Thermal Design and Experimental Test of a High-Performance Hot Chuck for a Ultra Precision Flip-Chip Bonder (초정밀 플립칩 접합기용 고성능 가열기의 열적 설계 및 시험)
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- Transactions of the Korean Society of Mechanical Engineers B
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- v.30 no.10 s.253
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- pp.957-965
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- 2006