Proceedings of the Korean Society for Technology of Plasticity Conference (한국소성가공학회:학술대회논문집)
- 2005.05a
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- Pages.393-396
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- 2005
FE-Simulation on drawing process of $Al-1\%Si$ bonding wire considering influence of fine Si particle
미세 Si 입자의 영향을 고려한 $Al-1\%Si$ 본딩 와이어의 신선공정해석
- Published : 2005.05.01
Abstract
This paper is concerned with the drawing process of