• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1005-1008
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• 2008

Electronic Paper Displays (EPDs) incorporating electrophoretic foils have made digital reading as pleasant as reading normal print. We will report on progress to replace glass-based displays with light and robust plastic EPDs using only a few extra process steps in a standard TFT-LCD factory.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.995-997
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• 2005

A plastic substrate for flexible display is developed. The gas barrier and optical properties of the substrate is improved through depositing silicon oxide/nitride layer and coating polymer layer on plastic film by sputtering process and wet coating process. Roll to roll processes will guarantee the productivity in the whole production process of the plastic substrate.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.305-308
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• 2003

We fabricated a flexible ferroelectric liquid crystal (FLC) device containing polymer walls and networks which fix plastic film substrates. The device using 100-${\mu}m$-thick substrates could be bent in a radius of 7mm without disordering the FLC alignment. When sandwiched between polarizers a roll-up display with high-speed grayscale capability for moving-image displays was created.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.10-17
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• 2024

This paper discusses Chip On Film (COF) technology, one of the key technologies in flexible packaging to enable miniaturization and flexibility of electronic devices. COF attaches Display Driver IC (DDI) directly to a flexible polyimide substrate, enabling lightweight and reduced thickness for high-resolution displays. COF technology is primarily used in high-performance display panels, such as organic light emitting diode (OLED) displays, and plays a key role in portable electronic devices, such as smartphones and wearable devices. This study analyzes the key components of COF and advances in bonding technology. In particular, the introduction of modern bonding techniques, such as thermo-compression bonding and thermo-sonic bonding, has led to significant improvements in bonding reliability and electrical performance. These bonding techniques enhance the mechanical stability of COF packages while maintaining high electrical connectivity in fine-pitch structures. This paper will discuss the future development of COF bonding technology and its challenges and explore its potential as a next-generation display and advanced packaging technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.353-356
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• 2005

We have characterized the mechanical stability of the Pixel-Isolated Liquid Crystal (PILC) mode for plastic LC display applications. In our device, the LC molecules are fully isolated in the pixels by the phase-separated polymer walls. The experimental results of microscopic observation and electro-optic characterization show that our flexible PILC device has good mechanical stability against external point pressure or bending distortion due to the polymer walls in our structure.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.374-377
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• 2005

We proposed a new fabrication method for stable flexible LCDs using stamping method with durable elastomer such as poly(dimethylsiloxane) (PDMS). In the device, the LC molecules are isolated in pixels where LCs are surrounded by PDMS microstructure, and two substrates are tightly attached by phase separated polymer layer. The electro-optic characteristics of our cell are comparable to those of normal sample without PDMS microstructure. We propose cost-effective roll-to-roll process for large size of plastic LCDs with our method.

• Advanced Industrial SCIence
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• v.1 no.1
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• pp.16-22
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• 2022

Starting with cathode ray tubes, displays are forming markets in the order of active marix organic light emitting diode (AMOLED) after PDP (Plasma Display Panel) and LCD (Liquid Crystal Display). OLED is recognized as a key field for the development of each country preparing for the fourth industrial revolution, and especially Samsung Display and LG Display, which are the top industries in Korea, are leading the market with more than 90% of OLED shares. Currently, AMOLED has moved to the area that can be folded or bent. This technology is possible because TFT (Thin Film Transistor) and OLED may be formed on a flexible substrate. In the future, the technology will move to stretchable displays, and for this, the development of substrate materials is first, and then TFT and OLED devices should also be implemented with stretchable materials.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.203-206
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• 2007

The FLEXMatters initiative is building a collaboration of companies and universities to develop and produce flexible devices. Kent Displays leads the production of flexible displays using their bistable cholesteric technology. The FLEXMatters members are collaborating to develop the flexible manufacturing process that will are common to a wide variety of devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1763-1766
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• 2007

Three technical obstacles must be overcome to build a fruitful business in the nascent industry of flexible microelectronics: the self-heating effect of thin film transistors (TFTs), the thermal and mechanical durability of flexible devices, and the cost issue. The self-heating effect is controlled through TFT shape, TFT electrical performance, dimensional reduction and energy-efficient circuits. Plastic engineering is one of the keys to solving thermal and mechanical durability problems faced by flexible microelectronics devices. For the Suftla flexible microelectronics business to be viable, Suftla transfer yield must be sufficiently high to keep down device cost. Improving the transfer yield is not easy, but it is the same challenge already faced and cleared in the TFT liquid crystal display industry.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.153-156
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• 2004

A newly developed flexible active-matrix (AM-) electrophoretic display (EPD) is reported. The AM-EPD features: (1) low-temperature polycrystalline silicon (LTPS) thin film transistor (TFT) technology, (2) fully integrated scan- and data-drivers, (3) flexibility and light-weight realized by transferring the whole circuits onto a plastic substrate using $SUFTLA^{TM}$ (Surface Free Technology by Laser Annealing/Ablation) process. A large storage capacitor is formed in each pixel so that driving electric field can be kept sufficiently strong during a writing period Two-phase driving scheme, a reset-phase which erases a previous image and a writing-phase for writing a new image, was chosen to cope with EPD's high driving voltage. The flexible AM-EPD has been successfully operated with a driving voltage of 8.5 V.