accident conditions, as required by the related regulations. The containment requirements of the cask are satisfied by maintaining a maximum air reference leak rate of $2.7{\times}10^{-4}ref.cm^3s^{-1}$ or a helium leak rate of $3.3{\times}10^{-4}cm^3s^{-1}$ for normal transport conditions and for hypothetical accident conditions.

• 한국초전도ㆍ저온공학회논문지
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• 제8권1호
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• pp.59-64
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• 2006

A closed-loop cryogenic cooling system for high field magnets is presented. This design is motivated by our recent development of cooling system for 21 tesla Fourier Transform ion Cyclotron Resonance (FT-ICR) superconducting magnets without any replenishment of cryogen. The low temperature superconducting magnets are immersed in a subcooled 1.8 K bath, which is connected hydraulically to the 4.2 K reservoir through a narrow channel. Saturated liquid helium is cooled by Joule-Thomson heat exchanger and flows through the JT valve, isenthalpically dropping its pressure to approximately 1 6 kPa, corresponding saturation temperature of 1.8 K. Helium gas exhausted from pump is now recondensed by two-stage cryocooler located after vapor purify system. The amount of cryogenic Heat loads and required mass flow rate through closed-loop are estimated by a relevant heat transfer analysis, from which dimensions of JT heat exchanger and He II heat exchanger are determined. The detailed design of cryocooler heat exchanger for helium recondensing is performed. The effect of cryogenic loads, especially superfluid heat leak through the gap of weight load relief valve, on the dimensions of cryogenic system is also investigated.

• 반도체디스플레이기술학회지
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• 제3권3호
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• pp.5-9
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• 2004

A new wafer level packaging scheme is presented as an alternative to MEMS package. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the idea for MEMS wafer level packaging. The scheme of this work is developed using an electroplated tin (Sn) solder. The critical difference over conventional ones is that wafers are laterally bonded by solder reflow after LEGO-like assembly. This lateral bonding scheme has merits basically in morphological insensitivity and its better bonding strength over conventional ones and also enables not only the hermetic sealing but also its electrical interconnection solving an open-circuit problem by notching through via-hole. The bonding strength of the lateral bonding is over 30 Mpa as evaluated under shear and the hermeticity of the encapsulation is 2.0$\times10^{-9}$mbar.$l$/sec as examined by pressurized Helium leak rate. Results show that the new scheme is feasible and could be an alternative method for high yield wafer level packaging.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.29-36
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• 2008

본 연구에서는 MEMS 소자의 직접화 및 소형화에 필수적인 through-wafer via interconnect의 신뢰성 문제를 연구하였다. 이를 위하여 Au-Sn eutectic 접합 기술을 이용하여 밀봉(hermetic) 접합을 한 웨이퍼 레벨 MEMS 패키지 소자를 개발하였으며, 전기도금법을 이용하여 수직 through-hole via 내부를 구리로 충전함으로써 전기적 연결을 시도하였다. 제작된 MEMS 패키지의 크기는 $1mm{\times}1mm{\times}700{\mu}m$이었다. 제작된 MEMS패키지의 신뢰성 수행 결과 비아 홀(via hole)주변의 크랙 발생으로 패키지의 파손이 발생하였다. 구리 through-via의 기계적 신뢰성에 영향을 줄 수 있는 여러 인자들에 대해서 수치적 해석 및 실험적인 연구를 수행하였다. 분석 결과 via hole의 크랙을 발생시킬 수 있는 파괴 인자로서 열팽창 계수의 차이, 비아 홀의 형상, 구리 확산 현상 등이 있었다. 궁극적으로 구리 확산을 방지하고, 전기도금 공정의 접합력을 향상시킬 수 있는 새로운 공정 방식을 적용함으로써 비아 홀 크랙으로 인한 패키지의 파괴를 개선할 수 있었다.

• 센서학회지
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• 제15권1호
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.