• Title/Summary/Keyword: flexible device

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Analysis of Environment-friendly features in the unit of Environment-friendly Certificated Apartment (친환경인증아파트 단위주거의 친환경적 계획요소 분석)

  • Lee, Song-Hyun;Hwang, Yeon-Sook
    • Korean Institute of Interior Design Journal
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    • v.15 no.6 s.59
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    • pp.150-158
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    • 2006
  • The purpose of this study is to evaluate environment-friendly planning feature in Environment-friendly Certificated apartments and to use the basic planning data of housing. Seven Environment-friendly Certificated apartments have been analyzed. The findings of this study are as follows: Environment-friendly planning features are categorized into 4 items; floor planning feature, material planning feature, universal planning feature and environmental planning feature. Among floor planning features, natural sunlight, built-in closets, and differentiated floor plans are well considered, but the flexible floor plan for resident's lifestyle and green space are lack. Among material planning features, environment-friendly finishing materials, environment-friendly products and energy-efficient double-pane windows are well considered, but implementation for resource savings using recycled materials are lack. Among universal design planning features, removal of threshold and installation of safety device in bathroom are not well considered. Among environmental planning features, usage of alternative energy like solar energy are not applied. The environment-friendly planning features in interior space should be introduced in diverse ways.

An Analysis of FCCL Shielding Effect for EMF Attenuation to On-Line Electric Vehicle (On-Line Electric Vehicle의 EMF 저감을 위한 FCCL 차폐효과 분석)

  • Shim, Hyung-Wook;Kim, Jong-Woo;Cho, Dong-Ho
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.6
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    • pp.770-775
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    • 2014
  • According to ICNIRP guidelines for limiting exposure to time-varying electric, magnetic and electromagnetic fields up to 300GHz, magnetic flux density which range from 3Hz to 150kHz are regulated to lower than $6.25{\mu}T$. In order to comply with its standard, OLEV(On-Line Electric Vehicle) have been designed considering EMF(Electro-Magnetic Field) reduction. However, if a current flowing in power line would be bigger for increasing power transfer efficiency, the established shield system no longer acts their role properly. In this paper, therefore, FCCL(Flexible Copper Clad Laminate) is applied to power line and pick-up devices to solve the problems. Though, the FCCL is normally utilized to insulator on circuit board, because of its high heat resistance characteristic, flexibility and thin properties, it makes effectiveness in the shielding device as well. 4 types of FCCL shielding structure are introduced to power line and pick-up devices. From the results, the FCCL which are placed in proposed positions shows maximum EMF reduction compared to the established shielding structure. Henceforth, if OLEV is applied FCCL shielding structure in practice, it will not only be more safe but also step forward to commercialization near future.

A Study on Wet Etch Behavior of Zinc Oxide Semiconductor in Acid Solutions

  • Seo, Bo-Hyun;Lee, Sang-Hyuk;Jeon, Jea-Hong;Choe, Hee-Hwan;Lee, Kang-Woong;Lee, Yong-Uk;Seo, Jong-Hyun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.926-929
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    • 2007
  • A significant progress has been made in the characterization of zinc oxide (ZnO) semiconductor as a new semiconductor layer instead of amorphous Si semiconductor used in thin film transistor due to its high electron mobility at low deposition temperature which is quite suitable for flexible display and OLED devices. The wet pattering of ZnO is another important issue with regard to mass production of ZnO thin film transistor device. However, the wet behavior of ZnO thin film in aqueous wet etching solutions conventionally used un TFT industry has not been reported yet, in this work, wet corrosion behavior of RF magnetron sputtered ZnO thin film in various wet solutions such as phosphoric and nitric acid solutions was studied using by electrochemical analysis. The effects of deposition parameters such as RF power and oxygen partial pressure on corrosion rate are also examined.

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Fabrication of Flexible OTFT Array with Printed Electrodes by using Microcontact and Direct Printing Processes

  • Jo, Jeong-Dai;Lee, Taik-Min;Kim, Dong-Soo;Kim, Kwang-Young;Esashi, Masayoshi;Lee, Eung-Sug
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.155-158
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    • 2007
  • Printed organic thin-film transistor(OTFT) to use as a switching device for an organic light emitting diode(OLED) were fabricated in the microcontact printing and direct printing processes at room temperature. The gate electrodes($5{\mu}m$, $10{\mu}m$, and $20{\mu}m$) of OTFT was fabricated using microcontact printing process, and source/drain electrodes ($W/L=500{\mu}m/5{\mu}m$, $500{\mu}m/10{\mu}m$, and $500{\mu}m/20{\mu}m$) was fabricated using direct printing process with hard poly(dimethylsiloxane)(h-PDMS) stamp. Printed OTFT with dielectric layer was formed using special coating system and organic semiconductor layer was ink-jet printing process. Microcontact printing and direct printing processes using h-PDMS stamp made it possible to fabricate printed OTFT with channel lengths down to $5{\mu}m$, and reduced the process by 20 steps compared with photolithography. As results of measuring he transfer characteristics and output characteristics of OTFT fabricated with the printing process, the field effect characteristic was verified.

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A Study on the Optimal Machining of 12 inch Wafer Polishing by Taguchi Method (다구찌 방법에 의한 12인치 웨이퍼 폴리싱의 가공특성에 관한 연구)

  • Choi, Woong-Kirl;Choi, Seung-Gun;Shin, Hyun-Jung;Lee, Eun-Sang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.6
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    • pp.48-54
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    • 2012
  • In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon. However, for many companies, it is hard to produce 400mm or 450mm wafers, because of excesive funds for exchange the equipments. Therefore, it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This research investigated the surface characteristics that apply variable machining conditions and Taguchi Method was used to obtain more flexible and optimal condition. In this study, the machining conditions have head speed, oscillation speed and polishing time. By using optimum condition, it achieves a ultra precision mirror like surface.

Modeling of Sound-structure Interactions for Designing a Piezoelectric Micro-Cantilever Acoustic Vector Sensor (압전 미세 외팔보 형 수중 음향 벡터센서의 작동 원리와 설계 기법)

  • Yang, Seongkwan;Kim, Junsoo;Moon, Wonkyu
    • The Journal of the Acoustical Society of Korea
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    • v.34 no.2
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    • pp.108-116
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    • 2015
  • An acoustic vector sensor is a device that is capable of measuring the direction of wave propagation and the acoustic pressure. In this paper, the modeling of micro-cantilever sensor for the vector sensor are proposed by consideration of acoustic phenomenon in water. Two models based on unimorph structure are proposed in this paper and corresponding transfer function which describes the relation between input pressure wave and output voltage depending on incidence angle and frequency of pressure wave is derived based on lumped model. It has been shown that very thin and flexible micro-cantilever can be used to measure directly the particle velocity component in water.

Design and Implementation of Data Protocol for Environmental Information Monitoring in Wired and Wireless Networks (유무선 통신망에서 운용 가능한 환경정보 모니터링 데이터 프로토콜 설계 및 구현)

  • Ye, Seoung-Bin;Ceong, Hee-Taek;Han, Soon-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.2
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    • pp.312-320
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    • 2010
  • Most online monitoring systems of running currently based on the wired network and local area wireless network generate an increase of administrative costs such as synchronization of data protocol conversion, flexible operation of measurement devices and maintenance. To solve this problem, this paper proposes the SMS data transmission protocol which allows multiple data collecting device to manage effectively including implementation method of cdma-based environmental information monitoring system. Also this paper shows operational safety of the proposed protocol and analyzes efficiency of data transfer and operating using SMS.

Digital-Radio Conversion System using Vector Synthesis Method (벡터합성방법에 의한 디지털-무선 변환시스템)

  • Joo Chang Bok;Kim Sung Ho
    • Journal of the Institute of Convergence Signal Processing
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    • v.1 no.2
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    • pp.131-137
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    • 2000
  • In this paper, as a compatible software radio transmission system, Digital-Radio conversion system which can directly change the digital signal generated by the logic circuit into radio signal is proposed. By the vector synthesis method, the digital signals can change directly into radio signal. If such a circuit is realized, RF circuit and an antenna can be composed by the simple one device, and the radio is directly controlled and performed by the software processing which is the essence of software radio. This Digital-Radio conversion system of this paper give many number of communication channels being offered by PN code and offer a hardware design flexibility by digitization, therefore it decrease the percentage ratio of hardware of system and give a more flexible function of software basis. In this paper, the principle of digital to radio signal generation algorithm is explained and the performance characteristics of proposed algorithm is shown in time base by the computer simulation method.

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Rapid Thermal Annealing at the Temperature of 650℃ Ag Films on SiO2 Deposited STS Substrates

  • Kim, Moojin;Kim, Kyoung-Bo
    • Applied Science and Convergence Technology
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    • v.26 no.6
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    • pp.208-213
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    • 2017
  • Flexible opto-electronic devices are developed on the insulating layer deposited stainless steel (STS) substrates. The silicon dioxide ($SiO_2$) material as the diffusion barrier of Fe and Cr atoms in addition to the electrical insulation between the electronic device and STS is processed using the plasma enhanced chemical vapor deposition method. Noble silver (Ag) films of approximately 100 nm thickness have been formed on $SiO_2$ deposited STS substrates by E-beam evaporation technique. The films then were annealed at $650^{\circ}C$ for 20 min using the rapid thermal annealing (RTA) technique. It was investigated the variation of the surface morphology due to the interaction between Ag films and $SiO_2$ layers after the RTA treatment. The results showed the movement of Si atoms in silver film from $SiO_2$. In addition, the structural investigation of Ag annealed at $650^{\circ}C$ indicated that the Ag film has the material property of p-type semiconductor and the bandgap of approximately 1 eV. Also, the films annealed at $650^{\circ}C$ showed reflection with sinusoidal oscillations due to optical interference of multiple reflections originated from films and substrate surfaces. Such changes can be attributed to both formation of $SiO_2$ on Ag film surface and agglomeration of silver film between particles due to annealing.

Reconstruction of a scalp defect due to cochlear implant device extrusion using a temporoparietal fascia flap and a split-thickness skin graft from the scalp

  • Kang, Jae Kyoung;Lee, Jae Seong;Suh, Michelle;Lim, Gil Chae;Shin, Myoung Soo;Yun, Byung Min
    • Archives of Craniofacial Surgery
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    • v.20 no.5
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    • pp.319-323
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    • 2019
  • Cochlear implant extrusion, which is a common complication of cochlear implants, is generally repaired by a well visualized soft-tissue flap. A 61-year-old female patient with a medical history of schizophrenia who had a skin ulcer that caused cochlear implant extrusion, but that would be a stronger statement was referred to our department for removal of the implant and reconstruction of the resultant scalp defect. Accordingly, the broad defect was covered via rotation of a temporoparietal fascia flap (TPFF) using the superficial temporal artery, with the pedicle in the preauricular region as the pivot point. Coverage of TPFF was achieved with a split-thickness skin graft using the scalp as the donor site, which led to a quick recovery after the operation and satisfactory results in terms of aesthetics. This case suggests that a TPFF might be used as a flexible flap with low donor site morbidity for reconstructing cases of cochlear implant extrusion accompanied by a large full-layer scalp defect.