• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.609-610
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• 2010

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2006년도 추계학술발표대회 논문집
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• pp.85-89
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• 2006

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.170-171
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• 2006

The chemical shift of SiOC film was observed according to the flow rate ratio. SiOC film has the broad main band of $880{\sim}1190cm^{-1}$ and the sharp Si-$CH_3$ bond at $1252cm^{-1}$, and the infrared spectra in the Si-O-C bond moved to low frequency according to the increasing of an oxygen flow rate. The chemical shift affected the carbon content in the SiOC film, and the decreasing of carbon atoms elongated the C-H bonding length, relatively. The main bond without the sharp Si-$CH_3$ bond at $1252cm^{-1}$ consisted of Si-C, C-O and Si-O bonds, and became the bonding structure of the Si-O-C bond.

• Applied Science and Convergence Technology
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• 제24권3호
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• pp.60-66
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• 2015

The modified amorphous GeTe formed by pulsed laser irradiation in as-grown GeTe has been analyzed in terms of variations of local bonding structure using extended x-ray absorption fine structure (EXAFS). The modified GeTe film has octahedral-like Ge-Te bonding structure that can be effectively induced by irradiation process. The EXAFS data clearly shows that the irradiation can lead to reduction of the average coordination number. Variations in the transition temperature for the irradiated film during crystallization can be described by the presence of octahedral-like local structure.

• 대한치과보철학회지
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• 제30권4호
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• pp.481-492
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• 1992

Author measured the bonding strength between Dental Porcelain and Nonprecious Dental Alloy and analyzed diffusion Phenomena at the interfaceby by Auger electron spectroscopy and also Electron spectroscopy for Chemical Analysis. The each specimen was sputtered with Al, Cr, In and Sn. 1. Ni whic is the main element of the matris of dental nonprecious alloy diffuse more than the other element and the Ni diffusion rate of each specimen was well coordinated with the bonding strength of each. 2. The Sn thin film suppress the diffusion rate of Ni of matrix into the Dental Porcelain than the In or Cr thin films. 3. The Al thin film suppress the diffusion rate of Ni than the Sn thin film. 4. The main coponent of dental porcelain : Al, Si, Mo diffused into the matrix of alloy. It means that the each element of dental alloy and dental porelain diffused into the each other part.

• 한국정밀공학회지
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• 제27권7호
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• Composites Research
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• 제24권6호
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• pp.56-63
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• 2011

본 연구에서는 화석에너지 고갈과 환경문제로 인해 새로운 신재생에너지로 주목 받고 있는 태양전지를 대표적인 경량재료인 복합재료에 적용하기 위해 적절한 태양전지 접착 방법에 대한 연구를 진행하였다. 사용된 태양전지는 후면전극 태양전지로 에너지변환 실험실 효율이 약 24.2%인 태양전지를 사용하였다. 하지만, 실리콘계열 태양전지는 재료의 특성상 깨지기 쉽기 때문에 일반적으로 사용되고 있는 동시경화 접착법 대신 접착제를 이용한 이차 접착법을 사용하였다. 접착재료는 태양전지의 충진재 및 접착제로 사용되고 있는 EVA film 과 프리프레그의 수지인 Resin film, 그리고 탄성 접착제를 이용하여 실험을 진행 하였으며, 태양전지가 접착된 복합재료 시험편에 기계적 하중을 부가하여 접착제 종류별 태양전지의 성능변화를 측정하였다. 또한, 기계적 하중 하에서 실시간으로 태양전지의 성능을 평가할 수 있는 측정장치를 설계하여 접착재료별 파단 시점과 특성을 비교 평가 하였다. 파단면분석을 통해 태양전지 효율 감소원인을 분석하여 고찰하였다. 실험결과 태양전지의 접착방법에 따라서 태양전지의 효율이 크게 영향을 받는다는 것을 파악하였다. 또한, 탄성접착제를 사용한 접착 방법이 가장 높은 태양전지 효율 성능을 보여주고 있음을 확인하였다.

• 대한전자공학회논문지SD
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• 제48권8호
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• pp.1-4
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• 2011

SiOC 박막과 같은 유무기 하이브리드 저유전 물질에서의 열처리효과에 의한 전기적인 특성의 변화와 유전상수에 관하여 연구하였다. SiOC 박막은 분극에 따른 특성을 분석하기 위해서 TMS과 산소의 혼합가스를 이용한 CVD방법에 의하여 증착되었으며, 300~500도까지 변화하면서 열처리를 하였다. SiOC 박막은 열처리에 의하여 유전상수는 더욱 낮아지며, 400도에서 열처리 한 경우 전기적인 특성이 우수한 것을 확인하였다. XRD 패턴에 의하면 300도이하에서 열처리한 박막과 400도 이상에서 열처리 한 경우 결합구조가 달라지는 것을 알 수 있고 400도 근처에서 급격한 변화가 일어나고 있는 것을 확인하였다.