• Journal of the Korean institute of surface engineering
• /
• v.43 no.3
• /
• pp.142-147
• /
• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.09a
• /
• pp.21-30
• /
• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.18 no.6
• /
• pp.560-570
• /
• 2005

In this paper, a microelectrode away DNA chip was fabricated on glass slide using photolithography technology. Several probe DNAs consisting of mercaptohexyl moiety at their 5' end were immobilized on the gold electrodes by DNA arrayer utilizing the affinity between gold and sulfu. Then target DNAs were hybridized and reacted with Hoechst 33258, which is a DNA minor groove binder and electrochemically active dye. Cyclic voltammetry in 5mA ferricyanide/ferrocyanide solution at 100 mV/s confirmed the immobilization of probe DNA on the gold electrodes. Linear sweep voltammetry or cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. It was derived from Hoechst 33258 concentrated at the electrode surface through association with formed hybrid. It suggested that this DNA chip could recognize the sequence specific genes. It suggested that multichannel electrochemical DNA microarray is useful to develop a portable device for clinical gene diagnostic system.

• Progress in Medical Physics
• /
• v.6 no.2
• /
• pp.51-60
• /
• 1995

Lithium Fluoride (LiF; TLD-100) crystal chips are normally used as thermolu minescence dosimeters (abbreviated as NC-100) for estimating the absorbed dose to the skin of a patient or in a solid water phantom undergoing radiotherapy with megavoltage photon (6 and 15MV) beams. In general, investigation has revealed a reduction in the sensitivity of NC-100 chips after many runs through heating cycles. A TLD-100 chip laminated with gold plate (140${\mu}{\textrm}{m}$) on the upper surface layer of its face toward the photon beam (abbreviated as GC-100) has properties different from that of a NC-100 chip activated by incident photons and contaminant electrons with various lower energies coming from the gantry head and air. Activation of the valence band electrons of GC-100 chips by incident photons, positrons and electrons-which come from the gold plate by mainly pair production process and partly from Compton scattering-results in more enhanced signal intensity, higher response per monitor unit, as well as a good linearity with monitor units and independence of dose rate. Since the electron beams (6 and 15 MeV) do not have the probability of pair production process with gold plate, there is only a small difference (about a 3.3％ increase for 15 MeV) in the signal gaps in the TL readout for electron beams between GC- and NC-100 chips. The 3.3％ increase is entirely due to the buildup caused by the 140 m gold plate. The sensitivity of GC-100 chips is much more susceptible to high energy photon beams than electron one because of pair production. The interaction of high energy photon with a material of high atomic number, such as the good plate in this case, results in a considerably significant probability of pair production. The gold plate on the NC-100 chips acts as not only an intensifier of their signals but also acts as a filter of contaminant electrons in therapeutic high energy X-ray beams.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.26 no.12
• /
• pp.1910-1917
• /
• 1989

This paper shows the performances of asynchronous binary direct-sequence spread-spectrum multiple access communication systems with Rayleigh fading and White Gaussian noise. The performance measures considered are worst-case bit error probability and average SNR depending on code sequences and chip waveforms. The code sequences used are m-sequence and Gold sequence with period 31.The chip waveforms employed are rectangular, sinusoidal and something other chip waveforms.

• Biotechnology and Bioprocess Engineering:BBE
• /
• v.3 no.1
• /
• pp.19-23
• /
• 1998

We enhanced the sensitivity of surface plasmon resonance biosensor by the conversion of the real-time direct binding immunoassay into the sandwich immunoassay, in which colloidal gold particles coated with anti-mouse IgG was used. By the immobilization of anti-mouse IgG onto the carboxymethyl dextran surface of thin gold film, the direct binding of analyte(mouse IgG) onto the sensor chip, and the injection of colloidal gold particles coated with anti-mouse IgG, about 100 times of sensitivity enhancement was obtained. This result suggests that nanoparticles, which has a high refractive index, homogeneous ultrafine structure and capability of size control, would be applicable for the detection of very small quantity of biomaterial.

• Applied Chemistry for Engineering
• /
• v.30 no.3
• /
• pp.379-383
• /
• 2019

The capability of detecting amyloid beta 42 ($A{\beta}42$), a biomarker of Alzheimer's disease, using a thiolated protein A-functionalized bimetallic surface plasmon resonance (SPR) chip was investigated. An optimized configuration of a bimetallic chip containing gold and silver was obtained through calculations in the intensity measurement mode. The surface of the SPR bimetallic chip was functionalized with thiolated protein A for the immobilization of $A{\beta}42$ antibody. The response of the thiolated protein A-functionalized bimetallic chip to $A{\beta}42$ in the concentration range of 50 to 1,000 pg/mL was linear. Compared to protein A without thiolation, the thiolated protein A resulted in greater sensitivity. Therefore, the thiolated protein A-functionalized bimetallic SPR chip can be used to detect very low concentrations of the biomarker for Alzheimer's disease.

• Journal of Sensor Science and Technology
• /
• v.30 no.5
• /
• pp.326-330
• /
• 2021

Reactions between gold (Au) surface plasmon resonance (SPR) chips and bovine serum albumin (BSA) dissolved in solutions of different pH were investigated. The charge on the BSA depends on the pH of the solution in which it is dissolved. Thus, dissolving BSA in different pH solutions resulted in different charges of BSA. Among the BSA dissolved in solutions with pH 4.01, 7.4, and 10.01, the SPR response was the highest for BSA dissolved in the solution of pH 4.01. To eliminate the response variation owing to the difference in the refractive indices of the solutions, phosphate buffered saline (PBS) was injected into the system after the reaction of BSA with the Au SPR chip had happened. In this case too, the BSA dissolved in the solution with pH 4.01 exhibited the highest response. This may be attributed to the non-uniform distribution of ionic patches on the BSA, which can induce electrostatic attraction to the surface even though BSA has a positive charge at pH 4.01, and the absolute values of the net charge of BSA at pH 4.01 and 7.4 were very close.

• KSBB Journal
• /
• v.22 no.6
• /
• pp.433-437
• /
• 2007

A constant desire has been to fabricate nanopatterns for biochip and the Ultraviolet-nano imprint lithography (UV-NIL) is promising technology especially compared with thermal type in view of cost effectiveness. By using this method, nano-scale to micro-scale structures also called nanopore structures can be fabricated on large scale gold plate at normal conditions such as room temperature or low pressure which is not possible in thermal type lithography. One of the most important methods in fabricating biochips, immobilizing, was processed successfully by using this technology. That means immobilizing proteins only on the nanopore structures based on gold, not on hardened resin by UV is now possible by utilizing this method. So this selective nano-patterning process of protein can be useful method fabricating nanoscale protein chip.

• Journal of Sensor Science and Technology
• /
• v.25 no.4
• /
• pp.243-246
• /
• 2016

The characteristics of a bimetallic surface plasmon resonance (SPR) chip were investigated to detect a tumor biomarker, carcinoembryonic antigen (CEA). The linewidth and the tangential slope of the reflectance curve of the bimetallic SPR chip was compared with those of the reflectance curve of a conventional gold (Au) SPR chip. The changes in reflectance in response to the variation in CEA in the critical concentration range were analyzed at an angle where the tangential slope of the reflectance curve was maximum. From linear regression analysis, the sensitivity of the bimetallic SPR chip with respect to the CEA in critical concentration was obtained.