Technical Obstacles to Suftla Flexible Microelectronics

Three technical obstacles must be overcome to build a fruitful business in the nascent industry of flexible microelectronics: the self-heating effect of thin film transistors (TFTs), the thermal and mechanical durability of flexible devices, and the cost issue. The self-heating effect is controlled through TFT shape, TFT electrical performance, dimensional reduction and energy-efficient circuits. Plastic engineering is one of the keys to solving thermal and mechanical durability problems faced by flexible microelectronics devices. For the Suftla flexible microelectronics business to be viable, Suftla transfer yield must be sufficiently high to keep down device cost. Improving the transfer yield is not easy, but it is the same challenge already faced and cleared in the TFT liquid crystal display industry.