• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.3 no.3
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• pp.231-236
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• 2005

HIC transport packaging to transport a high integrity container(HIC) containing dry spent resin generated from nuclear power plants is to comply with the regulatory requirements of Korea and IAEA for Type B packaging due to the high radioactivity of the content, and to maintain the structural integrity under normal and accident conditions. It must withstand 9 m free drop impact onto an unyielding surface and 1 m drop impact onto a mild steel bar in a position causing maximum damage. For the conceptual design of a cylindrical HIC transport package, three dimensional dynamic structural analysis to ensure that the integrity of the package is maintained under all credible loads for 9 m free drop and 1 m puncture conditions were carried out using ABAQUS code.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.5 no.3
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• pp.199-212
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• 2007

If a type IP-2 transport package were to be subjected to a free drop test and a penetration test under the normal conditions of transport, it should prevent a loss or dispersal of the radioactive contents and a more than 20% increase in the maximum radiation level at any external surface of the package. In this paper, we suggested the analytic method to evaluate the structural safety of a type IP-2 transport package using a thick steel plate for a structure part and a bolt for tying a bolt. Using an analysis a loss or dispersal of the radioactive contents and a loss of shielding integrity were confirmed for two kinds of type IP-2 transport packages to transport radioactive waste drums from a waste facility to a temporary storage site in a nuclear power plant. Under the free drop condition the maximum average stress at the bolts and the maximum opening displacement of a lid were compared with the tensile stress of a bolt and the steps in a lid, which were made to avoid a streaming radiation in the shielding path, to evaluate a loss or dispersal of radioactive waste contents. Also a loss of shielding integrity was evaluated using the maximum decrease in a shielding thickness. To verify the impact dynamic analysis for free drop test condition and evaluate experimentally the safety of two kinds of type IP-2 transport packages, free drop tests were conducted with various drop directions. For the tests we examined the failure of bolts and the deformation of flange to evaluate a loss or dispersal of radioactive material and measured the shielding thickness using a ultrasonic thickness gauge to assess a loss of shielding integrity. The strains and accelerations acquired from tests were compared with those by analyses to verify the impact dynamic analysis. The analytic results were larger than the those of test so that the analysis showed the conservative results. Finally, we evaluated the safety of the type IP-2 transport package under the stacking test condition using a finite element analysis. Under the stacking test condition, the maximum Tresca stress of the shielding material was 1/3 of the yielding stress. Two kinds of a type IP-2 transport package were safe for the free drop test condition and the stacking test condition.

• Journal of Ocean Engineering and Technology
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• v.21 no.1 s.74
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• pp.40-44
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• 2007

This paper presents the experimental results on slamming phenomenon. The air pressure cylinder was used to ensure repeatability of the impact. The results showed that the adopted experimental technique was excellent in terms of repeatability, compared to that of the free drop tests. The pressure time histories, magnitude of peak pressure and the behavior of jetspray were obtained. The flat specimen was tested for various incident angles. To estimate the incident speed of the specimen, a high-speed camera was used. The high-speed camera was also a useful tool in understanding the behavior.

• Journal of the Korean Society of Marine Environment & Safety
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• v.18 no.4
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• pp.365-370
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• 2012

International Organization for Standardization has recently published ISO 12215-5 which is the small craft-hull construction and scantling. According to ISO 12215-5 AnnexB, the scantling determination can be accomplished by drop test for craft with a length $L_H$ of 2.5m up to 6m and single-skin construction. The current method, however, of visual test has the issue where it is difficult to make an objective evaluation of ship body strength. In this study, in order to develop an evaluation system that can make a quantitative evaluation of the drop test of leisure boats, the domestic/foreign regulations on drop test of leisure boats are analyzed and the drop test evaluation system is designed, and the system applicability is reviewed through 5-meter level aluminum ship, and the issues incurred by the state of the ship and the posture while dropping were checked.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.35-40
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• 2006

Cushioning systems, which are cushion material and its designed configuration, are important to protect fragile items since they act as buffers between the impact force and the fragile product. As cushioning materials, several plastic foams are commonly used in industry. However, the utilization of the plastic material has been causing a solid waste problem and pollution. Thus, as an alternative cushion material to the plastic foams, a corrugated cushion, which is considered environmentally friendly and cheap material, was put into drop tests and its impact shock attenuation was investigated. Flat and free drop data were recorded and compared to the dynamic shock of EPS cushion. In addition, the mathematical model of the shock attenuation of the corrugated cushion was developed. The result showed that the corrugated cushion gave an excellent protection for items that were subjected to the limited number of drops. There was no significant difference of the shock absorbing ability between the EPS and corrugated cushions. Energy density model of cushioning material successfully explained the mechanical behavior and fatigue of the corrugated cushions.

• Elastomers and Composites
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• v.41 no.1
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• pp.40-48
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• 2006

Mechanical systems with rubber parts have been used widely in industry fields. The evaluation of the physical characteristics of rubber is important in rubber application. Rubber material is useful to machine component for excellent shock absorbing characteristics. The impact characteristics of rubber were examined by experimental and finite element method. The impact test was conducted with a free-drop type impact tester. The ABAQUS/Explicit was used for finite element analysis. In the finite element analysis, elastic modulus of rubber using impact force was used as dynamic modulus, which are measured and predicted with dynamic property test and WLF model. The analysis result was coincided with the experimental results.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.33-37
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• 2008

A noticeable amount of Kirkendall voids formed at the Sn-3.5Ag solder joint with electroplated Cu, and that became even more significant when an additive was added to Cu electroplating bath. With SPS, a large amount of voids formed at the $Cu/Cu_3Sn$ interface of the solder joint during thermal aging at $150^{\circ}C$. The in-situ AES analysis of fractured joints revealed S segregation on the void surface. Only Cu, Sn, and S peaks were detected at the fractured $Cu/Cu_3Sn$ interfaces, and the S peak decreased rapidly with AES depth profiling. The segregation of S at the $Cu/Cu_3Sn$ interface lowered interface energy and thereby reduced the free energy barrier for the Kirkendall void nucleation. The drop impact test revealed that the electrodeposited Cu film with SPS degraded drastically with aging time. Fracture occurred at the $Cu/Cu_3Sn$ interface where a lot of voids existed. Therefore, voids occupied at the $Cu/Cu_3Sn$ interface are shown to seriously degrade drop reliability of solder joints.

• Journal of Photoscience
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• v.5 no.1
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• pp.33-37
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• 1998

One macroscopic effect in the free-running Er:YAG laser is an accumulation of microscopic effects. Understanding of the exogenous water induced mechanical effect on the dental hard tissue by the Qswitched Er:YAG laser has an important impact on the further understanding of the free-running Er:YAG laser ablation on the dental hard tissue. The Q-switched Er:YAG laser (1-$\mu$s-long pulse width) was used in the recoil pressure measurement with an aid of water-jet system and a pressure transducer. The amplitude of the recoil pressure depends on the tooth surface conditions (dry and wet) and the volume of the water upon it. Wet surfaces yielded higher recoil pressure than that of dry, surface, and as the volume of the exogenous water drop increased, the amplitude of the recoil pressure increased also.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.