• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.91-96
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• 2017

One of the most critical aspects of the modern semiconductor industry is the quality of wafer surface, the roughness of which is mostly caused by the ingot slicing. And the grinding is supposed to be the main process to reduce the surface roughness. The vibrations of the disc surface grinder are the major problem to effectively achieve the required surface quality. In this study, the structure of a disc surface grinder was analyzed through the experiment and the computer simulation to investigate the dynamic characteristics of the machine, and further to alter the design for the improved stability. The result of the study shows that simple design alterations without alternating main body can effectively suppress the vibrations of the machine.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.6-9
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• 2005

In this study, the ultra precision centerless grinder for ferrule grinding was designed. As the good-qualified ferrule is required a precise and fine grinding, grinding machine for ferrule must have a high accuracy and a sufficient stiffness. The centerless grinder is composed of the high damping concrete bed, grinding wheel spindle unit, regulating wheel spindle unit, feeding table and dressing unit. For a newly developed centerless grinder, hydrostatic system with high precision feeding and high stiffness was proposed. The grinding and regulating wheel spindle units were composed of hydrostatic spindle and feeding table was hydrostatic table. The prototype of hydrostatic table was manufactured and tested.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.557-558
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• 2006

In this study, the ultra precision centerless grinder for ferrule grinding was designed. As the good-qualified ferrule is required a precise and fine grinding, grinding machine for ferrule must have a high accuracy and a sufficient stiffness. The centerless grinder is composed of the high damping concrete bed, grinding wheel spindle unit, regulating wheel spindle unit, feeding table and dressing unit. For a newly developed centerless grinder, hydrostatic system with high precision feeding and high stiffness was proposed.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.

• Journal of the Semiconductor & Display Technology
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• v.15 no.1
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• pp.56-64
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• 2016

It is generally accepted that the surface quality of wafer edge is mostly damaged by the vibrations of the edge grinding machine. The surface quality of wafer edge is supposed to be the most dominant factor of the cracks, scratches, burrs and chips on the edge surfaces, which are the main defects of the wafers. In this study, the structure of a wafer edge grinder has been investigated through the frequency response experiment and the computer simulation to find ways to suppress the vibrations from the structure. The main reasons of the structural vibrations were analyzed. And further the design alterations were deduced from the results of the experiment and the simulation, and applied to the machine to check the effects of those alterations and to eventually improve the structural stability. The result shows that the machine can have much improved stability with relatively simple design changes.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.40-45
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• 2003

Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1-5
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• 2005

The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.769-772
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• 2011

We propose a sweeping machine is equipped with a polyester filter to retain small particles of dust. The filter is washable and can be easily removed for maintenance purpose or eventual replacement. Research continues into key areas such as making the structure of machine as ship' s floor grinder as possible, and designing algorithms and systems for efficiency-related system technologies.

• Proceedings of the Korean Institute Of Construction Engineering and Management
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• 2004.11a
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• pp.531-534
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• 2004

Cutting work of the concrete pile is an important task to chsh a part of pile head which is compressed with more than $800kgf/cm^{2}$. It is usually performed by a crusher and three to four skilled workers. llecent analysis results of the pile cutting work reveal that it frequently makes a lot of cracks which significantly reduce the strength of the pile and is labor-intensive work. The primary objective of this study is to propose the end-effector which can effectively break PHC Pile without any longitudinal cracks before developing an automated pile cutting machine having unified grinder and crusher parts. It is anticipated that the development of the automated pile cutting machine would be able to bring improvements in safety, productivity, quality as well as cost saving.