• Journal of the Korean Ceramic Society
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• v.41 no.4
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• pp.313-322
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• 2004

Thick film photolithography is a new technology in that the lithography process such as exposure and development is applied to the conventional thick film process including screen-printing. In this research, low-temperature cofireable silver paste, which enabled the formation of thick film fine-line using photolithographic technology, was developed. The optimum composition for fine-line forming was studied by adjusting the amounts of silver powder, polymer and monomer, and the additional amount of photoinitiator, and then the effect of processing parameter such as exposing dose on the formation of fine-line was also tested. As the result, it was found that the ratio of polymer to monomer, silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of fine-line. The developed photosensitive silver paste was printed on low-temperature cofireable green sheet, then dried, exposed, developed in aqueous process, laminated, and fired. Results showed that the thick film fine-line under 20$\mu\textrm{m}$ width could be obtained after cofiring.

• Polymer(Korea)
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• v.30 no.5
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• pp.407-411
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• 2006

The SiC-based ceramic nanopatterns were prepared by placing polydimethylsiloxane (PDMS) mold from DVD master on the spincoated polyvinylsilaeane (PVS) or allylhydridopolycaybosilane (AHPCS) as ceramic precursors to fabricate line pattern via UV-nanoimprint lithography (UV-NIL), and subsequent pyrolysis at $800^{\circ}C$ in nitrogen atmosphere. As the dimensional change of polymeric and ceramic patterns was comparatively investigated by AFM and SEM, the shrinkage in height was 38.5% for PVS derived pattern and 24.1% for AHPCS derived pattern while the shrinkage in width was 18.8% for PVS and 16.7% for AHPCS. It indicates that higher ceramic yield of the ceramic precursor resulted in less shrinkage, and the strong adhesion between the substrate and the pattern caused anisotropic shrinkage. This preliminary work suggests that NIL is a promissing route for fabricating ceramic MEMS devices, with the development on the shrinkage control.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.342-345
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• 2002

As the size of chip components and module decreases, new patteming method for fine line and geometry is needed. So far, in LTCC(Low Temperature Cofired Ceramic) process, screen printing method has been used generally. But screen printing method has some disadvantages as follows. First, the geometry including line, vias, etc. smaller than $100{\mu}m$ can't be evaluated easily. Second, the patterned dimension is different from designed value, which makes distortion in charactersitics of not only chip components but also modules. Thick film lithography has advantages of thick film screen printing process, low cost and thin film process, fine line feasibility. Using this method, the line with $30{\mu}m$ width and the geometry with expected dimension can be evaluated. In this study, the fine line with $35{\mu}m$ line/space is formed and the embedded capacitor with very small tolerance is developed using thick film lithography.

• Transactions of the Society of Information Storage Systems
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• v.1 no.1
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• pp.108-114
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• 2005

The generation of fine relics of suspensions is a significant interest as it holds the key to the fabrication of electronic devices. These processes offer opportunities for miniaturization of multilayer circuits, for production of functionally graded materials, ordered composites and far small complex-shaped components. Some novel printing methods of depositing ceramic and metal droplets were suggested in recent years. In an electro-hydrodynamic printing, the metallic capillary nozzle can be raised to several kilovolts with respect to the infinite ground plate or pin-type electrode positioned a few millimeters from the nozzle tip. Depending on the electrical and physical properties of the liquid, for a given geometry, it Is possible to generate droplets in any one of three modes, dripping, cone-jet and multi-jet. In this experiment, an alumina suspension flowing through a nozzle was subjected to electro-hydrodynamic printing using pin-type electrodes in the cone-jet mode at different applied voltages. The pin-type electrodes of 1, 100, 1000${\mu}m$ in diameter were used to form fine ceramic patterns onto the substrates. Various feature sizes with applied voltages and electrode diameters were measured. The feature sizes increased with the electrode diameter and applied voltages. The feature size was as fine as $30 {\mu}m$.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.157-161
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• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.303-303
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• 2007

Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then $50/50{\mu}m$ in line and space was obtained, which is difficult in screen printing method.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.158.1-158
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• 2003

• Journal of the Korean Ceramic Society
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• v.23 no.4
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• pp.35-40
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• 1986

The production process of a fine size fraction of Korean kaolin by ball milling is studied in this paper by analyzing the size distribution the size distribution of products with the Rosin-rammle formular and the rate process of cumulative size fractions with Alyavdin-Chujyo's formular. The size distribution is found to be divided in three regions a coarser part influenced by feed size an intermediate part where the size distribution shows a clear straight line relationship on Rosin-Rammler chart and the finest part with the ultimate limit of fineness by ball milling. Alyavdin-Chujyo's relationship is found to be valid over a very wide range of milling conditions. For different feed sizes the Alyavdin-Chujyo's relationship gives a group of straight lines with a common intersection point which can be defined as the limiting point of the persistent component region.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.768-771
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• 2003

Nowadays, the study on the ceramic components and modules used in telecommunication system is being performed. Duplexer is the one of the most important components and has the role of dividing Rx and Tx signal. Duplexer including the FBAR is being done vigorously LTCC is used for package like SAW package, duplexer package. In our research, LTCC material is used for FBAR duplexer package and photo-lithography for the fine line phase shifter. The good characteristics, low loss and good isolation, of duplexer is obtained by the fine line phase shifter having high characteristic impedance of stripline.

• Journal of the Korean Academy of Esthetic Dentistry
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• v.11 no.2
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• pp.33-36
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• 2002

As patients have concerned the esthetics of dental restorations, the porcelain fused to metal restorations have gain their popularity due to their strength and esthetic appearance for many years. However, metal collar in subgingival level of porcelain fused to metal restoration often causes black shadows. Inadequately positioned metal collar causes plaque depositions, gingival inflammations, black shadows, and discolorations of margin area. Those problems can be avoided by a clear finishing line, well-fabricated provisional restorations with precise margin and fine polishing, collarless porcelain fused to metal restoration, and all ceramic restoration. In this case report, collarless porcelain fused to metal restoration was used to treat cervical discoloration from old restorations.