• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
• /
• pp.953-956
• /
• 2003

Transparent conductive ZnO:Ga thin films were deposited on glass substrates using rf magnetron sputtering method for flat panel display. The ZnO:Ga films were preferentially oriented to c-axis (002) of on substrates. The surface morphology was smooth and had not porous whatever substrate temperature was. The electrical conductivity of the thin films were in the range of $1.6{\times}10^2{\sim}6.7{\times}10^3\;{\Omega}^{-1}cm^{-1}$ at the growth temperature from 50 to $400^{\circ}C$, whereas has a maximum at around $250^{\circ}C$. By combining of XRD and EXAFS, the crystallinity and grain size decreased with increasing substrate temperature corresponding to the reduction of the grain-boundary scattering. The optical transmittance of sputtered ZnO:Ga thin films had an improved about 86% in the UV-visible region.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 International Symposium
• /
• pp.21-30
• /
• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 한국구조물진단유지관리공학회 논문집
• /
• 제15권3호
• /
• pp.163-170
• /
• 2011

본 연구에서 교량바닥판용으로 조립식(Modular) 유리섬유 보강(GFRP) 바닥판의 개념을 제안하였다. 본 조립식 GFRP 바닥판시스템은 GFRP 주 단위모률(unite module)과 연결 단위모듈로 구성되어 있다. 본 GFRP 바닥판의 구조성능을 평가하기 위해 정적하중실험을 실시하였다. 그리고 구조성능 결과에 대해서 범용 유한요소 프로그램인 LUSAS을 이용한 수치해석 결과와 비교 분석하였다. 본 연구에서 제안한 조립식 GFRP 바닥판은 교량적용에 매우 유용할 수 있음을 확인할 수 있었다. 제안된 GFRP 바닥판의 파괴모드가 개발된 다른 상용화된 GFRP 바닥판의 파괴모드와 매우 유사한 파괴모들 나타내었다.

• KIEAE Journal
• /
• 제16권2호
• /
• pp.23-31
• /
• 2016

Purpose: Recently energy consumption is rapidly increasing due to continuous development of social evolution in various field. In this situation, there is a lot of effort to reduce this energy consumption in many ways, especially in building energy. Preceding studies already started to analyze the housing area such as zero energy house and passive house by researching annual building energy consumption, but to apply the results of housing to office building is insufficient since it has different consumption tendency. Method: In this study, eQuest program was used for simulation and the base model is selected among standard office building in ASHRAE 90.1. Variables are divided into passive and active factors for comparison. Result: In passive factors, glazing system showed the highest energy saving rate by 21.3% with triple low-e glass and enhancing wall u-value showed the lowest energy saving rate by 3.6% with 0.15 m2/K. In active factors, VAV system showed 30.9% energy saving rate when compared to CAV system, and heat exchanger showed 10.2% energy saving rate. For regeneration energy part, photovoltaic panel generated 10.4% of base annual energy usage.

• 반도체디스플레이기술학회지
• /
• 제11권1호
• /
• pp.73-78
• /
• 2012

In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

• 전기학회논문지
• /
• 제58권10호
• /
• pp.1976-1981
• /
• 2009

Transparent conducting aluminum-doped zinc oxide (AZO) thin films were deposited on Coming glass substrate using an Gun-type rf magnetron sputtering deposition technology. The AZO thin films were fabricated with an AZO ceramic target (Zn: 98wt.%, $Al_2O_3$: 2wt.%). The AZO thin films were deposited with various growth conditions such as the substrate temperature, oxygen pressure. X -ray diffraction (XRD), UV/visible spectroscope, atomic force microscope (AFM), and Hall effect measurement system were done in order to investigate the properties of the AZO thin films Among the AZO thin films prepared in this study, the one formed at conditions of the substrate temperature $100^{\circ}C$, Ar 50 sccm, $O_2$ 5 sccm and working pressure 5 motor showed the best properties of an electrical resistivity of $1.763{\times}10^{-4}\;[{\Omega}{\cdot}cm]$, a carrier concentration of $1.801{\times}10^{21}\;[cm^{-3}]$, and a carrier mobility of $19.66\;[cm^2/V{\cdot}S]$, which indicates that it could be used as a transparent electrode for thin film transistor and flat panel display applications.

• Transactions on Electrical and Electronic Materials
• /
• 제1권4호
• /
• pp.20-24
• /
• 2000

This study aimed to develop ITO(Indium Tim Oxide) tin films ablation with a pulsed type KrF excimer laser required for the electrode patterning application in flat panel display into small geometry on a large substrate are. The threshold fluence for ablating ITO on glass substrate is about 0.1 J/㎠. And its value is much smaller than that using 3 .sup rd/ harmonic Nd:YAG laser. Through the optical microscope measurement the surface color of the ablated ITO is changed into dark brown due to increase of surface roughness and transformation of chemical composition by the laser light. The laser-irradiated regions were all found to be electrically isolating from the original surroundings. The XPS analysis showed that the relative surface concentration of Sn and In was essentially unchanged (In:Sn=5:1)after irradiating the KrF excimer laser. Using Al foil made by 2$\^$nd/ harmonic Na:YAG laser, the various ITO patterning is carried out.

• 한국화재소방학회논문지
• /
• 제23권6호
• /
• pp.39-45
• /
• 2009

본 연구에서는 샌드위치패널의 종합적인 화재특성을 파악하기 위하여 스티로폼, 난연 스티로폼, 우레탄폼, 난연 우레탄폼, 그라스울 샌드위치패널에 대해 국제 화재 시험 규격인 ISO 9705 시험(Full-scale room test)을 실시하였다. 이를 바탕으로 EN 13501-1 및 Eurefic Research Program에서 제시하고 있는 분류기준에 적용하여 샌드위치패널의 종합적인 화재특성을 분석하였다. 그 결과 그라스울 샌드위치 패널은 A class, 난연 우레탄폼과 난연 스티로폼 샌드위치 패널은 B class로 나타났다. 플래시오버가 발생한 스티로폼, 우레탄폼 샌드위치 패널은 E class 로 나타났다.

• 품질경영학회지
• /
• 제47권3호
• /
• pp.425-435
• /
• 2019

Purpose: The purpose of this study was to resolve the Naval ship's Local Operation Panel(LOP) malfunction problems which caused by overheating in summer season and dispatching to equatorial regions. Methods: Instead of using dual type heat insulation materials(consist with ceramic wool and glass wool), aerogel heat insulation materials were used for decreasing heat emissions from gas-turbine heat waste steam pipes passing water-jet- room. Experiment and Computational analysis of heat flow were conducted to analyze the internal room temperature changes. Results: The results of this study are as follows; The aerogel heat insulation materials suppress heat emission more efficiently than dual type insulation materials. The cold surface temperature of insulation was far more decreased and internal room, LOP surface temperature also showed significant results too. Conclusion: The substituted heat insulation materials appeared remarkable performance in decreasing room temperature that it could be used for suppressing the LOP overheatings and malfunctions.

• Advances in aircraft and spacecraft science
• /
• 제6권2호
• /
• pp.169-187
• /
• 2019

This work presents a practical detailed finite element (FE) approach for the three-dimensional (3D) free-vibration analysis of actual aircraft and spacecraft-type lightweight and thin honeycomb sandwich panels. It consists of calling successively in $MATLAB^{(R)}$, via a developed user-friendly GUI, a detailed 3D meshing tool, a macrocommands language translator and a commercial FE solver($ABAQUS^{(R)}$ or $ANSYS^{(R)}$). In contrary to the common practice of meshing finely the faces and core cells, the proposed meshing tool represents each wall of the actual hexagonal core cells as a single two-dimensional (2D) 4 nodes quadrangularshell element or two 3 nodes triangular ones, while the faces meshes are obtained simply using the nodes at the core-faces interfaces. Moreover, as the same 2D FE interpolation type is used for meshing the core and faces, this leads to an automatic handling of their required FE compatibility relations. This proposed approach is applied to a sample made of very thin glass fiber reinforced polymer woven composite faces and a thin aluminum alloy hexagonal honeycomb core. The unknown or incomplete geometric and materials properties are first collected through direct measurements, reverse engineering techniques and experimental-FE modal analysis-based inverse identification. Then, the free-vibrations of the actual honeycomb sandwich panel are analyzed experimentally under different boundary conditions and numerically using different mesh basic cell shapes. It is found that this approach is accurate for the first few modes used for pre-design purpose.