• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.14 no.1
• /
• pp.1-8
• /
• 2008

New concepts and solutions for the Flexible Food Packaging Design have been demanded to meet the various customer's needs and to compete with other worldwide products. Future-oriented designs beyond the basic functions of preserving and protecting contents can only meet the demands on product's reliability and consumer's satisfaction, specially considering environmental issues. This study is to describe the spiritual values of Korean Flexible Food Packaging Design on the basis of comprehensive understanding and to identify the process of changes and developments. The thesis also forecasts the future of Flexible Food Packaging. Little progress in the Flexible Food Packaging has been made because of the slow response, only to meet the increasing demand without any statistical or theoretical study. On the contrary, Korean Flexible Food Packaging Design has been developed by imitating foreigners' and made mistake of not creating original design reflecting a native traditional culture. This study researches the roles of food-classified flexible packaging to predict the near future trend of packaging industry classifying those into functional, visual, environmental and industrial aspects.

• The monthly packaging world
• /
• s.364
• /
• pp.110-116
• /
• 2023

미국 연포장협회(Flexible Packaging Association∙FPA)는 최근 제67회 '2023 우수 연포장상'(2023 Flexible Packaging Achievement Award) 수상작을 발표했다. 수상작은 지난 3월 미국 플로리다주 아멜리아섬 리츠칼튼에서 열린 '2023년 FPA 연차 총회'와 함께 열린 'FPA 웰컴 디너 & 플렉시블 포장 공로상'시상식을 통해 공개됐다. 대회 수상작들은 재료, 그래픽, 구조, 새로운 용도, 연장된 보관 수명 및 지속 가능성의 발전 등 시장의 기대와 요구를 충족하는 포장 솔루션을 선보였다. 올해 대회에서는 총 323개 출품작과 함께 87개 패키지 출품작이 제출(일부 패키지는 여러 카테고리에 포함)되었으며 30개의 패키지가 총 38개의 상을 수상했다. 지면을 통해서는 최고상과 골드어워드 수상작을 소개한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.74-78
• /
• 2002

MEMS공정을 이용하여 폴리실리콘의 piezoresistivity를 이용한 스트레인 센서어레이를 제작하였고, 이 센서 어레이를 flexible substrate에 패키징하는 공정을 개발하였다. 실리콘 웨이퍼에 표면 가공(surface micromachining)된 센서는 폴리이미드 코팅, release-etch 방법을 통해 웨이퍼로부터 분리되어 폴리이미드를 기판으로 하는 flexible sensor array module을 완성할 수 있었다. 공정은 희생층과 절연층을 증착하고 폴리실리콘 0.5 $\mu\textrm{m}$을 증착, 도핑 및 패터닝하여 센서 어레이를 구성하였다. 이 센서어레이를 flexible substrate에 패키징 하기 위해서 폴리이미드를 코팅하여 15 $\mu\textrm{m}$의 막을 구성하였고, 100% $O_2$RIE를 이용한 선택적 식각 방법으로 via hole을 구성하였다. 이후 전기도금을 통해 회로를 구성하여 1단계 패키징(die to chip carrier)과 2단계 패키징(chip to substrate)을 웨이퍼 레벨에서 완성하였다. 희생층을 제거함으로서 웨이퍼로부터 센서어레이 모듈을 분리하였다. 제작되어진 센서 모듈은 임의의 곡면에 실장이 가능하도록 충분한 flexibility를 얻을 수 있었다.

• The monthly packaging world
• /
• s.200
• /
• pp.89-93
• /
• 2009

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.1
• /
• pp.29-36
• /
• 2004

A flexible packaging scheme, which includes chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending tests and finite element analysis. Thinned silicon chips (t<30 $\mu\textrm{m}$) are fabricated by chemical etching process to avoid possible surface damages on them. And the chips are stacked directly on $Kapton^{Kapton}$film by thermal compressive bonding. The low height difference between the thinned silicon chip and $Kapton^{Kapton}$film allows electroplating for electrical interconnection method. Because the 'Chip' is embedded in the flexible substrate, higher packaging density and wearability can be achieved by maximized usable packaging area.

• The monthly packaging world
• /
• s.128
• /
• pp.54-55
• /
• 2003

• The monthly packaging world
• /
• s.196
• /
• pp.42-43
• /
• 2009

• The monthly packaging world
• /
• s.249
• /
• pp.88-107
• /
• 2014

• The monthly packaging world
• /
• s.264
• /
• pp.60-73
• /
• 2015

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.19-28
• /
• 2016

This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.