• Title/Summary/Keyword: gate dielectric

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Study of charge trap flash memory device having Er2O3/SiO2 tunnel barrier (Er2O3/SiO2 터널베리어를 갖는 전하트랩 플래시 메모리 소자에 관한 연구)

  • An, Ho-Myung
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2013.05a
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    • pp.789-790
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    • 2013
  • $Er_2O_3/SiO_2$ double-layer gate dielectric shows low gate leakage current and high capacitance. In this paper, we apply $Er_2O_3/SiO_2$ double-layer gate dielectric as a charge trap layer for the first time. $Er_2O_3/SiO_2$ double-layer thickness is optimized by EDISON Nanophysics simulation tools. Using the simulation results, we fabricated Schottky-barrier silicide source/drain transistor, which has10 um/10um gate length and width, respectively. The nonvolatile device demonstrated very promising characterstics with P/E voltage of 11 V/-11 V, P/E speed of 50 ms/500 ms, data retention of ten years, and endurance of $10^4$ P/E cycles.

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A study on Current-Voltage Relation for Double Gate MOSFET (DGMOSFET의 전류-전압 특성에 관한 연구)

  • Jung, Hak-Kee;Ko, Suk-Woong;Na, Young-Il;Jung, Dong-Su
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • v.9 no.2
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    • pp.881-883
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    • 2005
  • In case is below length 100nm of gate, various kinds problem can be happened with by threshold voltage change of device, occurrence of leakage current by tunneling because thickness of oxide by 1.5nm low scaling is done and doping concentration is increased. SiO$_2$ dielectric substance can not be used for gate insulator because is expected that tunneling current become 1A/cm$^2$ in 1.5nm thickness low. In this paper, devised double gate MOSFET(DGMOSFET) to decrease effect of leakage current by this tunneling. Therefore, could decrease effect of these leakage current in thickness 1nm low of SiO$_2$ dielectric substance. But, very big gate insulator of permittivity should be developed for develop device of nano scale.

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Organic TFT 특성향상을 위한 절연막의 표면처리 및 소자 특성 변화

  • Kim, Yeong-Hwan;Kim, Byeong-Yong;O, Byeong-Yun;Park, Hong-Gyu;Im, Ji-Hun;Na, Hyeon-Jae;Han, Jeong-Min;Seo, Dae-Sik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.158-158
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    • 2009
  • This paper focuses on improving organic thin film transistor (OTFT) characteristics by controlling the self-organization of pentacene molecules with an alignable high-dielectric-constant film. The process, based on the growth of pentacene film through high-vacuum sublimation, is a method of self-organization using ion-beam (IB) bombardment of the $HfO_2/Al_2O_3$ surface used as the gate dielectric layer. X-ray photoelectron spectroscopy indicates that the IB raises the rate of the structural anisotropy of the $HfO_2/Al_2O_3$film, and X-ray diffraction patterns show the possibility of increasing the anisotropy to create the self-organization of pentacene molecules in the first polarized monolayer. An effective mobility of $2.3{\times}10^{-3}cm^2V^{-1}s^{-1}$ was achieved, which is significantly different from that of pentacene films that are not aligned. The proposed OTFT devices with an ultrathin $HfO_2$ structure as the gate dielectric layer were operated at a gate voltage lower than 5 V.

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Oxide Semiconductor Thin Film Transistor based Solution Charged Cellulose Paper Gate Dielectric using Microwave Irradiation

  • Lee, Seong-Yeong;Jo, Gwang-Won;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.207.1-207.1
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    • 2015
  • 차세대 디스플레이 소자로서 TAOS TFT (transparent amorphous oxide semiconductor Thin Film Transistor)가 주목 받고 있다. 또한, 최근에는 값 비싼 전자 제품을 저렴하고 간단히 처분 할 수 있는 시스템으로 대신 하는 연구가 진행되고 있다. 그중, cellulose-fiber에 전기적 시스템을 포함시키는 e-paper에 대한 관심이 활발하다. cellulose fiber는 가볍고 깨지지 않으며 휘는 성질을 가지고 있다. 가격도 저렴하고 가공이 용이하여 차세대 기판의 재료로서 주목받고 있다. 하지만, cellulose-fiber 위에는 고온의 열처리공정과 고품질 박막 성장이 어려워서 TFT 제작에 어려움을 겪고 있다. 이러한 문제를 해결하기 위해서 산화물 반도체를 이용하여 TFT를 제작한 사례가 보고되고 있다. 또한, 채널 물질 뿐만 아니라 cellulose fiber에도 다른 물질을 첨가하거나 증착하여 전기적 화학적 특성을 개선시킨 사례도 많이 보고되고 있다. 본 연구에서는 가장 저품질의 용지로 알려진 신문지와 A4용지를 gate dielectric을 이용하여서 a-IGZO TFT를 제작하였다. 하지만, cellulose fiber로 만들어진 TFT의 경우에는 고온의 열처리가 불가능 하다. 따라서 저온에서 높을 효율은 보이는 microwave energy를 이용하여 열처리를 진행하였다. 추가적으로 저품질의 종이의 특성을 개선시키기 위해서 high-k metal-oxide solution precursor를 첨가 하여 TFT의 특성을 개선시켰다. 결과적으로 cellulose fiber에 metal-oxide solution precursor을 첨가하는 공정과 micro wave를 조사하는 방법을 사용하여 100도 이하에서 cellulose fiber를 저렴하고 우수한 성능의 TFT를 제작에 성공하였다.

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Oxide Semiconductor Thin Film Transistor based Solution Charged Cellulose Paper Gate Dielectric using Microwave Irradiation

  • Lee, Gi-Yong;Jo, Gwang-Won;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.207.2-207.2
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    • 2015
  • 차세대 디스플레이 소자로서 TAOS TFT (transparent amorphous oxide semiconductor Thin Film Transistor)가 주목 받고 있다. 또한, 최근에는 값 비싼 전자 제품을 저렴하고 간단히 처분 할 수 있는 시스템으로 대신 하는 연구가 진행되고 있다. 그중, cellulose-fiber에 전기적 시스템을 포함시키는 e-paper에 대한 관심이 활발하다. cellulose fiber는 가볍고 깨지지 않으며 휘는 성질을 가지고 있다. 가격도 저렴하고 가공이여 용이하여 차세대 기판의 재료로서 주목받고 있다. 하지만, cellulose-fiber 위에는 고온의 열처리공정과 고품질 박막 성장이 어려워서 TFT 제작에 어려움을 겪고 있다. 이러한 문제를 해결하기 위해서 산화물 반도체를 이용하여 TFT를 제작한 사례가 보고되고 있다. 또한, 채널 물질 뿐만 아니라 cellulose fiber에도 다른 물질을 첨가하거나 증착하여 전기적 화학적 특성을 개선시킨 사례도 많이 보고되고 있다. 본 연구에서는 가장 저품질의 용지로 알려진 신문지와 A4용지를 gate dielectric을 이용하여서 a-IGZO TFT를 제작하였다. 하지만, cellulose fiber로 만들어진 TFT의 경우에는 고온의 열처리가 불가능 하다. 따라서 저온에서 높을 효율은 보이는 microwave energy를 이용하여 열처리를 진행하였다. 추가적으로 저품질의 종이의 특성을 개선시키기 위해서 high-k metal-oxide solution precursor를 첨가 하여 TFT의 특성을 개선시켰다. 결과적으로 cellulose fiber에 metal-oxide solution precursor을 첨가하는 공정과 micro wave를 조사하는 방법을 사용하여 100도 이하에서 cellulose fiber를 저렴하고 우수한 성능의 TFT를 제작에 성공하였다.

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Low-Voltage Driving of Indium Zinc Oxide Transistors with Atomic Layer Deposited High-k Al2O3 as Gate Dielectric (원자층 증착을 이용한 고 유전율 Al2O3 절연 박막 기반 Indium Zinc 산화물 트랜지스터의 저전압 구동)

  • Eom, Ju-Song;Kim, Sung-Jin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.7
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    • pp.432-436
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    • 2017
  • IZO transistors with $Al_2O_3$ as gate dielectrics have been investigated. To improve permittivity in an ambient dielectric layer, we grew $Al_2O_3$ by atomic layer deposition directly onto the substrates. Then, we prepared IZO semiconductor solutions with 0.1 M indium nitrate hydrate [$In(NO_3)_3{\cdot}xH_2O$] and 0.1 M zinc acetate dehydrate [$Zn(CH_3COO)_2{\cdot}2H_2O$] as precursor solutions; the IZO solution made with a molar ratio of 7:3 was then prepared. It has been found that these oxide transistors exhibit low operating voltage, good turn-on voltage, and an average field-effect mobility of $0.90cm^2/Vs$ in ambient conditions. Studies of low-voltage driving of IZO transistors with atomic layer-deposited high-k $Al_2O_3$ as gate dielectric provide data of relevance for the potential use of these materials and this technology in transparent display devices and displays.

Characteristics of the Reoxidized Oxynitride Gate Dielectric for Charge Trap Type NVSM (전하 트랩 형 비휘발성 기억소자를 위한 재산화 산화질화막 게이트 유전악의 특성에 관한 연구)

  • 이상은;박승진;김병철;서광열
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.37-40
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    • 1999
  • For the first time, charge trapping nonvolatile semiconductor memories with the deoxidized oxynitride gate dielectric is proposed and demonstrated. Gate dielectric wit thickness of less than 1 nm have been grown by postnitridation of pregrown thermal silicon oxides in NO ambient and then reoxidation. The nitrogen distribution and chemical state due to NO anneal/reoxidation were investigated by M-SIMS, TOF-SIMS, AES depth profiles. When the NO anneal oxynitride film was reoxidized on the nitride film, the nitrogen at initial oxide interface not only moved toward initial oxide interface, but also diffused through the newly formed tunnel oxide by exchange for oxygen. The results of reoxidized oxynitride(ONO) film analysis exhibits that it is made up of SiO$_2$(blocking oxide)/N-rich SiON interface/Si-rich SiON(nitrogen diffused tunnel oxide)/Si substrate. In addition, the SiON and the S1$_2$NO Phase is distributed mainly near the tunnel oxide, and SiN phase is distributed mainly at tunnel oxide/Si substrate interface.

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Studies for Improvement in SiO2 Film Property for Thin Film Transistor (박막트랜지스터 응용을 위한 SiO2 박막 특성 연구)

  • Seo, Chang-Ki;Shim, Myung-Suk;Yi, Junsin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.6
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    • pp.580-585
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    • 2004
  • Silicon dioxide (SiO$_2$) is widely used as a gate dielectric material for thin film transistors (TFT) and semiconductor devices. In this paper, SiO$_2$ films were grown by APCVD(Atmospheric Pressure chemical vapor deposition) at the high temperature. Experimental investigations were carried out as a function of $O_2$ gas flow ratios from 0 to 200 1pm. This article presents the SiO$_2$ gate dielectric studies in terms of deposition rate, refrative index, FT-IR, C-V for the gate dielectric layer of thin film transistor applications. We also study defect passivation technique for improvement interface or surface properties in thin films. Our passivation technique is Forming Gas Annealing treatment. FGA acts passivation of interface and surface impurity or defects in SiO$_2$ film. We used RTP system for FGA and gained results that reduced surface fixed charge and trap density of midgap value.

Synthesis and characterization of silanized-SiO2/povidone nanocomposite as a gate insulator: The influence of Si semiconductor film type on the interface traps by deconvolution of Si2s

  • Hashemi, Adeleh;Bahari, Ali
    • Current Applied Physics
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    • v.18 no.12
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    • pp.1546-1552
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    • 2018
  • The polymer nanocomposite as a gate dielectric film was prepared via sol-gel method. The formation of crosslinked structure among nanofillers and polymer matrix was proved by Fourier transform infrared spectroscopy (FT-IR). Differential thermal analysis (DTA) results showed significant increase in the thermal stability of the nanocomposite with respect to that of pure polymer. The nanocomposite films deposited on the p- and n-type Si substrates formed very smooth surface with rms roughness of 0.045 and 0.058 nm respectively. Deconvoluted $Si_{2s}$ spectra revealed the domination of the Si-OH hydrogen bonds and Si-O-Si covalence bonds in the structure of the nanocomposite film deposited on the p- and n-type Si semiconductor layers respectively. The fabricated n-channel field-effect-transistor (FET) showed the low threshold voltage and leakage currents because of the stronger connection between the nanocomposite and n-type Si substrate. Whereas, dominated hydroxyl groups in the nanocomposite dielectric film deposited on the p-type Si substrate increased trap states in the interface, led to the drop of FET operation.

The Structure, Surface Morphology and Electrical Properties of ZrO2 Metal-insulator-metal Capacitors (ZrO2 MIM 캐패시터의 구조, 표면 형상 및 전기적 특성)

  • Kim Dae Kyu;Lee Chongmu
    • Korean Journal of Materials Research
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    • v.15 no.2
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    • pp.139-142
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    • 2005
  • [ $ZrO_2$ ] gate dielectric thin films were deposited by radio frequency (rf)-magnetron sputtering and its structure, surface morphology and electrical peoperties were studied. As the oxygen flow rate increases, the surface becomes smoother. The experimental results indicate that a high temperature annealing is desirable since it improves the electrical properties of the $ZrO_2$ gate dielectric thin films by decreasing the number of interfacial traps at the $ZrO_2/Si$ interface. The carrier transport mechanism is dominated by the thermionic emission.