• Journal of the Korean Society of Visualization
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• v.7 no.2
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• pp.17-21
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• 2010

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.77-86
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• 2005

This paper is about the development of Automatic FPC(flexible printed circuit) punching instrument for the improvement of working condition and cost saving. FPC is used to detect the contact position of keyboard and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, The punching accuracy is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used fur the sake of cost down instead of using high quality vision systems for the factory automation. Test algorithms and programs showed good results to the designed automatic punching system and led to the increasement of productivity and huge cost down to law material like FPC by avoiding bad quality.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.981-984
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• 2004

This paper is about the development of Automatic FPC punching instrument. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. Test algorithm shows good results to the designed automatic punching system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.976-979
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• 2005

This paper is about the development of automatic FPC(flexible printed circuit) punching instrument for the improvement of working condition and cost saving. FPC is used to detect the contact position of keyboard and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation Is done manually, the accuracy of the punching degree is varied with operator's condition. To improve this manual punch ing operation to the FPC, automatic FPC punching system is introduced. Test algorithms and programs showed good results to the designed automatic punching system and led to the increasement of productivity and huge cost down to law material like FPC by avoiding bad quality.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.154-158
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• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• Journal of the Korea Society for Simulation
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• v.5 no.2
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• pp.1-12
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• 1996

Utilizing the simulation approaches, the dynamic production scheduling system FOLS(Flexible flowshop On-Line Simulation) is developed under the flexible flowshop environment. When an interruption such as machine failure/recovery is occurred at the shop floor, the FOLS system performs evaluations for job selection rule oriented alternatives, and generates a dynamic production schedule based on the collected current shop floor data. For the case study, the FOLS system is applied to the printed circuit card assembly(PCCA) line and simulation results are reported.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.63-67
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• 2014

As the demand for fine-pitch FPCB (Flexible Printed Circuit Board) increases, so do the number of applications of sputtered FCCL (Flexible Copper Clad Laminate). Furthermore, as the width between the circuit patterns decreases, greater defects are observed in the migration phenomenon. In this study we observed changes in ion migration in real circuit-pattern width using sputtered FCCL. We found that as the applied voltage and residue thickness of the NiCr seeds increase, ion migration occurs faster. If the NiCr seed layer thickens due to a high cathode power and long deposition time while being sputtered, the NiCr will form a residue that quickly becomes a factor for incurring ion migration.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.63.1-63.1
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• 2012

In recent years, the functional inks for printed electronics that can be combined with a variety of printing techniques have attracted increasingly significant interest for use in low cost, large area, high performance integrated electronics and microelectronics. In particular, the development of solution-processable conductor, semiconductor and insulator materials is of great importance as such materials have decisive impacts on the electrical performance of various electronic devices, and, therefore, need to meet various requirements including solution processability, high electrical performance, and environmental stability. Semiconductor inks such as IGO, CIGS are synthesized by chemical solution method and microwave reaction method for TFT and solar cell application. Fine circuit pattern with high conductivity, which is valuable for flexible electrode for PCB and TSP devices, can be printed with highly concentrated and stabilized conductor inks such as silver and copper. Solution processed insulator such as polyimide derivatives can be use to all printed TFT device. Our research results of functional inks for printed electronics provide a recent trends and issues on this area.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.4
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• pp.371-377
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• 2017

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

• Journal of Sensor Science and Technology
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• v.26 no.4
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• pp.245-250
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• 2017

A novel method to implement a birdcage-type receiving coil sensor for use in a magnetic resonance imaging(MRI) system has been demonstrated employing a flexible printed circuit board (FPCB) fabrication technique. Unlike the conventional methods, the two-dimensional shape of the coil sensor is first implemented as a FPCB and then it is attached to the surface of a cylindrical supporting structure to implement the three-dimensional birdcage-type coil sensor. The proposed method is very effective to implement object-specific MRI coil sensors especially for small animal measurements in research and preclinical applications since the existing well-developed FPCB-based techniques can easily meet the requirements on accuracies and costs during coil implement process. The performances of the coil sensor verified through $^1H$ 1.5T MRI measurements for small animals and it showed excellent characteristics by providing a high spatial precision and a high signal-to-noise ratio.