• 제목/요약/키워드: fine-wire

검색결과 133건 처리시간 0.022초

마이크로 드릴링을 이용한 미세압출다이 가공에 관한 연구 (A study on the machining of micro-extruding die using micro-drilling)

  • 민승기;제태진;이응숙;이동주
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2003년도 춘계학술대회 논문집
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    • pp.161-166
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    • 2003
  • The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

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극세선 냉간 정수압 압출에서 금형과 윤활의 영향 (Effect of Die and Lubrication in Fine Wire Cold Hydrostatic Extrusion)

  • 나경환;박훈재;김승수;윤덕재;최태훈;김응주
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2002년도 금형가공 심포지엄
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    • pp.225-230
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    • 2002
  • As in most metal forming processes, die and lubrication are of vital importance in hydrostatic extrusion. An efficient die design and lubrication system selection reduce the pressure required for a given reduction ratio by lowering friction at the billet-die interface. In contrast to the conventional macroscopic extrusion, fine-wire fabrication requires higher extrusion pressure and effect of friction is much more significant. Forming fine Au, Ag, and Cu wire with hydrostatic extrusion process in cold condition, the effect of extrusion die angle, lubrication and billet's initial diameter was studied.

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극세선용 압출다이의 미세구멍 가공기술 연구 (A study on the micro-hole machining for micro-extruding die)

  • 민승기;제태진;이응숙;이동주
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.202-205
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    • 2002
  • The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\Phi$ 50${\mu}{\textrm}{m}$ micro-drill which is coated with diamond is used for drilling of super micro-hole sues. For the machining of taper parts of entrance and exit, drill having $\Phi$ 9mm inclination angle 20$^{\circ}$ is used. This is useful for anti tool-breakage in drilling process. After micro-drilling, the polishing process by abrasive is carried out for increasing surface roughness.

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다단 습식 신선공정 해석 및 적용 (Analysis of Multi-Pass Wet Wire Drawing Process and Its Application)

  • 이상곤;김병민
    • 소성∙가공
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    • 제14권8호통권80호
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    • pp.689-695
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    • 2005
  • Multi-pass wet wire drawing process is used to produce fine wire in the industrial field. The production of fine wire through multi-pass wet wire drawing process with appropriate dies pass schedule would be impossible without understanding the relationship among many process parameters such as material properties, dies reduction, friction conditions, drawing speed etc However, in the industrial field, dies pass schedule of multi-pass wet wire drawing process has been executed by trial and error of experts. This study investigated the relationship among many process parameters quantitatively to obtain the important process information fur the appropriate pass schedule of multi-pass wet wire drawing process. Therefore, it is possible to predict the many important process parameters of multi-pass wet wire drawing process such as dies reduction, machine reduction, drawing force, backtension force, slip rate, slip velocity rate, power etc. The validity of the analyzed drawing force was verified by FE simulation and multi-pass wet wire drawing experiment. Also, pass redesign was performed based on the analyzed results, and the wire breakage between the original pass schedule and the redesigned pass schedule was compared through experiment.

와이어 컷 방전가공에서 방전가공횟수가 파인 블랭킹 금형과 제품에 미치는 영향 (An Effect of Number of Passes in Wire-Cut Electric Discharge Machining on Fine Blanking Dies and Products)

  • 유헌일;김세환;최계광
    • 소성∙가공
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    • 제6권3호
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    • pp.192-202
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    • 1997
  • This study presents an effect of number of passes in wire-cut electric discharge machining on fine blanking dies and products. Three part fine blanking dies were produced by the difference of numbers of passes discharge machining. Brake pad was produced, through the die produced like that, the objective of this study is the improvement in surface roughness of die block and punch, life extension of die block, the decrease of second fracture dimensions, the rise of productive.

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미세 Si 입자의 영향을 고려한 $Al-1\%Si$ 본딩 와이어의 신선공정해석 (FE-Simulation on drawing process of $Al-1\%Si$ bonding wire considering influence of fine Si particle)

  • 황원호;문형준;고대철;김병민
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.393-396
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    • 2005
  • This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.

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하이브리드 용접에 의한 세립강 용접부의 기계적 성질에 관한 연구 (Mechanical Property of Ultra Fine Grained Steel Weld by Hybrid Welding)

  • 동현우;안용식
    • 동력기계공학회지
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    • 제15권1호
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    • pp.45-50
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    • 2011
  • The effect of Mn and Ti contents in filler wire on the microstructure and mechanical property of weld metal has been investigated after hybrid welding with ultra fine grained (UFG) steel. The microstructure and distribution of alloy compositions at the top region of weld zone were quite different with those at the bottom region after hybrid welding. The bottom region of weld zone contained higher Mn and Ti contents, and consequently the hardness of bottom region was higher than that of top region. With the increase of Mn and Ti contents in filler wire, the volume percent of acicular ferrite in weld metal decreased, and the weld zone showed higher hardness and better impact property.

마이크로 와이어의 전단 형상에 관한 실험적 연구 (An Experimental Study of burrless shearing on the micro wire)

  • 홍남표;김병희;김헌영;김웅겸
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.448-452
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    • 2005
  • Punching/blanking/shearing is among the oldest and most frequently used sheet metal forming process. We have developed the shear device for burrless cutting using the micro wire. Since the burr minimization and fine shear plane, this paper is a study on the effect of the shear angle and clearance of the cutter-cutter. And, we confirm the tendency of the shear plane. It is impossible to completely remove the burr in the shearing process. In order to minimize the burr size and fine shear plane, we have accomplished the various experiment conditions such as the shear angle and clearance. Despite the quality of shear plane is not good enough yet, it is possible to make the burr minimization and fine shear plane by the optimization of process parameters.

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초소형 광디스크 드라이브용 조동구동기의 동특성 평가 및 2-와이어 미세 구동기의 개발 (Evaluation of Dynamic Characteristics of Coarse Actuator and Design of a 2-Wire Fine Actuator for Small Form Factor ODD)

  • 박세준;이강녕;이동주;박노철;박영필
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 춘계학술대회논문집
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    • pp.351-351
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    • 2004
  • For greeting the era of ubiquitous network, data storage devices have been essentially attached to mobile data devices. As a result, the minimization of the storage device has arisen as major interests in the next generation data storage technology. So, there are many researches for the small form factor ODD. In this paper, we propose a pick up that consists of a linear VCM and 2-wire focusing actuator for a small form factor ODD. For the sake of checking performance of the coarse actuator, PID controller is designed. Experiment with controller and DSP board shows its propriety as a fine tracking actuator. And, 2-wire suspension actuator is designed in order to be contained in a coarse actuator and to satisfy the thickness of a PCMCIA type. Through the experiment of designed actuator, It verifies performance as a focusing actuator.

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Critical Cleaning Requirements for Flip Chip Packages

  • Bixenman, Mike;Miller, Erik
    • 마이크로전자및패키징학회지
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    • 제7권1호
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    • pp.61-73
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    • 2000
  • In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

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