• Journal of the Korean Society of Safety
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• v.36 no.4
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• pp.12-19
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• 2021

This paper presents a safety assessment method for FTA-based induction heating systems; the failures and causes of electrical fire are first analyzed for each part and module qualitatively, and methods to manage high probabilities of failure and electrical fire are considered, thereby improving the reliability of the induction heating system. The cumulative importance value (ACC) of the minimal cut set is drawn by setting failure as the top event, and STACK and SMPS are observed to account for about 70% of the induction heating system failures. Thus, intensively managing the basic events contained in the minimal cut set of failures for STACK and SMPS is expected to provide effective and stable operation of the induction heating system. When electrical fire is set as the top event, the STACK percentage is 90%. Accordingly, the current IGBT is changed to a FET to increase the applied voltage and prevent induction heating system failure, and a heat sink plane is installed to prevent FET heating caused by switching, thereby preventing an electrical fire. By classifying the parts and modules of the induction heating system in detail and by applying FTA based on actual failure rates and relevant data, more practical and reasonable results may be expected. Hence, continuous research must be conducted to ensure safety when using induction heating systems.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.6
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• pp.233-239
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• 2021

In this study, Ga₂O₃/diamond layers were grown on Si substrates to improve the thermal characteristics of Ga₂O₃ materials. Firstly, diamond thin film was grown on Si substrates by hot-filament chemical vapor deposition. Afterward, Ga₂O₃ layer was grown in the growth temperature range of from 450~600℃ by mist chemical vapor deposition. We found that layer separation happens at the Ga₂O₃/diamond interface at the growth temperature of 500℃. This is attributed to the different thermal expansion coefficient of the mixture of amorphous and crystalline structures during cooling process. Therefore, this study might contribute to the heat-sink-layer bonded power semiconductor applications by stabilizing the thermal properties at Ga₂O₃/diamond interface.

• Nuclear Engineering and Technology
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• v.55 no.9
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• pp.3409-3416
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• 2023

Licensing the next-generation of nuclear reactor designs requires extensive use of Modeling and Simulation (M&S) to investigate system response to many operational conditions, identify possible accidental scenarios and predict their evolution to undesirable consequences that are to be prevented or mitigated via the deployment of adequate safety barriers. Deep Learning (DL) and Artificial Intelligence (AI) can support M&S computationally by providing surrogates of the complex multi-physics high-fidelity models used for design. However, DL and AI are, generally, low-fidelity 'black-box' models that do not assure any structure based on physical laws and constraints, and may, thus, lack interpretability and accuracy of the results. This poses limitations on their credibility and doubts about their adoption for the safety assessment and licensing of novel reactor designs. In this regard, Physics Informed Neural Networks (PINNs) are receiving growing attention for their ability to integrate fundamental physics laws and domain knowledge in the neural networks, thus assuring credible generalization capabilities and credible predictions. This paper presents the use of PINNs as surrogate models for accidental scenarios simulation in Nuclear Power Plants (NPPs). A case study of a Loss of Heat Sink (LOHS) accidental scenario in a Nuclear Battery (NB), a unique class of transportable, plug-and-play microreactors, is considered. A PINN is developed and compared with a Deep Neural Network (DNN). The results show the advantages of PINNs in providing accurate solutions, avoiding overfitting, underfitting and intrinsically ensuring physics-consistent results.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.2
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• pp.213-218
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• 2010

A cooling system utilizing liquid helium to chill the cryopanel (800 mm $\times$ 700 mm dimensions) down to 4.2 K was designed, implemented, and tested to verify the role of the cryopanel as a heat sink for the payload of a spacecraft inside the large thermal vacuum chamber (effective dimensions : 8 m ($\Phi$) $\times$ 10 m (L)) of KARI (Korea Aerospace Research Institute). Two LHe (Liquid Helium) Dewars, one for the main supply and the other for refilling, were used to supply liquid helium or cold helium gas into this cryopanel, and flow control for the target temperature of the cryopanel within requirements was done through fine adjustment of the pressure inside the LHe Dewars. The return helium gas from the cryopanel was reused as a thermal barrier to minimize the heat influx on the core liquid helium supply pipe. The test verified a cooling time of around three hours from the ambient temperature to 40 K (combined standard uncertainty of 194 mK), the capacity for maintaining the cryopanel at intermediate temperatures, and a 1 K uniformity over the entire cryopanel surface at around 40 K with 20 W cooling power.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.65-70
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• 2015

A study on thermal properties for a single-layer metal and two-layer composites was investigated for the heat-sink application. For the single-layer metal, an aluminum alloy (Al6061) was selected. A screen printed aluminum nitride (AlN) layer on the Al6061 substrate was chosen for the two-layer composites. The thermal conductivity of the sample was determined from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared to calculated values using the data from the references. The thermal conductivity of composites with screen printed AlN layer on the Al6061 substrate decreased linearly with increasing the thickness of AlN layer. Measured values of the thermal conductivity for composites with $53{\mu}m$ and $163{\mu}m$ thick AlN layers were $114.1W/m{\cdot}K$ and $72.3W/m{\cdot}K$, respectively. In particular, the thermal conductivity of the screen-printed AlN layer was demonstrated by appling the rule of mixture in view point of thermal resistivity. Measured values of the thermal conductivity for AlN layers with the thickness of $53{\mu}m$ and $163{\mu}m$ showed $9.35W/m{\cdot}K$ and $12.40W/m{\cdot}K$, respectively.

• Korean Journal of Agricultural and Forest Meteorology
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• v.7 no.1
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• pp.45-50
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• 2005

This study was conducted to measure and understand the exchange of CO₂ and water in a rice canopy. Eddy covariance system was installed on a 10m tower along with other meteorological instruments. CO₂ flux and surface energy balance were measured throughout the whole growing season in 2003 over a typical paddy field in Icheon, Korea. During the early growth stage in May and June, most of net radiation was partitioned to latent heat flux with daytime Bowen ratio of 0.3 to 0.7. Evapotranspiration (i.e., daily integrated latent heat flux) typically ranged from 3 to 4 mm d/sup -1/, with even higher rates on sunny days. Daily integrated net ecosystem exchange (NEE) of CO₂ increased with increasing solar radiation and leaf area index (LAI). The NEE was especially high during the stages of young panicle formation and heading. On 1 June 2003, when the rice field was flooded, it was a weak sink of atmospheric CO₂ with an uptake rate of 9.1 gm/sup -2/d/sup -1/. Despite frequent rainy and cloudy conditions in summer, maximum NEE of 36.2 gm/sup -2/d/sup -1/ occurred on 31 July prior to heading stage. As rice crop senesced after early September, the NEE decreased.

• Korean Journal of Agricultural and Forest Meteorology
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• v.21 no.3
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• pp.135-145
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• 2019

Analysis of a long cycle or a trend of time series data based on a long-term observation would require comparability between data observed in the past and the present. In the present study, we proposed an approach to ensure the compatibility among the instruments used for the long-term observation, which would allow to secure continuity of the data. An open-path gas analyzer (Model LI-7500, LI-COR, Inc., USA) has been used for eddy covariance flux measurement in the Gwangneung deciduous forest for more than 10 years. The open-path gas analyzer was replaced by an enclosed-path gas analyzer (Model EC155, Campbell Scientific, Inc., USA) in July 2015. Before completely replacing the gas analyzer, the carbon dioxide ($CO_2$) and latent heat fluxes were collected using both gas analyzers simultaneously during a five-month period from August to December in 2015. It was found that the $CO_2$ fluxes were not significantly different between the gas analyzers under the condition that the daily mean temperature was higher than $0^{\circ}C$. However, the $CO_2$ flux measured by the open-path gas analyzer was negatively biased (from positive sign, i.e., carbon source, to 0 or negative sign, i.e., carbon neutral or sink) due to the instrument surface heating under the condition that the daily mean temperature was lower than $0^{\circ}C$. Despite applying the frequency response correction associated with tube attenuation of water vapor, the latent heat flux measured by the enclosed-path gas analyzer was on average 9% smaller than that measured by the open-path gas analyzer, which resulted in >20% difference of the sums over the study period. These results indicated that application of the additional air density correction would be needed due to the instrument heat and analysis of the long-term observational flux data would be facilitated by understanding the underestimation tendency of latent heat flux measurements by an enclosed-path gas analyzer.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.46-54
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• 1998

A planar Bi-Sb multijunction thermal converter, which is consisted of a linear or bifilar thin film NiCr-heater and a thin film Bi-Sb thermopile, has been fabricated, and its ac-dc transfer characteristics were examined in a frequency range from 10 Hz to 10 KHz. In order to increase the thermal sensitivity and to decrease the ac-dc transfer error of a thermal converter, the heater and the hot junctions of a thermopile were prepared on a Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$-diaphragm which acts as a thermal isolation layer, and the cold junctions on the Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$-thin film supported with the silicon rim which functions as a heat sink. The respective thermal sensitivities in air and in a vacuum of the converter with a built-in bifilar heater were about 14.0 ㎷/㎽ and 54.0 ㎷/㎽, and the ac-dc voltage and the current transfer difference ranges in air were about $\pm$0.60 ppm and $\pm$0.11 ppm, respectively, indicating that the ac-dc transfer accuracy of the converter are much higher than that of a commercial 3-dimensional multijunction thermal converter. However, the output thermoelectric voltage fluctuation of the converter was rather high.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.5-12
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• 2000

Uncooled metallic thin-film thermopile infrared detectors have been fabricated, and the figures of merit for the detectors were examined. The hot junctions of a thermopile were prepared on a $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$-membrane which acts as a thermal isolation layer, the cold junctions on the membrane supported with the silicon rim which functions as a heat sink, and Au-black was used as an infrared absorber. Infrared absorbance of Au-black, which strongly depends on the chamber pressure during Au-evaporation and its mass per area, was found to be about 90 ％ in the wavelength range from 3${\mu}{\textrm}{m}$ to 14${\mu}{\textrm}{m}$. Voltage responsivity, noise equivalent power, and specific detectivity of Bi-Sb thermopile infrared detector at 5 Hz-chopping frequency were about 10.5V/W, 2.3 nW/Hz$^{1/2}$, 및 $1.9\times10^{7}$ cm.Hz$^{1/2}$/w at room temperature in air, respectively.

• Journal of the Korea Society of Computer and Information
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• v.16 no.9
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• pp.1-10
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• 2011

Unfortunately, in current microprocessors, increasing the frequency causes increased power consumption and reduced reliability whereas it improves the performance. To overcome the power and thermal problems in the singlecore processors, multicore processors has been widely used. For 2D multicore processors, interconnection is regarded as one of the major constraints in performance and power efficiency. To reduce the performance degradation and the power consumption in 2D multicore processors, 3D integrated design technique has been studied by many researchers. Compared to 2D multicore processors, 3D multicore processors get the benefits of performance improvement and reduced power consumption by reducing the wire length significantly. However, 3D multicore processors have serious thermal problems due to high power density, resulting in reliability degradation. Detailed thermal analysis for multicore processors can be useful in designing thermal-aware processors. In this paper, we analyze the impact of workload distribution, distance to the heat sink, and number of stacked dies on the processor temperature. We also analyze the effects of the temperature on overall system performance. Especially, this paper presents the guideline for thermal-aware multicore processor design by analyzing the thermal problems in 2D multicore processors and 3D multicore processors.