• Title/Summary/Keyword: finite difference expansion

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HIGH-SPEED FLOW PHENOMENA IN COMPRESSIBLE GAS-LIQUID TWO-PHASE MEDIA (압축성 기-액 이상매체중의 고속 유동현상)

  • Shin, Byeong-Rog
    • 한국전산유체공학회:학술대회논문집
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    • 2007.10a
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    • pp.249-257
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    • 2007
  • A high resolution numerical method aimed at solving gas-liquid two-phase flow is proposed and applied to gas-liquid two-phase shock tube problem. The present method employs a finite-difference 4th-order Runge-Kutta method and Roe's flux difference splitting approximation with the MUSCL TVD scheme. By applying the homogeneous equilibrium cavitation model, the present density-based numerical method permits simple treatment of the whole gas-liquid two-phase flow field, including wave propagation and large density changes. The speed of sound for gas-liquid two-phase media is derived on the basis of thermodynamic relations and compared with that by eigenvalues. By this method, a Riemann problem for Euler equations of one dimensional shock tube was computed. Numerical results such as detailed observations of shock and expansion wave propagations through the gas-liquid two-phase media and some data related to computational efficiency are made. Comparisons of predicted results and exact solutions are provided and discussed.

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GAS-LIQUID TWO-PHASE HOMOGENEOUS MODEL FOR CAVITATING FLOW (캐비테이션 유동해석을 위한 기-액 2상 국소균질 모델)

  • Shin, Byeong-Rog
    • Journal of computational fluids engineering
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    • v.12 no.2
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    • pp.53-62
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    • 2007
  • A high resolution numerical method aimed at solving cavitating flow is proposed and applied to gas-liquid two-phase shock tube problem. The present method employs a finite-difference 4th-order Runge-Kutta method and Roe's flux difference splitting approximation with the MUSCL TVD scheme. By applying the homogeneous equilibrium cavitation model, the present density-based numerical method permits simple treatment of the whole gas-liquid two-phase flow field, including wave propagation and large density changes. The speed of sound for gas-liquid two-phase media is derived on the basis of thermodynamic relations and compared with that by eigenvalues. By this method, a Riemann problem for Euler equations of one dimensional shock tube was computed. Numerical results such as detailed observations of shock and expansion wave propagations through the gas-liquid two-phase media at isothermal condition and some data related to computational efficiency are made. Comparisons of predicted results and exact solutions are provided and discussed.

A Simplified Numerical Model for an Integral Abutment Bridge Considering the Restraining Effects Due to Backfill

  • Hong, Jung-Hee;Jung, Jae-Ho;You, Sung-Kun;Yoon, Soon-Jong
    • Journal of the Korea Concrete Institute
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    • v.15 no.5
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    • pp.759-767
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    • 2003
  • This paper presents the simplified but more rational analysis method for the prediction of additional internal forces induced in integral abutment bridges. These internal forces depend upon the degree of restraint provided tc the deck by the backfill soil adjacent to the abutments and piles. In addition, effect of the relative flexural stiffness ratio among pile foundations, abutment, and superstructure on the structural behavior is also an important factor. The first part of the paper develops the stiffness matrices, written in terms of the soil stiffness, for the lateral and rotational restraints provided by the backfill soil adjacent to the abutment. The finite difference analysis is conducted and it is confirmed that the results are agreed well with the predictions obtained by the proposed method. The simplified spring model is used in the parametric study on the behavior of simple span and multi-span continuous integral abutment PSC beam bridges in which the abutment height and the flexural rigidity of piles are varied. These results are compared with those obtained by loading Rankine passive earth pressure according to the conventional method. From the results of parametric study, it was shown that the abutment height, the relative flexural rigidity of superstructure and piles, and the earth pressure induced by temperature change greatly affect the overall structural response of the bridge system. It may be possible to obtain more rational and economical designs for integral abutment bridges by the proposed method.

Thermal Deformation Analysis of L-shaped Composite During Cure Process by Viscoelastic Model (점탄성을 고려한 L-형상 복합재료 성형시 열변형 해석)

  • Seong, Dong-Yun;Kim, Wie-Dae
    • Composites Research
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    • v.33 no.4
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    • pp.220-227
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    • 2020
  • When curing the composite, the fibers have little thermal deformation, but the resin changes its properties with time and temperature, which leads to residual stress in the product. Residual stress is caused by the difference in the coefficient of thermal expansion of the fibers and resin during the curing process and the chemical shrinkage of the resin. This difference causes thermal deformation such as spring-in and warpage. Thermal deformation of composite structure is important issue on quality of product, and it should be considered in manufacturing process. In this study, a subroutine was developed to predict thermal deformation by applying 3-D viscoelastic model. The finite element analysis was verified by comparing the results of the plate analysis of the 2-D viscoelastic model. Spring-in of L-shaped structure was predicted and analyzed by applying the 3-D viscoelastic model.

Analysis of Warpage of Fan-out Wafer Level Package According to Molding Process Thickness (몰드 두께에 의한 팬 아웃 웨이퍼 레벨 패키지의 Warpage 분석)

  • Seung Jun Moon;Jae Kyung Kim;Euy Sik Jeon
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.4
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    • pp.124-130
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    • 2023
  • Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

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Prediction of Crack Pattern of Continuously Reinforced Concrete Track Induced by Temperature Change and Shrinkage of Concrete (온도 변화와 콘크리트 수축에 의한 연속철근 콘크리트궤도의 균열 발생 패턴 예측)

  • Bae, Sung Geun;Choi, Seongcheol;Jang, Seung Yup;Cha, Soo Won
    • Journal of the Korean Society for Railway
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    • v.17 no.4
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    • pp.270-280
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    • 2014
  • In this study, to examine the causes of cracks in continuously reinforced concrete tracks (CRCTs) and the main factors affecting cracking, a field survey on the status of cracks and crack patterns in the Gyeong-bu high speed line was conducted, and the crack patterns of CRCT due to the temperature difference between the top of the slab (TCL) and the bottom of the subbase (HSB) and the drying shrinkage of concrete were predicted by a nonlinear finite element model considering the structure of CRCT. The results of the numerical analysis show that cracks will be developed at the interface between the sleeper and the TCL, and under the sleeper due to the temperature difference and concrete shrinkage. This corresponds well to the crack locations found in the field. Also, it is found that the most significant factors are the coefficient of thermal expansion with respect to the temperature difference, and the drying shrinkage strain with respect to shrinkage. According to the results, the reinforcement ratio should be carefully determined considering the structures of CRCT because the crack spacing is not always proportional to the reinforcement ratio due to the sleepers embedded in the TCL.

On the Improvement of the Accuracy of Higher Order Derivatives in the MLS(Moving Least Square) Difference Method via Mixed Formulation (MLS 차분법의 결정 변수에 따른 정확도 분석 및 혼합변분이론을 통한 미분근사 성능향상)

  • Kim, Hyun-Young;Kim, Jun-Sik
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.33 no.5
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    • pp.279-286
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    • 2020
  • In this study, we investigate the accuracy of higher order derivatives in the moving least square (MLS) difference method. An interpolation function is constructed by employing a Taylor series expansion via MLS approximation. The function is then applied to the mixed variational theorem in which the displacement and stress resultants are treated as independent variables. The higher order derivatives are evaluated by solving simply supported beams and cantilevers. The results are compared with the analytical solutions in terms of the order of polynomials, support size of the weighting function, and number of nodes. The accuracy of the higher order derivatives improves with the employment of the mean value theorem, especially for very high-order derivatives (e.g., above fourth-order derivatives), which are important in a classical asymptotic analysis.

Expansion of Test Frequency Band and Improvements of Field Uniformity in a Reverberation Chamber by Using Dual-Band Diffusers (이중 대역 확산기를 이용한 전자파 잔향실 시험 주파수 대역 확장 및 전자기장 균일도 향상에 관한 연구)

  • Lim Wook-Chae;Rhee Joong-Geun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.1 s.104
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    • pp.74-80
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    • 2006
  • This paper presents the characteristics of electromagnetic field uniformity in a reverberation chamber that can be used alternatively for the analysis, test and evaluation of electromagnetic interference and immunity. The dual-band diffuser, which can be used at two different frequency bands in a reverberation chamber, is applied, and it is made of two different single-band Schroeder's Quadratic Residue Diffusers. The FDTD method is used to analyze the field characteristics. Compared with single-band diffuser, the dual-band diffuser shows the improvement in not only expansion of test frequency band but also in characteristics of the field uniformity, polarity, power efficiency, and tolerance. Therefore, the reverberation chamber with the dual-band diffuser is a better facility, for the analysis and measurement of electromagnetic interference and immunity, than the reverberation chamber with a single-band diffuser.

Warpage Improvement of PCB with Material Properties Variation of Core (코어 물성 변화에 따른 인쇄회로기판의 warpage 개선)

  • Yoon Il-Soung
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.2 s.39
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    • pp.1-7
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    • 2006
  • In this paper, warpage magnitude and shape of printed-circuit board in case that properties of core and thickness of solder resist are varied are investigated. The cause of warpage is coefficient of thermal expansion differences of stacked materials. Therefore, we need small difference of coefficient of thermal expansion that laminated material, and need to decrease asymmetric of top side and bottom side in structure shape. Also, we can control occurrence of warpage heightening hardness of core in laminated material. Composite material that make core are exploited in connection with the structural bending twisting coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. If we use such characteristic, we can control warpage with change of material properties. In this paper, warpage of two layer stacked chip scale package is investigated, and evaluate improvement result using an experiment and finite element method tool.

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Numerical simulation of dense interflow using the k-ε turbulence model (k-ε 난류모형을 이용한 중층 밀도류의 수치모의)

  • Choi, Seongwook;Choi, Sung-Uk
    • Journal of Korea Water Resources Association
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    • v.50 no.9
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    • pp.637-646
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    • 2017
  • This study presents a numerical model for simulating dense interflows. The governing equations are provided and the finite difference method is used with the $k-{\varepsilon}$ turbulence model. The model is used to simulate a dense interflow established in a deep ambient water, resulting velocity and excess density profiles. It is observed that velocity decreases in the longitudinal direction due to water entrainment in the vicinity of the outlet and rarely changes for increased Richardson number. Similarity collapses of velocity and excess density are obtained, but those of turbulent kinetic energy and dissipation rate are not. A shape factor for the dense interflow is obtained from the simulated profiles. The value of this shape factor can be used in the layer-averaged modeling of dense interflows. In addition, a buoyancy-related parameter ($c_{3{\varepsilon}}$) for the $k-{\varepsilon}$ model and the volume expansion coefficient (${\beta}_0$) are obtained from the simulated results.