• 한국분말재료학회지
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• 제5권2호
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• pp.89-97
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• 1998

Sintering behavior of nanostructured(NS) W-Cu powders prepared by mechanical alloying (MA) was investigated as a function of sintering temperature. MA NS W-2owt%Cu and W-3owt%Cu composite powders with the crystal size of 20-30 nm were annealed at 90$0^{\circ}C$, and thermal characteristics of those powders were investigated by DSC. Sintering behavior of MA NS W-Cu composite powders was investigated during the solid-state sintering and the Cu-liquid phase sintering. The new nanosintering phenonenon of MA W-Cu powders at solid-state sintering temperature was suggested to explain the W-grain growth in the inside of MA powders. The sintering densification of MA NS W-Cu powders was enhanced at Cu melting temperature by arrangement of MA powders, i.e., the first rearrangement of MA powders was occurred, and then the rearrangement of W-grains in the sintered parts was also took place during liquid-phase sintering, i.e., the second rearrangement was happened. Due to the double rearrangement process of MA NS W-Cu powders, the high sintered density with more than 96%o was obtained and the fine and high homogeneous state of W and Cu phases was achieved by sintering at 1200 $^{\circ}C$.

• 한국세라믹학회지
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• 제32권6호
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• pp.726-734
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• 1995

Pb(Zr0.53Ti0.47)O3 (PZT) ceramics having different microstructures were fabricated at low temperatures using calcined PZT powders with addition of excess PbO powder and/or ball milling. The effects of excess PbO and ball milling time on the microstructure, the sintering characteristic, and the mechanical properties of these ceramics were studied. Fine powders with average particle size of 0.38㎛ could be obtained by ball milling with 2.5 mm Ф zirconia balls for 120 hours. By the addition of 2mol% of excess PbO to these powders, it was possible to obtain well-densitified PZT ceramics at low sintering temperature of 980℃. Densification behavior of PZT was affected by the addition of excess PbO powder, while, grain growth was hardly affected by PbO addition. It was observed that Vicker's hardness decreased and fracture toughness increased with the increasing amount of PbO. At 1mol% excess PbO, it was shown that the minimum values of hardness and maximum fracture toughness were achieved. In addition, with increasing sintering time, the fracture toughness decreased and the hardness increased.

• 한국세라믹학회지
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• 제43권9호
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• pp.582-587
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• 2006

Decomposition behavior of $ferro-Si_3N_4$was investigated with varying temperature and holding time in mud components for high temperature refractory applications. Porosities gradually increased with increasing temperature and holding time due to the carbothermal reduction of $Si_3N_4\;and\;SiO_2$. Silicon monoxide (SiO) as a intermediate resulted from evaporation of $Si_3N_4\;and\;SiO_2$ reacted with C sources to generate needle-like ${\beta}-SiC$ and Fe in $Si_3N_4$ acted as a catalyst in order to enhance growth of SiC grain with the preferred orientation. SiC generation yield increased with increasing holding time, all of the $Si_3N_4\;and\;SiO_2$ affected on SiC formation up to 2h. However, SiC generation was only dependent on residual $SiO_2$ over 2h, because the carbothermal reduction reaction of $Si_3N_4$ was no longer possible at that time.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.427-430
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• 2008

The influence of subsequent annealing treatment on the dynamic deformation and the fracture behavior of submicrocrystalline Al-4.4%Mg alloy is investigated in this study. After inducing an effective strain of 8 via equal-channel angular pressing at $200^{\circ}C$, most of the grains are considerably reduced to nearly equiaxed grains of $0.3{\mu}m$ in size. With an increment of various subsequent heat treatments for 1 hour, resultant microstructures are found to be fairly stable at temperatures up to $200^{\circ}C$, suggesting that static recovery will be dominantly operative, whereas grain growth is pronounced above $250^{\circ}C$. The results of tensile tests show that yield and ultimate tensile strength decrease, but elongation-to-failure and strain hardening rate increase with an increase in annealing temperatures. The dynamic deformation and the fracture behavior retrieved with a series of torsional tests are explored with respect to annealed microstructures. Such mechanical response is analyzed in relation to resultant microstructure and fracture mode.

• 대한금속재료학회지
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• 제46권9호
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• pp.563-571
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• 2008

The influence of annealing treatment on dynamic deformation behavior of ultra-fine grained aluminum alloys was investigated in this study. After equal-channel angular pressing at $200^{\circ}C$, most of the grains were considerably reduced to nearly equiaxed grains of $0.3{\mu}m$ in size. With an increment of various annealing treatments for 1 hour, resultant microstructures were found to be fairly stable at temperatures up to $200^{\circ}C$, suggesting that static recovery would be dominantly operative, whereas grain growth was pronounced above $250^{\circ}C$. The tensile test results showed that yield and ultimate tensile strengths decreased, but elongation-to-failure and strain hardening rate increased with increasing annealing temperature. The dynamic deformation behavior retrieved with a series of torsional tests was explored with respect to annealed microstructures. Such mechanical response was analyzed in relation to resultant microstructure and fracture mode.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.522-522
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• 1996

An investigation of the effects of transverse magnetic field and Peltier effect on melt convection and macrosegregation in vertical Bridgman crystal grosth of Te doped InSb was been carried out by means of microstructure observation, Hall measurement, electrical resistivity measurement and X-ray analysis. Before the experiments, Interface stability, convective instability and suppression of convection by magnetic field were calculated theoretically. After doping 1018, 1019 cm-3 Te in InSb, the temperature of Bridgman furnace was set up at $650^{\circ}C$. The samples were grown in I.D. 11mm, 100mm high quartz tube. The velocity of growth was about 2${\mu}{\textrm}{m}$/sec. In order to obtain the suppression of convection by magnetic field in the middle of growth, 2-4KG magnetic field was set on the melt. For searching of the shape of solid-liquid interface and the actual velocity of crystal growth, let 2A current flow from solid to liquid for 1second every 50seconds repeatedly (Peltier effect). The grown InSb was polycrystal, and each grain was very sharp. There was no much difference between the sample with and without magnetic field at a point of view of microstructure. For the sample with Peltier effect, the Peltier marks(striation) were observed regularly as expected. Through these marks, it was found that the solid-liquid interface was flat and the actual growth velocity was about 1-2${\mu}{\textrm}{m}$/sec. On the ground of theoretical calculation, there is thermosolutal convection in the Te doped InSb melt without magnetic field in this growth condition. and if there is more than 1KG magnetic field, the convection is suppressed. Through this experiments, the effective distribution coefficients, koff, were 0.35 in the case of no magnetic field, and 0.45 when the magnetic field is 2KG, 0.7 at 4KG. It was found that the more magnetic field was applied, the more convection was suppressed. But there was some difference between the theoretical calculation and the experiment, the cause of the difference was thought due to the use of some approximated values in theoretical calculation. In addition to these results, the sample with Peltier effect showed unexpected result about the Te distribution in InSb. It looked like no convection and no macrosegregation. It was thought that the unexpected behavior was due to Peltier mark. that is, when the strong current flew the growing sample, the mark was formed by catching Te. As a result of the phenomena, the more Te containing thin layer was made. The layer ruled the Hall measurement. The values of resistivity and mobility of these samples were just a little than those of other reference. It was thought that the reason of this result was that these samples were due to polycrystal, that is, grain boundaries had an influence on this result.

• 한국재료학회지
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• 제14권8호
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• pp.552-557
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• 2004

Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

• 한국세라믹학회지
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• 제42권8호
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• pp.525-531
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• 2005

Tailoring the microstructure and the composition of silicon nitride ceramics can have profound effects on their properties. Here it is shown that the grain growth behavior, in particular its anisotropy, is a function of the specific additives, which allow one to tune the microstructure from one consisting of more equiaxed grains to one with very elongated grains. Recent studies are discussed that provide an understanding of the atomic level processes by which these additives influence grain shapes. Next the microstructural (and compositional) parameters are discussed that can be used to modify the thermal conductivity, as well as fracture toughness of silicon nitride ceramics. As a result of the open <0001> channels in $\beta-Si_3N_4$, the c-axis conductivity can be exceptionally high. Thus, the formation of elongated c-axis grains, particularly when aligned can result in conductivity values approaching those of AlN ceramics. In addition, the controlled formation of elongated grains can also be used to significantly enhance the fracture toughness. At the same time, both properties are shown to be affected by the composition of the densification additives. Utilizing such understanding, one will be able to tailor the ceramics to achieve the properties desired for specific applications.

• 한국분말재료학회지
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• 제13권6호
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• pp.415-420
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• 2006

Nanostructured metallic materials are synthesized by bottom-up processing which starts with powders for assembling bulk materials or top-down processing starting with a bulk solid. A representative bottom-up and top-down paths for bulk nanostructured/ultrafine grained metallic materials are powder consolidation and severe plastic deformation (SPD) methods, respectively. In this study, the bottom-up powder and top-down SPD approaches were combined in order to achieve both full density and grain refinement without grain growth, which were considered as a bottle neck of the bottom-up method using conventional powder metallurgy of compaction and sintering. For the powder consolidation, equal channel angular pressing (ECAP), one of the most promising method in SPD, was used. The ECAP processing associated with stress developments was investigated. ECAP for powder consolidation were numerically analyzed using the finite element method (FEM) in conjunction with pressure and shear stress.

• 한국수소및신에너지학회논문집
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• 제17권2호
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• pp.141-148
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• 2006

This study was carried out to analyze the microstructure characteristics of electrolyte membrane through XRD, SEM and AC impedance measurement for using in high temperature steam electrolysis(HTE). It was investigated that thermal stability and electric characteristics by sintering condition using dry and wet process, and confirmed growth of particle and density change by sintering temperature. The sintering temperature and behavior had an effect on the relative density of the ceramic and the average grain size. The more amount of dispersant in organic compound increase, the more the density increased. But the binder was shown opposite phenomenon. It was analyzed that electrolyte resistance and electrical characteristics using AC impedance. The electrical properties of YSZ grain boundary changed with the sintering temperature.