• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.2
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• pp.128-135
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• 2004

Generally, heavy electronic products undergo many different types of shocks in transportation from a manufacturer to customers. Cushioning package is used to protect electronic products from severe shock environments. Since the mass distribution of heavy electronic products is usually unbalanced and complex. it is very difficult to design a cushioning package with having high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning package for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning package for a large refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study the optimal shape of cushioning package, which has high cushioning performance and minimized volume, was obtained through the mechanical drop analysis and a optimization process. Through free drop tests of refrigerators, it was identified that the cushioning performance of the cushioning package was improved up by 25% and the its own volume was reduced by 22 ％.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.11a
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• pp.677-683
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• 2003

Generally, heavy electronic products undergo many different types of shocks in transporting from a manufacturer to customers. Cushioning package materials are used to protect electronic products from severe shock environments. Since the mass distributions of heavy electronic products are usually unbalanced and complex, it is very difficult to design a cushioning package with haying high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning material for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning material for a large-sized refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study, the optimal shape of cushioning material, which has high cushioning performance and minimized volume, was obtained from the drop analysis and a optimization process. From free drop tests of a refrigerator, it was identified that the cushioning performance of the optimal package were improved up to 16 % and the volume of it was reduced in a range of 22 %.

• Proceedings of the KIEE Conference
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• 2000.11a
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• pp.76-78
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• 2000

The previous MCC's have the demerits of high cost and much manhour for rework because they are impossible for the standardization of products and have many manual connections. The customers require the products which can operate in connection with SCADA system by digitalizing the functions of the current MCC's and are systematized with capability of remote control. To solve these disadvantages and requirements, we developed the Electronic Motor Control System according to starting type for applying to fields based on this. This system has the various functions such as protection, measurement, and communication. Using these functions, it can monitor motor status through communication with the upper system and define the circuit for lower connection cost according to starting type and shorter manufacture period by program. The development of this product results in establishment of competitive structure with domestic competition and perfect automatic monitoring through linkage with SCADA system. In addition, it provides the comparable dominancy of receiving on orders in switch gear and adaptability to change of MCC market in Japan and Europe.

• Journal of Environmental Analysis, Health and Toxicology
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• v.21 no.4
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• pp.209-219
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• 2018

In the areas of RoHS, WEEE, ELV and REACH, reinforcement of environmental regulations against harmful substances is a global trend not only in EC but also in all over the world. In the fields of Korea's major export products such as material parts, electrical and electronic products and automobile parts, we are responding to these regulations consistently. To develop reference material for analyzing lead and cadmium in paints, the candidate materials were produced through the screening process which separated shapes and sizes. To secure the traceability of the candidate materials produced, the characteristics and uncertainties are estimated by ICP-AES analysis using the primary reference material. The short-term and long-term stabilities also are evaluated in parallel. In order to calculate the final certification value of the candidate material, the verification were carried out by the performance evaluation through the comparison among the KOLAS (Korea Laboratory Accreditation Scheme) laboratories, and the CRM was produced in accordance with ISO Guide 35. The certified values and uncertainties of Pb and Cd of the final paint standard, determined according to the joint analysis among laboratories, are Pb [($191.4{\pm}3.1$) mg/kg, ($944.1{\pm}5.6$) mg/kg] and Cd [($45.0{\pm}2.6$) mg/kg, ($225.5{\pm}3.5$) mg/kg]. These standard materials were developed to enhance the reliability of measurement analysis, including the validity and traceability of measurement results. Also it is expected that the CRM will be used as QCM (quality control material) for the product design and the process monitoring, so that regulation and management of hazardous heavy metals can be systematically implemented.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.595-597
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• 2000

Poymeric insulators using in an heavy contamination area are easily attached to contaminants such as salt and by-products of industrial processes. To understand its effect on contaminants adhered to these insulators, we manufactured slurry mixed by some kaolin and salt as artificial contaminated solution. And then put samples in its slurry, for about one minute. And these samples are dried in natural condition for 6 days. We measured the degree of contaminant, AC leakage current for these contaminated samples.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.738-742
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• 2005

Rapid Prototype has been used to design and Production of part in a variety of fields ; Car, Electronic products, Aviation, Heavy industry etc. Moreover development of hardware gave rise to use the method of Rapid Prototype more and more at high precision and complicated shapes. Expecially, to be using process of products that shapes of Micro-hole ; Cellular phones, Antennas, Jewels, Semi conductor cases. In case of Micro-shape, precision of the shape turns on various condition ; Laser size, Laminate height, scanning speed, overcure, viscosity of resin, etc. Sometimes breaks out the case that interner hole of shape is blocked by viscosity of resin. The phenomenon has solved easily to reduce viscosity of resin. But, in case of the method brings about the problem that strength goes down in actuality products hardening. This study on verify to change of shape of Micro-hole and makes the semiconductor case which has shape of Micro-hole by using resin of higher viscosity, scanning speed and overcure

• Journal of Korean Academy of Nursing
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• v.53 no.2
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• pp.155-166
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• 2023

Purpose: Although heated tobacco product (HTP) use among adolescents is an emerging public health problem, little is known about the frequency and quantity of HTP use. Thus, we investigated the associations between the frequency and quantity of HTP use and smoking characteristics (i.e., combustible cigarette [CC] and electronic cigarette [EC] use, and attempts to quit smoking) among CC-smoking adolescents. Methods: We analyzed nationally representative data from 2,470 Korean adolescents who were current CC smokers. To investigate our aim, we conducted multinomial logistic and logistic regression analyses. Results: We found that daily and heavier CC users had greater likelihoods of more frequent and heavier HTP use. In addition, dual users of CCs and ECs were more likely to use HTPs more frequently and heavily than CC users who did not use ECs. Moreover, daily EC users had the highest risk of frequent and heavy HTP use. The frequency and quantity of HTP use were not associated with attempts to quit smoking. Compared to CC-only use, dual use of CCs and HTPs was not associated with quitting attempts, and triple use of CCs, ECs, and HTPs was associated with a lower likelihood of quitting attempts. Conclusion: HTP use was less likely to displace CC use and promote attempts to quit smoking. Thus, strict regulations are required to prevent the promotion of HTPs as a substitute for CCs or as a means of quitting smoking. Additionally, health professionals should consider preventive interventions for HTP, as well as CC and EC use among adolescents.

• Journal of Korea Foundry Society
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• v.44 no.4
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• pp.97-102
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• 2024

In this study, the properties of Zr-14Cu-7.5Ni-2.6Al wide ribbon with amorphous structure and properties were analyzed using Hall effect, SEM-EDX, and XRD. Made by melt spinning method, this Zr-14Cu-7.5Ni-2.6Al based alloy ribbon is not more than 96 ㎛ thick and 100 mm wide. This amorphous alloy exhibited tensile strength of 1,641 MPa, yield strength of 1,541 MPa, elongation of 1% and elastic modulus of 98GPa. The bulk concentration, resistivity, and mobility values are midway between general heavy doping ceramics and metals, and they are about 100 times weaker than ordinary metals, so they are close to Si and have good electrical conductivity. In addition, folding tests were conducted at extreme temperatures, withstanding 150,000 times at -20℃, 300,000 times at 24℃, and 150,000 times at 60℃, with no folding defects observed. These results demonstrate the excellent durability and reliability of the Zr-14Cu-7.5Ni-2.6Al wide ribbon alloy and suggest the possibility of developing electronic products using this alloy.

• The Magazine of the IEIE
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• v.35 no.7
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• pp.57-71
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• 2008

The last decade has witnessed great improvements in power semiconductor devices thanks to the advanced design and process, which have made it possible to significantly improve the electrical performances of electronic systems while simultaneously reducing their site, weight and perhaps most importantly reducing their cost. Among the power semiconductor devices, IGBT will be a key semiconductor component for power industry since it has a huge potential to cover large areas of power electronics from small home appliances to heavy industries. Currently, only a few limited power semiconductor manufacturers supply most of the industrial consumptions of power IGBT and its modules. Therefore, a large portion of technology in the power industry is dependent on other advanced countries. In this regard, to independently build power IGBT devices and the relevant power module technology, Korean government initiated a new 5-year project 'Power IT,' which also aimed at booming the business of the power semiconductor and the allied industries. With the success of this power IT project, it is expected that the power semiconductor technology will be a basis to foster the high power semiconductor industry and moreover, there will be more innovative developments in the Korea region and globally Also, forming the channel between the customers and suppliers, it is possible to effectively develop the customized power products, which could strengthen the competitiveness of Korean power industry. Furthermore, the power industry including semiconductor manufacturers will be technologically self-supporting and be able to obtain good business opportunities, and eventually increase the share in the growing power semiconductor market, which could be positioned as a major industry in Korea.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.9
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• pp.166-171
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• 2002

The objective of this paper is to investigate the effect of clearance and the configuration of die system on burr formation by FEM analysis and experimental tests. Compared with casting, forging and machining, shearing has been known, especially in heavy or mass-production industries, as a very economical and fast way to obtain the desired shape Recently, the shearing process becomes widely used in the small and light electronic component manufacturing industries. When shearing a part of sheet metal, the burr formed on the cutting edge is usually unavoidable. The burr would not only degrade the precision of products but also causes additional cost for the deburring process. In this paper, the influence of shearing parameters such as clearance and configurations of the lower pad (ejector) on burr formation is investigated by using the experimental and numerical approach. From the experimental results, it has been shown that the more narrow clearance gives the smaller burr height and the higher shearing forces. The removal of lower holder also makes the sheared surface integrity and the dimensional accuracy become worse. The FEM results (using DEFORM-2D) show good agreement with the experimental results.