• Journal of the Korean Society of Safety
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• v.11 no.2
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• pp.67-78
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• 1996

Gas sensing element, $\gamma-Fe_2O_3$was synthesized by dehydration, reduction, and oxidation of $$${\gamma}$-FeOOH, which was synthesized with $FeSO_4\;{\cdot}\;7H_2O$ and NaOH. They were produced as a bulk-type, a thick film-type. Then, their responses and mechanisms of response to the gas of liquefied-petroleum were studied. The qualities of gas sensing elements are decided by the structure and the relative surface area. In the process of $\alpha-FeOOH $synthesis, the effects of reaction conditions as the equivalent ratio, on the structure and the relative surface area of gas sensing element were observed. The changes of the structure were measured with XRD, SEM, TG-DTA and BET. The resistance changes of the synthesized gas sensor in the air were measured. The response ratio were also measured for the changes of working temperature and gas concentration. As a result of analysis with XRD, it was confirmed that the the best conditions for the synthesis of $\alpha -FeOOH$ were equivalent ratio 0.65. The thick film-type element of $\gamma-Fe_2O_3$responded more quickly than the bulk-type did. The structure and the relative surface area of the $\alpha-FeOOH $were confirmed as the important factors deciding gas response charcteristics.

• Transactions on Electrical and Electronic Materials
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• v.1 no.3
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• pp.14-17
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• 2000

Giga bit dynamic random access memory(DRAM) requires the capacitor of high dielectric films. Some metal oxides films have been proposed as the dielectric material . And Pt is one of the most promising electrode materials. However very little has been done in developing the etching technologoy Pt film. Therefore, it is the first priority to develop the technology for plasma etching of Pt film. In this study, the dry etching of Pt film was investigated in Inductively Coupled Plasma(ICP) etching system with Cl$_2$/Ar and HBr/Cl$_2$/Ar gas mixing. X-ray photoelectron spectroscopy (XPS) was used in analysis of sidewall residues for the understanding of etching mechanism. We found the etch residues on the pattern sidewall is mainly Pt-Pt, Pt-Cl and Pt-Br compounds, Etch profile was observed by Scanning Electron Spectroscopy(SEM) . The etch rate of Pt film at 10%, Cl$_2$/90% Ar gas mixing ration was higher than at 100%. Ar. Addition of HBr to Cl$_2$/Ar as an etching gas led to generally higher selectivity to SiO$_2$. And the etch residues were reduced at 5% HBr/5% Cl$_2$/90% Ar gas mixing ration. These pages provide you with an examples of the layout and style which we wish you to adopt during the preparation of your paper, Make the width of abstract to be 14cm.

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.200-204
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• 2011

In this paper, we deposited the tungsten carbon nitride (W-C-N; nitrogen gas flow of 2 sccm) and tungsten carbon (W-C) thin film on silicon substrate using rf magnetron sputter. Then the thin films annealed at $800^{\circ}C$ during 30 minute ($N_2$ gas ambient) for thermal damage. Nano-indenter was executed 16 points on thin film surface to measure the thermal stability, and we also propose the elastic modulus and the Weibull distribution, respectively. This nanotribology method provides statistically reliable information. From these results, the W-C-N thin film included nitrogen gas flow is more stable for film uniformities, physical properties and crystallinities than that of not included nitrogen gas flow.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.1
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• pp.60-63
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• 1999

Application of reactive ion etching (RIE) technique to Ta-Al alloy thin film with a thickness of $1000{\AA}$ was studied. $CF_{4}$ gas could be used effectively to etch the Ta-Al alloy thin film. The etching rate in the thin film with Ta content of 50 mol% was about $67{\AA}/min$. NO selectivity between the Ta-Al alloy film and $SiO_{2}$ film was observed during the etching using the $CF_{4}$ gas. The etching rate of the $SiO_{2}$ layer was 12 times faster than that of the Ta-Al alloy thin film. It was also observed that photoresist of AZ5214 was more useful than Shiepley 1400-27 in RIE with the $CF_{4}$ gas.

• Korean Journal of Soil Science and Fertilizer
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• v.30 no.4
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• pp.357-360
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• 1997

To fine out the concentration of $SO_2$ gas in plastic film house, the survey was conducted at 343 sites throughout the nation. The $SO_2$ concentration in plastic film house were similar both heating and non-heating, but $SO_2$ cocentration higher than 0.8ppm was detected at those with heating. The $SO_2$ concentration in plastic film house cultivated red-pepper higher than those of cucumber or tomato cultivation, and it was produced higher amounts at day time than night due to the higher temperature. In plastic film house with heating, $SO_2$ was leaked at brocken parts of heater and joint of stove pipe, sometimes, $SO_2$ discharged from smokestack was resucked with air. $SO_2$ concentration in the plastic film house with and without ventilation were 0.2 and 0.6ppm, respectively.

• Journal of the Korean Ceramic Society
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• v.48 no.1
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• pp.69-73
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• 2011

A $ZrO_2$ thin film as a corrosion protective layer was deposited on Zircaloy-4 (Z-4) clad material using $N_2O$ as a reactive gas by RF reactive magnetron sputtering at room temperature. The Z-4 substrate was located in plasma or out of plasma during the $ZrO_2$ deposition process to investigate mechanical and corrosive properties for the plasma immersion. Tetragonal and monoclinic phases were existed in $ZrO_2$ thin film immersed in plasma. We observed that a grain size of the $ZrO_2$ thin film immersed in plasma state is larger than that of the $ZrO_2$ thin film out of plasma state. In addition, the corrosive property of the $ZrO_2$ thin films in the plasma was characterized using the weight gains of Z-4 after the corrosion test. Compared with the $ZrO_2$ thin film immersed out of plasma, the weight gains of $ZrO_2$ thin film immersed in plasma were larger. These results indicate that the $ZrO_2$ film with the tetragonal phase in the $ZrO_2$ can protect the Z-4 from corrosive phenomena.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.2
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• pp.87-91
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• 2011

Single layer Sn doped $In_2O_3$ (ITO) films and ITO 50 nm / Au 10 nm / ITO 40 nm (IAI) multilayer films were prepared with electron beam assisted magnetron sputtering on glass substrates. The effects of the Au interlayer, post-deposition atmosphere annealing and intense electron irradiation on the methanol gas sensitivity were investigated at room temperature. As deposited ITO films did not show any diffraction peaks in the XRD pattern, while the IAI films showed the diffraction peak for $In_2O_3$ (400). In this study, the gas sensitivity of ITO and IAI films increased proportionally with the methanol vapor concentration and an intense electron beam irradiated IAI film shows the higher sensitivity than the others film. From the XRD pattern, it is supposed that increased crystallization promotes the gas sensitivity. This approach is promising in gaining improvement in the performance of IAI gas sensors used for the detection of methanol vapor at room temperature.

• Korean Journal of Materials Research
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• v.30 no.4
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• pp.169-175
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• 2020

Silicon nitride thin films are deposited by RF (13.57 MHz) magnetron sputtering process using a Si (99.999 %) target and with different ratios of Ar/N₂ sputtering gas mixture. Corning G type glass is used as substrate. The vacuum atmosphere, RF source power, deposit time and temperature of substrate of the sputtering process are maintained consistently at 2 ~ 3 × 10^-3 torr, 30 sccm, 100 watt, 20 min. and room temperature, respectively. Cross sectional views and surface morphology of the deposited thin films are observed by field emission scanning electron microscope, atomic force microscope and X-ray photoelectron spectroscopy. The hardness values are determined by nano-indentation measurement. The thickness of the deposited films is approximately within the range of 88 nm ~ 200 nm. As the amount of N₂ gas in the Ar:N₂ gas mixture increases, the thickness of the films decreases. AFM observation reveals that film deposited at high Ar:N₂ gas ratio and large amount of N₂ gas has a very irregular surface morphology, even though it has a low RMS value. The hardness value of the deposited films made with ratio of Ar:N₂=9:1 display the highest value. The XPS spectrum indicates that the deposited film is assigned to non-stoichiometric silicon nitride and the transmittance of the glass with deposited SiO₂-Si_xN_y thin film is satisfactory at 97 %.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.551-555
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• 1999

The deposition condition to obtain stoichiometric $Ta_2$O\ulcorner films, which is still controversial, using magnetron reactive sputtering was studied. The films were deposited by varying $O_2$gas flow rate with sputtering power and Ar gas flow rate of 200W and 60 sccm fixed. At the conditions of $O_2$ gas flow rate over 20 sccm, amorphous Tantalum oxide films with the refractive index of 2.1 and dielectric constant of 25 were deposited. Among those films, the capacitors dielectric properties of the film deposited at the condition of $O_2$ gas flow rate 50 sccm was best, the leakage current was 1$\times$10\ulcornerA/$\textrm{cm}^2$ at the electric field strength of 0.5 MC/cm and the breakdown field strength was over 2.0 MV/cm. This result could be explained from the analysis comparing with a standard sample using RBS because the composition of the film deposited at this condition was closest to the stoichiometric $Ta_2$O\ulcorner. The result of XPS analysis convinced that this film was stoichiometric $Ta_2$O\ulcorner film. A maximum cathode voltage was observed when $O_2$gas flow rate was 30 sccm. This shows that the Schiller's proposition that one can obtain stoichiometric films at the condition of maximum cathode voltage is not correct and more oxygen than that of the maximum voltage condition is necessary to deposit the stoichiometric Ta$_2$O\ulcorner films.

• Korean Journal of Soil Science and Fertilizer
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• v.31 no.1
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• pp.72-76
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• 1998

In order to investigate the emission pattern of sulphur dioxide gas from the soils in the plastic film house, the amounts of sulphur dioxide gas emitted from soils was periodically measured either in the plastic film house condition or in the incubator where the interior temperature was controlled to 10, 20. 30 and $40^{\circ}C$. Each soil was mixed with either mushroom, poultry, pig or fish meal compost at the rate of 0, 10, 20, 30, 40 and 50g/kg for individual treatment and then treated with addition of 50, 100, 150 and 200ml of water. A significant increase in the emission of sulphur dioxide gas was observed in the treatment of fish meal compost and such increase was initiated from the rate of l0g/kg, while little difference was observed in other treatments. Compared to upland soils, as control, the horticultural soils containing higher sulphur content emitted more sulphur dioxide. The emission of sulphur dioxide was favoured as temperature increased and was highest with the addition of 150ml of water.