• Progress in Superconductivity
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• v.3 no.1
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• pp.87-90
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• 2001

We designed a high temperature superconducting rapid single flux quantum(RSFQ) T flip-flop(TFF) circuit using Xic and WRspice. According to the optimized circuit parameters, we fabricated the TFF circuit with $Y_1$$Ba_2$Cu$_3$$O_{7-x}$(YBCO) interface-controlled Josephson junctions. The whole circuit was comprised of five epitaxial layers including YBCO ground plane. The interface-controlled Josephson junction was fabricated with natural junction barrier that was formed by interface-treatment process. In addition, we report second design for a new flip-flop without ground palne.e.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.82-82
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• 1995

• 한국초전도학회:학술대회논문집
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• v.14
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• pp.52-52
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• 2004

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.14-14
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• 2003

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.272-275
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• 2002

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.276-277
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.80-80
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• 1998

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of the Korean Society of Propulsion Engineers
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• v.7 no.1
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• pp.28-39
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• 2003

Effects of the orifice internal flow such as cavitation and hydraulic flip on transverse injection into subsonic crossflows have been studied. The liquid column breakup length and the liquid column trajectory were measured by changing the orifice diameter (d), the orifice length/orifice diameter (L/d), the injection pressure and the shapes (sharp and round) of orifice entrance, and were compared with previous results. It is found that cavitation bubbles, which occur inside the sharp-edged orifice, make the liquid jet very turbulent and especially in the orifices with L/d ＝ 5 hydraulic flip appear as cavitation bubbles are emitted from the orifice. The breakup length is shorter as cavitation bubbles grows and hydraulic flip appears. However, the liquid column trajectories normalized by the effective diameter and the effective momentum ratio have a similar tendency irrespective of cavitation and hydraulic flip.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.