Design and Fabrication of High Temperature Superconducting Rapid Single Flux Quantum T Flip-Flop

고온 초전도 단자속 양자 T 플립 플롭 설계 및 제작

  • Kim, J. H. (Electronics and Telecommunications Research Institute) ;
  • Kim, S. H. (Electronics and Telecommunications Research Institute) ;
  • Jung, K. R. (Korea Institute of science and Technology) ;
  • Kang, J. H. (University of Inchon) ;
  • Syng, G. Y. (Electronics and Telecommunications Research Institute)
  • Published : 2001.01.01

Abstract

We designed a high temperature superconducting rapid single flux quantum(RSFQ) T flip-flop(TFF) circuit using Xic and WRspice. According to the optimized circuit parameters, we fabricated the TFF circuit with $Y_1$$Ba_2$Cu$_3$$O_{7-x}$(YBCO) interface-controlled Josephson junctions. The whole circuit was comprised of five epitaxial layers including YBCO ground plane. The interface-controlled Josephson junction was fabricated with natural junction barrier that was formed by interface-treatment process. In addition, we report second design for a new flip-flop without ground palne.e.

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