• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.148-148
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• 2010

Measuring the a-IGZO TFTs with various temperatures was found to induce a threshold voltage shift and a change of the subthreshold gate voltage swing. Characteristic change is dependant on a material of the substrate at the temperature from $20^{\circ}C$ to $100^{\circ}C$. The threshold voltage was shifted to the left from -2.7V to -61V on SiO2/galss. But, as the temperature increases form $20^{\circ}C$ to $100^{\circ}C$. the threshold voltage was shifted to the right from 0.85V to 2.45V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.89-90
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• 2008

본 연구에서는 PECVD(Plasma Enhanced CVD) 에서 사용하는 유해 가스인 $SiH_4$ 대신에 유기 사일렌 반응 물질인 TEOS(Tetraethyl Orthosilicate, Si$(OC_2H_5)_4)$를 이용하여 상압 화학 기상 증착법 (Atmospheric Pressure CVD, APCVD)으로 실리콘 산화막을 증착하고 박막의 조성과 특성 및 화학적, 전기적 특성들을 살펴보았다. TEOS 반응원료를 이용한 CVD 공정에서 공정 온도를 낮추기 위한 방법으로 강력한 산화제인 오존을 이용하여 공정온도를 $400^{\circ}C$이하로 낮췄으며, 유리기판 상의 ELA(Excimer Laser Annealing)처리된 다결정 실리콘 기판에 트랜지스터 소자를 제작하고, 게이트 절연막으로의 전기적 특성을 살펴보았다.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.297-300
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• 2002

Application of electronic nose and PLD chip design was developed to be used in gas discrimination system for limited kinds of gas. An array of 4 metal oxide gas sensors with different selectivity patterns were used in order to measure gases. BP(Back Propagation) algorithm was designed and implemented on CPLD of two hundred thousand gate level chips by VHDL language for processing input signals from 4 kinds of gas sensors. This module successfully discriminated 4 kinds of gases and displayed the results on LCD and LED. The developed module could be used for various applications in the field of food process control and alcohol judgment.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.5
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• pp.22-29
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• 1981

An ion sensitive field effect transistor employing a special HCI heat treatment for the gate oxide layer along with tungsten metallization and multilayer encapsulation using fumed silica epoxy mixture was fabricated and its performance characteristics have been investigated. A theoretical model for the device operation is discussed, and it is shown that the experimental results are in good agreement with the theory. The fabricated device has excellent performance characteristics showing the fast response, long operation-life, small pH hysteresis, high sensitivity, etc. Especially, its stability has been greatly improved.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.216-219
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• 1999

A simple two-terminal cyclic current-voltage(I-V) technique is used to measure the current-transients in MOS capacitors. Distinct charging/discharging currents were measured and analyzed as a function of (1) the hold time. (2) the gate polarity during the FNT electron injection, (3) the injection fluence and (4) the annealing time after the injection had stopped. Discharging and charging current-transients were strongly dependent upon the conditions for forming the inversion layer and the density of interface traps caused during the FNT electron injection, respectively. Several tentative mechanisms were suggested in the current work.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.9
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• pp.1-9
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• 1994

This paper analyzes the faults and their mechanism of CMOS ICs using IDDQ testing technique and evalutes the reliability of the chips that fail this test. It is implemented by the three testing phases, initial test, burn-in and life test. Each testing phase includes the parametric test, functional test, IDDQ test and propagation delay test. It is shown that the short faults such as gate-oxide short, bridging can be only detected by IDDQ testing technique and the number of test patterns for this test technique is very few. After first burn-in, the IDDQ of some test chips is decreased, which is increased in conventional studies and in subsequent burn-in, the IDDQ of all test chips is stabilized. It is verified that the resistive short faults exist in the test chips and it is deteriorated with time and causes the logic fault. Also, the new testing technique which can easily detect the rsistive short fault is proposed.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.8
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• pp.126-132
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• 1995

The electrical stress of short channel polycrystalline silicon (poly-Si) thin film transistor (TFT) has been investigated. The device characteristics of short channel poly-Si TFT with 5$\mu$m channel length has been observed to be significantly degraded such as a large shift in threshold voltage and asymmetric phenomena after the electrical stress. The dominant degradation mechanism in long channel poly-Si TFT's with 10$\mu$m and 20$\mu$m channel length respectively is charage trappling in gate oxide while that in short channel device with 5.mu.m channel length is defect creation in active poly-Si layer. We propose that the increased defect density within depletion region near drain junction due to high electric field which could be evidenced by kink effect, constitutes the important reason for this significant degradation in short channel poly-Si TFT. The proposed model is verified by comparing the amounts of the defect creation and the charge trapping from the strechout voltage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.83-87
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• 2020

In this letter, we propose and analyze a new asymmetric structure that can be used for next-generation power semiconductor devices. We compare and analyze the electrical characteristics of the proposed device with respect to those of symmetric devices. The proposed device has a p-emitter on the right side of the cell. The peak electric field is reduced by the shielding effect caused by the p-emitter structure. Consequently, the breakdown voltage is increased. The proposed asymmetric structure has an approximately 100% higher Baliga's figure of merit (~94.22 MW/㎠) than the symmetric structure (~46.93 MW/㎠), and the breakdown voltage of the device increases by approximately 70%.

• 한국컴퓨터산업교육학회:학술대회논문집
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• 2003.11a
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• pp.71-74
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• 2003

A vertical trench electrode type EST has been proposed in this paper. The proposed device considerably improve the snap-back effect which leads to a lot of problem of device applications. In this paper, the vertical dual gate Emitter Switched Thyristor(EST) with trench electrode has been proposed for improving snap-back effect. It is observed that the forward blocking voltage of the proposed device is 800V. The conventional EST of the same size were no more than 633V. Because the proposed device was constructed of trench-type electrode, the electric field moved toward trench-oxide layer, and the punch through breakdown of the proposed EST is occurred at latest.

• 한국컴퓨터산업교육학회:학술대회논문집
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• 2003.11a
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• pp.79-82
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2$ and $Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability.