• 제목/요약/키워드: film uniformity

검색결과 412건 처리시간 0.029초

Synthesis of Nanoporous Metal Oxide Films Using Anodic Oxidation and Their Gas Sensing Properties

  • Suh, Jun Min;Kim, Do Hong;Jang, Ho Won
    • 센서학회지
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    • 제27권1호
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    • pp.13-20
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    • 2018
  • Gas sensors based on metal oxide semiconductors are used in numerous applications including monitoring indoor air quality and detecting harmful substances like volatile organic compounds. Nanostructures, for example, nanoparticles, nanotubes, nanodomes, and nanofibers have been widely utilized to improve gas sensing properties of metal oxide semiconductors, and this increases the effective surface area, resulting in participation of more target gas molecules in the surface reaction. In the recent times, 1-dimensional (1D) metal oxide nanostructures fabricated using anodic oxidation have attracted great attention due to their high surface-to-volume ratio with large-area uniformity, reproducibility, and capability of synthesis under ambient air and pressure, leading to cost-effectiveness. Here, we provide a brief overview of 1D metal oxide nanostructures fabricated by anodic oxidation and their gas sensing properties. In addition, recent progress on thin film-based anodic oxidation for application in gas sensors is introduced.

Engineering of Bi-/Mono-layer Graphene Film Using Reactive Ion Etching

  • Irannejad, M.;Alyalak, W.;Burzhuev, S.;Brzezinski, A.;Yavuz, M.;Cui, B.
    • Transactions on Electrical and Electronic Materials
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    • 제16권4호
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    • pp.169-172
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    • 2015
  • Although, there are several research studies on the engineering of the graphene layers using different etching techniques, there is not any comprehensive study on the effects of using different etching masks in the reactive ion etching (RIE) method on the quality and uniformity of the etched graphene films. This study investigated the effects of using polystyrene and conventional photolithography resist as a etching mask on the engineering of the number of graphene layers, using RIE. The effects were studied using Raman spectroscopy. This analysis indicated that the photo-resist mask is better than the polystyrene mask because of its lower post processing effects on the graphene surface during the RIE process. A single layer graphene was achieved from a bi-layer graphene after 3 s of the RIE process using oxygen plasma, and the bi-layer graphene was successfully etched after 6 s of the RIE process. The bilayer etching time was significantly smaller than reported values for graphene flakes in previous research.

Polymer semiconductor based transistors for flexible display

  • 이지열;이방린;김주영;정지영;박정일;정종원;구본원;진용완
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.59.1-59.1
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    • 2012
  • Organic thin-film transistors (OTFTs) with printable semiconductors are promising candidate devices for flexible active-matrix (AM) display applications. Yet, stable operation of actual display panels driven by OTFTs has seldom been reported up to date. Here, we demonstrate a flexible reflective type polymer dispersed liquid crystal (PDLC) display, in which inkjet-printed OTFT arrays are used as driving elements with excellent areal uniformity in terms of device performance. As the active semiconductor, a novel, ambient processable conjugated copolymer was synthesized. The stability of the devices with respect to electrical bias stress was improved by applying a channel-passivation layer, which suppresses the environmental effects and hence reduces the density of trap states at the channel/dielectric interface. The combination of high performance and high stability OTFT devices enabled the successful realization of stable operating flexible color-displays by inkjet-printing.

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고균일 유기박막 코팅을 위한 모세관 현상 전산모사 (Simulation of Capillary Phenomenon for Solution Coating of High-uniformity Organic thin Films)

  • 신동균;홍기영;박종운;서화일
    • 반도체디스플레이기술학회지
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    • 제16권1호
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    • pp.106-111
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    • 2017
  • When a substrate with a pixel-defining layer (bank) is coated, there arises capillary force due to surface tension and adhesive forces between a solvent and the bank layer. It brings in a degradation of film thickness and emission uniformities within pixels. With an attempt to suppress it, we have performed fluid flow simulations of capillary arise by varying the contact angle of bank and the bank structure. We have first demonstrated that the fluid flow model can reproduce the capillary phenomenon that was observed experimentally. It has been found that capillary arise can be suppressed using a hydrophobic material for the bank layer. Furthermore, it was suppressed by tilting the sidewalls outwardly (i.e., using a positive photoresistor). We can obtain very uniform films when the slope is $50^{\circ}$ with the contact angle of $40^{\circ}$.

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Pulsed Magnet ron Sputtering Deposit ion of DLC Films Part II : High-voltage Bias-assisted Deposition

  • Chun, Hui-Gon;Lee, Jing-Hyuk;You, Yong-Zoo;Ko, Yong-Duek;Cho, Tong-Yul;Nikolay S. Sochugov
    • 한국표면공학회지
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    • 제36권2호
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    • pp.148-154
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    • 2003
  • Short ($\tau$=40 $mutextrm{s}$) and high-voltage ($U_{sub}$=2~8 kV) negative substrate bias pulses were used to assist pulsed magnetron sputtering DLC films deposition. Space- and time-resolved probe measurements of the plasma characteristics have been performed. It was shown that in case of high-voltage substrate bias spatial non-uniformity of the magnetron discharge plasma density greatly affected DLC deposition process. By Raman spectroscopy it was found that maximum percentage of s $p^3$-bonded carbon atoms (40 ~ 50%) in the coating was attained at energy $E_{c}$ ~700 eV per deposited carbon atom. Despite rather low diamond-like phase content these coatings are characterized by good adhesion due to ion mixing promoted by high acceleration voltage. Short duration of the bias pulses is also important to prevent electric breakdowns of insulating DLC film during its growth.wth.

Thermo-Piezoelectric Read/Write Mechanisms for Probe-Based Data Storage

  • Nam, Hyo-Jin;Kim, Young-Sik;Lee, Sun-Yong;Jin, Won-Hyeog;Jang, Seong-Soo;Cho, Il-Joo;Bu, Jong-Uk
    • 정보저장시스템학회논문집
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    • 제3권1호
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    • pp.47-53
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    • 2007
  • In this paper, a thermo-piezoelectric mechanism with integrated heaters and piezoelectric sensors has been studied for low power probe-based data storage. Silicon nitride cantilever integrated with silicon heater and piezoelectric sensor has been developed to improve the uniformity of cantilevers. Data bits of 40 nm in diameter were recorded on PMMA film. The sensitivity of the piezoelectric sensor was 0.615 fC/nm after poling the PZT layer. And, the $34\times34$ probe array integrated with CMOS circuits has been successfully developed by simple one-step bonding process. The process can simplify the process step and reduce tip wear using silicon nitride tip.

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Effect of Thermal Annealing on Nanoscale Thickness and Roughness Control of Gravure Printed Organic Light Emitting for OLED with PVK and $Ir(ppy)_3$

  • Lee, Hye-Mi;Kim, A-Ran;Kim, Dae-Kyoung;Cho, Sung-Min;Chae, Hee-Yeop
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1511-1514
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    • 2009
  • Organic light emitting layer in OLED device was formed by gravure printing process in this work. Organic surface coated by gravure printing typically showed relatively bad uniformity. Thickness and roughness control was characterized by applying various mixed solvents in this work. Poly (N-vinyl carbazole) (PVK) and fact-tris(2-phenylpyridine)iridium($Ir(ppy)_3$) are host dopant system materials. PVK was used as a host and Ir(ppy)3 as green-emitting dopant. To luminance efficiency of the plasma treatment on etched ITO glass and then PEDOT:PSS spin coated. The device layer structure of OLED devices is as follow Glass/ITO/PEDOT:PSS/PVK+Ir(ppy)3-Active layer /LiF/Al. It was printed by gravure printing technology for polymer light emitting diode (PLED). To control the thickness multi-printing technique was applied. As the number of the printing was increased the thickness enhancement was increased. To control the roughness of organic layer film, thermal annealing process was applied. The annealing temperature was varied from room temperature, $40^{\circ}C$, $80^{\circ}C$, to $120^{\circ}C$.

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대면적 플랙시블 기판용 회전자석형 마그네트론 소스 개발 (Development of rotary-magnet type magnetron source for large area sputtering on flexible substrate)

  • 조찬섭;윤성호;김봉환;김광태;정영철;이종현
    • 반도체디스플레이기술학회지
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    • 제11권2호
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    • pp.1-6
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    • 2012
  • In this study, a high performance rotary magnet type magnetron source for roll-to-roll sputter system has been developed. We analyzed the density of magnetic field as a function of size variation of the magnet which are in the center and edge of the target. The target efficiency showed the best result when the width of center magnet, the width of edge magnet, the angle of edge magnet, and the rotation angle of Yoke are 20mm, 10mm, $56^{\circ}$, and $16^{\circ}$, respectively. On the basis of the results of magnet array, Roll-to Roll magnetron source was fabricated and tested. The uniformity of the film thickness and that of the sheet resistance was ${\pm}1.62%$ and ${\pm}4.13%$, and the resistivity was $2.79{\times}10^{-3}W{\cdot}cm$.

LED적용 TFT-LCD 외관 백색 균일도 향상을 위한 광선 추적 시뮬레이션 연구 (The Study of White uniformity improvement in TFT LCD using LED)

  • 이상환;이준신;이승재
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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    • pp.1665-1666
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    • 2006
  • TFT-LCD(Thin Film Transistor Liquid Crystal Display)는 표시장치로서 실용화된 후 많은 상품에 적용중이다. 그러나, LCD는 자체 발광능력이 없으므로 그후면에서 LCD 화면을 밝혀주는 BLU(Backlight Unit)를 필요로 한다. BLU는 내부 광원으로 밝기가 균일한 평면광을 만들어 LCD 화면을 균일하게 면조사하는 역할을 한다. LCD가 적용되는 분야중 Note PC에는 광원으로 CCFL(Cold Cathode Fluorescent Lamp)가 적용되어 왔지만, 최근 고휘도, 박형화, 저소비 전력을 달성하기 위해 CCFL로는 한계가 있어 LED(Light Emitting Diode)를 적용한 BLU를 제작하기 위한 연구가 진행되고 있다. 본 연구에서는 점광원인 LED 적용한 LED에 있어서 요구되는 휘도 균일성을 향상시키기 위해서는 LED광원이 적용된 BLU의 외관 품질 향상을 위한 도광판 입광부 구조 최적화를 광추적 Simulation을 통해 예측하고 향상시킬 수 있는 구조를 제안한다. Simulation결과, 외관품질 개선을 위해 도광판 입광면에 130도의 Serration과 휘도를 향상하기 위해 도광판 밑면에 렌즈 형상의 바 구조를 도출해 적용한 결과 외관품질향상과 휘도향상을 얻었다.

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Cu 배선 형성을 위한 CMP 특성과 ECP 영향 (Cu CMP Characteristics and Electrochemical plating Effect)

  • 김호윤;홍지호;문상태;한재원;김기호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.252-255
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    • 2004
  • 반도체는 high integrated, high speed, low power를 위하여 design 뿐만 아니라 재료 측면에서도 많은 변화를 가져오고 있으며, RC delay time을 줄이기 위하여 Al 배선보다 비저항이 낮은 Cu와 low-k material 적용이 그 대표적인 예이다. 그러나, Cu 배선의 경우 dry etching이 어려우므로, 기존의 공정으로는 그 한계를 가지므로 damascene 또는 dual damascene 공정이 소개, 적용되고 있다. Damascene 공정은 절연막에 photo와 RIE 공정을 이용하여 trench를 형성시킨 후 electrochemical plating 공정을 이용하여 trench에 Cu를 filling 시킨다. 이후 CMP 공정을 이용하여 절연막 위의 Cu와 barrier material을 제거함으로서 Cu 배선을 형성하게 된다. Dual damascene 공정은 trench와 via를 동시에 형성시키는 기술로 현재 대부분의 Cu 배선 공정에 적용되고 있다. Cu CMP는 기존의 metal CMP와 마찬가지로 oxidizer를 이용한 Cu film의 화학반응과 연마 입자의 기계가공이 기본 메커니즘이다. Cu CMP에서 backside pressure 영향이 uniformity에 미치는 영향을 살펴보았으며, electrochemical plating 공정에서 발생하는 hump가 CMP 결과에 미치는 영향과 dishing 결과를 통하여 그 영향을 평가하였다.

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