• Journal of the Korean Society for Precision Engineering
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• v.25 no.10
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• pp.67-76
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• 2008

In this research, a simple technique for designing PID controller, which guarantees robust stability for two-mass systems with parameter uncertainties as well as rigid-body behavior and zero steady-state error,is described. As well, such a PID controller is designed to mate two important frequencies, at which the given system is excited, very close so that an appropriate reference profile generated by using command shaping techniques can cover those two frequencies. Root-locus analysis. which shows traces of closed-loop poles for the given system, is used to design this PID controller. Finally, feedforward controller is added to improve tracking performance of the closed-loop system. Simulation for a system with a flexible mode and parameter uncertainties is executed to prove the feasibility of this technique.

• Journal of Industrial Technology
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• v.24 no.B
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• pp.193-198
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• 2004

We propose and analyse a flexible secure file sharing scheme which can be used for data sharing among members in P2P environment. When a member wants to share data, notification messages are sent to the members with whom the member wants to share data. Each notification message includes one-time password encrypted with the receiver's public key. A member who received the notification message can download the data by using the one-time password. The proposed scheme provides selective sharing, download confirmation and efficient memory management. In terms of security, the proposed scheme supports authentication, entity privacy, replay attack protection and disguise prevention.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.482-483
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• 2003

We have synthesized a new material of polyoxetane based liquid crystalline polymer/liquid crystal (LCP/LC) for flexible memory or dynamic mode device and characterized the electro-optics behavior of this system. The microscopic dynamic behavior of main chain, side chain, and the low molecular weight LC were characterized by X-ray scattering and time resolved FTIR..

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.94-101
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• 2004

This paper presents the development of a keypad test system for the improvement of working environment and productivity using PTC 16F877 microprocessor. In order to detect the fault of keypad products, hardware and software design is performed in this system. Keypad fault detection system is controlled by the 8 bit one chip PIC microcontroller for the exactness and speed. Developed panel of the keypad test system is comprised of the sub-panel for selecting in the inspected keypad types and the main panel f3r displaying the working order and fault position. Furthermore, all data from keypad inspection are stored in main memory of personal computer for the database. All these functions lead to the improvement of working speed and environment.

• The Journal of the Acoustical Society of Korea
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• v.25 no.4E
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• pp.137-141
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• 2006

This paper presents HE-AAC decoder optimization on TMS320C55x fixed-point DSP core using a DSP-C like FFR code, which provides fast and flexible porting to a DSP core. Our optimization efforts are focused on methodologies that include general optimization methods of FFR code suitable for general DSP or RISC platform in high-level language and software optimization methods in assembly language level. The implementation result requires 48 MIPS and 135 Kbytes memory space to decode 48 Kbps stereo using real Korean S-DMB data.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1998.04a
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• pp.165-172
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• 1998

The development of Reinforced Concrete member design modules is necessary for user to design structures easily. The purpose of this paper is to be available for a integrated system used structure design. This module is linked with central database for the benefit of minimizing time of design and user's efforts. In order to minimize memory space, all of data is stored in central database. Member design modules applied Object-Oriented concepts are possible to be reusible, flexible for member functions in classes. This modules can be operated both independent member design modules and a part of integrated system. Sooner or later, this modules will be related to member grouping modules by data.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.30B no.4
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• pp.27-36
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• 1993

This paper proposes a shortest path allocation algorithm over the processors on the hypercube system based on the message passing techniques with the optimized module allocation. On multiprocessor systems, how to divide one task into multiple tasks efficiently is an important issue due to the hardness of the life cycle estimation of each process. To solve the life cycle discrepancies, the appropriate task assignment to each processor and the flexible communications among the processors are indispensible. With the concurrent program execution on hypercube systems, each process communicaties to others with the method of message passing. And, each processor has its own memory. The proposed algorithm generates a callable tree out of the module, assigns the weight factors, constructs the allocation graph, finds the shortest path allocation tree, and maps them with hypercube.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.22.2-22
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• 2001

Recently, Reinforcement Learning (RL) methods in MDP have been extended and applied to the POMDP problems. Currently, hierarchical RL methods are widely studied. However, they have the drawback that the learning time and memories are exhausted only for keeping the hierarchical structure, though they aren´t necessary. On the other hand, our "Labeling Q-learning (LQ-learning) proposed previously, has no hierarchical structure, but adopts a characteristic internal memory mechanism. Namely, LQ-1earning agent percepts the state by pair of observation and its label, and the agent can distinguish states, which look as same, but obviously different, more exactly. So to speak, at each step t, we define a new type of perception of its environment ～ot = (ot, $\theta$t), where of is conventional observation, and $\theta$t is the label attached to the observation. Then the conventional ...

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.25-29
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• 2020

This study demonstrates direct-patternable amorphous TiO_x resistive switching (RS) device and the fabrication method using photochemical metal-organic deposition (PMOD). For making photosensitive stock solutions, Ti(IV) 2-ethylhexanoate was used as starting precursor. Photochemical reaction by UV exposure was observed and analyzed by Fourier transform infrared spectroscopy and the reaction was completed within 10 minutes. Uniformly formed 20 nm thick amorphous TiO_x film was confirmed by atomic force microscopy. Amorphous TiO_x RS device, formed as 6 × 6 ㎛ square on 4 ㎛ width electrode, showed forming-less RS behavior in ±4 V and on/off ratio ≈ 20 at 0.1 V. This result shows PMOD process could be applied for low temperature processed ReRAM device and/or low cost, flexible memory device.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.