• 열처리공학회지
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• 제18권4호
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• pp.229-234
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• 2005

Effect of incident ion beam energy on microstructure and adhesion behavior of TiN thin films were studied. Without ion beam assist, TiN film showed (111) growth mode which was thought to have the lowest deformation energy. As the ion beam assist energy increased, TiN film growth mode was changed from (111) to (200) mode. On the Si(100) substrate the critical incident energy for growth mode change was 100 eV/atom, however the critical assist energy was 121 eV/atom on the STD61 substrate. Grain size of TiN films increased with the assist ion beam energy. Finally, adhesion strength of TiN films bombarded above the critical ion assist energy showed 4~5 times higher values than that with lower bombard ion energy.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.172-175
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• 2003

Thermomechanical behavior of Al-Mg-Si alloys have been studied to investigate the effect of microstructural features such as pre-existing substructure and distribution of particles on the deformation characteristics. The controlled compression tests have been carried out to get the basic information on how the alloy responds to temperature, strain amount and strain rate. Then hot forging of Al-Mg-Si alloys has been carried out and analyzed by the comparison with the compression tests. Microstructural features after forging have been discussed in terms of the thermomechanical response of Al-Mg-Si alloys. As already well mentioned, we have found that the deformation of Al-Mg-Si at the elevated temperature brought the recovered structure on most conditions. In a certain time, however, abnormally large grains have been found as a result of deformation assisted grain growth, which means that hot forging of Al-Mg-Si alloys could lead to a undesirable microstructural variation and the consequent mechanical properties such as fatigue strength.

• 한국세라믹학회지
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• 제28권10호
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• pp.785-792
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• 1991

An investigation of the crack propagation behavior of Al2O3-33Vol.% SiCw at 140$0^{\circ}C$ was conducted with various loading frequencies. Higher crack propagation was observed in lower frequency and higher load ratios. Interface sliding fracture due to glassy phase from the oxidation of SiCw and cavitation along grain boundary of diffusional creep appeared to be the main mechanism of fatigue fracture in slower crack propagation while interface sliding and whisker pull out aided by glassy phase formation played main role of fatigue fracture for higher crack growth condition. The frequency effect on deformation behavior was discussed with a Maxwell model.

• 소성∙가공
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• 제13권1호
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• pp.27-32
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• 2004

Thermomechanical behavior of Al-Mg-Si alloys was studied to investigate the effect of microstructural features such as pre-existing substructure and distribution of particles on the deformation characteristics. The controlled compression tests were carried out to get the information on how the alloy responds to temperature, strain amount and strain rate. Then hot forging of Al-Mg-Si alloys carried out and analyzed by the comparison with the compression tests. Microstructural features after forging were discussed in terms of the thermomechanical response of Al-Mg-Si alloys. As already well mentioned, we found that the deformation of Al-Mg-Si at the elevated temperature brought the recovered structure on most conditions. In a certain time, however, abnormally large grains were found as a result of deformation assisted grain growth, which means that hot forging of Al-Mg-Si alloys could lead to a undesirable microstructural variation and the consequent mechanical properties such as fatigue strength.

• Nuclear Engineering and Technology
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• 제40권6호
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• pp.505-510
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• 2008

The correlation between the tensile strength and corrosion behavior of Zr-1.0wt%Nb alloy heat treated at $480^{\circ}C$ for up to 32 hours was evaluated. The tensile strength at $400^{\circ}C$ was continuously reduced with an increasing heat treatment time, mainly due to a grain growth and a decreased area fraction of the precipitates. However, the corrosion resistance in an aqueous ammonia solution at $360^{\circ}C$ was enhanced, mainly due to the formation of $\beta$-Nb precipitates. It is thus concluded that a longer heat treatment time provides a better corrosion resistance while degrading the tensile strength.

• 한국분말재료학회지
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• 제8권1호
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• pp.61-69
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• 2001

Spark-Plasma Sintering(SPS) is one of the new sintering methods which takes advantages both inconventional pressure sintering and electric current sintering. It is known that SPS is very effective for the densification of hard-to-sinter materials like refractory metals, intermetallic compounds, glass and ceramics without grain growth. However, a clear explanation for sintering mechanism and an experimental evidence for the formation of weak plasma during SPS are not given yet. In this study, fundamental study on sintering behavior and mechanism of SPS was investiged. For this study, various spherical Fe powders were prepared such as as-received, as-reduced, and as-oxidized and then sintered by SPS facility. In order to confirm the surface cleaning effect during SPS neck region and fracture surface of sintered body was observed and analyzed by SEM/EPMA. Densification behavior was analyzed from the data of deflection along the pressure axis. Some specimens were additionally produced by Hot Pressing and the results were compared with those of SPS.

• 한국분말재료학회지
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• 제1권1호
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• pp.15-20
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• 1994

The effect of SiC addition on sintering behaviors and microstructures of TiB2 ceramics were studied. The sintering of TiB2 was limited due to the surface diffusion and rapid grain growth at high temperature. However the addition of SiC to TiB2 ceramics improved the densification to above 99% of the theoretical density. The sintering of TiB2-SiC composite starts at 120$0^{\circ}C$ with the melting of the oxides in particle surface as impurities. After the reduction of the oxide by additional cabon at above 140$0^{\circ}C$, the grain boundary diffusion through the interface of TiB2-SiC play an important role. TEM observation showed neither chemical reactions nor other phases formed at the TiB2-SiC interfaces but the microcracks were observed due to the mismatch of thermal expansion between TiB2-SiC.

• 동력기계공학회지
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• 제22권1호
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• pp.87-93
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• 2018

Specimens were machined out from hot-rolled AZ31 magnesium alloy, and deformed at 623K with rolling reduction of 30%. After hot rolling, specimens were annealed at various range of temperature and time. In this study, static recrystallization was occurred during heat treatment, however, variation of main component and intensity of texture was not revealed. The results of microstructure observation, damping capacity test and dislocation mechanism indicated that increasing of damping capacity was caused by grain growth. It means that grain size is effective factor to damping capacity.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.978-979
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• 2006

In this study, bottom-up type powder processing and top-down type SPD (severe plastic deformation) approaches were combined in order to achieve both full density and grain refinement of metallic powders with least grain growth. ECAP (Equal channel angular pressing) was used for the powder consolidation. We investigated the consolidation, plastic deformation and microstructure evolution behavior of the metallic powders during ECAP using an experimental method. It was found that high mechanical strength could be achieved effectively as a result of the well bonded powder contact surface during ECAP process of gas atomized Al-Si powders.

• The Korean Journal of Ceramics
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• 제6권2호
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• pp.110-115
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• 2000

$SrBi_2Ta_2O_9$ thin films were deposited at room temperature on the usual (111) oriented Pt bottom electrodes using r.f. magnetron sputtering, and then post-annealed at 650-$800^{\circ}C$ for 30min in oxygen flow. Low temperature processing which shows the preferred oriented SBT thin films was obtained by controlling the sputtering pressure and/or Sr content in target. The orientation and grain growth behavior of SBT thin films were dependent on Sr contents in films. With increasing the excess Bi content up to 50% in SBT thin films, it was possible to lower the onset temperature of grain growth. The c-axis preferred oriented SBT thin films were well-grown under the condition of low post-annealing($650^{\circ}C$) by lowering post-annealing pressure. After $10^{11}$ switching cycles, no polarization degradation was observed in both preferred oriented SBT capacitors.