• 제목/요약/키워드: filling performance

검색결과 391건 처리시간 0.027초

Flowing Ability and Mechanical Properties of Polypropylene Fiber Reinforced High Performance Concrete

  • Kim, Young-Ik;Sung, Chan-Yong
    • 한국농공학회지
    • /
    • 제45권7호
    • /
    • pp.27-37
    • /
    • 2003
  • This study was performed to examine the flowing ability and filling ability of polypropylene fiber reinforced high performance concrete. The slump flow was decreased with increasing the polypropylene fiber content, rapidly. At the box-type filling ability, the difference of box height was increased with increasing the fiber content and the box-type passing ability was closed in fiber content 1 %. The final flowing distance of L-type was decreased with increasing the fiber content. Also, it was decreased above 0.75% of polypropylene fiber content, rapidly. The filling ability of L-type was badly showed above polypropylene fiber content 0.75%. Also, the compressive strength was decreased with increasing the fiber content, but the flexural strength was shown higher than that of the concrete without fiber. At the impact resistance, drop numbers for reaching in final fracture were increased with increasing the fiber content. Also, the drop numbers for reaching initial fracture of 1mm were increased with increasing the fiber content. At the acid resistance, the percent of original mass was decreased with increasing the fiber content.

단일 첨가제를 이용한 고종횡비 TSV의 코발트 전해증착에 관한 연구 (A Study on the Cobalt Electrodeposition of High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive)

  • 김유정;이진현;박기문;유봉영
    • 한국표면공학회:학술대회논문집
    • /
    • 한국표면공학회 2018년도 춘계학술대회 논문집
    • /
    • pp.140-140
    • /
    • 2018
  • The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

  • PDF

MRC 기반의 영상 부호화를 위한 분수령 알고리즘을 이용한 효과적인 신호 채움 기법 (Efficient Signal Filling Method Using Watershed Algorithm for MRC-based Image Compression)

  • 박상효;이시웅
    • 한국콘텐츠학회논문지
    • /
    • 제15권2호
    • /
    • pp.21-30
    • /
    • 2015
  • Mixed raster content 모델 기반의 영상 부호화는 전경과 배경 레이어에 빈 영역인 don't care region (DCR)이 발생하게 되며, 이 영역에 대한 신호 채움 방식에 따라 전체적인 부호화 성능이 큰 영향을 받게 된다. DCR을 채우기 위한 대부분의 기존 기법들은 홀 주변 기존 영역의 특성을 효율적으로 이용하지 않아 신호 채움 후에도 기존 신호 영역에 존재하던 고주파 성분이 반영될 뿐 아니라, DCR 경계에서의 신호 불연속으로 인해 고주파 성분이 추가적으로 발생한다는 문제점을 갖고 있다. 이 문제를 해결하기 위해 본 논문은 우선순위 기반의 적응적 영역 확장법을 이용한 새로운 DCR 채움 알고리즘을 제안한다. 제안 알고리즘은 분수령 알고리즘을 이용하여 DCR의 각 홀 픽셀에 대한 신호 특성을 판단한 후, 이를 토대로 영역 채움의 우선순위를 결정한다. 이 우선 순위를 기반으로 영역 확장을 수행함으로써 고주파 성분을 포함하고 있는 영역의 확장이 최소화되어 전체적인 부호화 효율이 향상될 수 있다. 실험 결과를 통해 제안 알고리즘이 비교 대상 알고리즘에 비해 효율적인 신호 채움으로 우수한 부호화 성능을 가짐을 보인다.

Dynamic Fractional Frequency Reuse based on an Improved Water-Filling for Network MIMO

  • M.K, Noor Shahida;Nordin, Rosdiadee;Ismail, Mahamod
    • KSII Transactions on Internet and Information Systems (TIIS)
    • /
    • 제10권5호
    • /
    • pp.2124-2143
    • /
    • 2016
  • In Long Term Evolution-Advanced (LTE-A) systems, Inter-cell Interference (ICI) is a prominent limiting factor that affects the performance of the systems, especially at the cell edges. Based on the literature, Fractional Frequency Reuse (FFR) methods are known as efficient interference management techniques. In this report, the proposed Dynamic Fractional Frequency Reuse (DFFR) technique improved the capacity and cell edge coverage performance by 70% compared to the Fractional Frequency Reuse (FFR) technique. In this study, an improved power allocation method was adopted into the DFFR technique to reach the goal of not only reducing the ICI mitigation at the cell edges, but also improving the overall capacity of the LTE-A systems. Hence, an improved water-filling algorithm was proposed, and its performance was compared with that of other methods that were considered. Through the simulation results and comparisons with other frequency reuse techniques, it was shown that the proposed method significantly improved the performance of the cell edge throughput by 42%, the capacity by 75%, and the coverage by 80%. Based on the analysis and numerical expressions, it was concluded that the proposed DFFR method provides significant performance improvements, especially for cell edge users.

중력식 안벽 구조물의 증심 시공을 위한 가소성 그라우트의 충진성능 평가 (Estimation on Filling Performance of Thixotropic Grout for Increasing Front-Water Depth of Gravity-Type Quay Wall)

  • 장경필;유용선;권승희;한운우;오명학
    • 한국구조물진단유지관리공학회 논문집
    • /
    • 제21권6호
    • /
    • pp.169-177
    • /
    • 2017
  • 최근 수송선박의 대형화에 따라 기존 항만 시설의 접안 깊이 확보에 대한 필요성이 증가하고 있다. 증심공법은 기존 항만시설의 접안 깊이를 확보하는 방법으로, 필요 깊이만큼 사석마운드를 굴착한 후 그라우팅을 통해 보강한다. 이 연구에서는 사석마운드 보강을 위한 그라우팅 재료로 가소성 그라우트를 사용할 경우 보강성능과 충진성능에 대해 검토하고자 하였다. 2가지 가소성 그라우트 배합에 대해 압축강도실험을 수행하여 지반보강효과를 검토하였고, 직경 400 mm, 높이 530 mm 크기의 실린더형 실험체 5개를 제작해 충진성능을 평가하였다. 구조물의 안전성 확보를 위해 요구되는 개량체의 소요강도는 6 MPa이며, 이 연구에서 사용한 가소성 그라우트 배합 모두 재령 7일에 9 MPa 이상으로 소요강도를 만족하는 것으로 확인되었다. 충진성능 평가 실험체의 충진상태를 육안으로 관찰한 결과, 이 연구에서 목표로 설정한 사석 채 움 높이까지 가소성 그라우트가 잘 채워지는 것을 확인하였다.

예방적 유지보수를 위한 소수성 저점도 AP 표면처리재 개발 (The Development of the Hydrophobic - Low Viscosity Filling Material for the Surface Treatment for Pavement Preventive Maintenance)

  • 최준성;김조순
    • 한국도로학회논문집
    • /
    • 제16권2호
    • /
    • pp.35-41
    • /
    • 2014
  • PURPOSES : Surface treatment is a favorable method in the pavement preventive maintenance. This study (Part I) aimed to develop the low viscosity filling material for waterproof characteristics and high penetrable and weather resistance, and a series of companion study (Part II) presents the coating characteristics and performance analysis using field and lab tests. METHODS : Hydrophobic characteristics of the advanced surface treatment material are observed and measured the filling depth and the permeability for sand and asphalt pavement specimen using the water absorption test and permeability test, X-RAY CT test. Color difference for the weather resistance using ultraviolet ray accelerated weathering test is compared with asphalt pavement specimens. RESULTS : The developed material shows the decreased water absorption and increased impermeable effect because of the hydrophobic characteristics. It is found that the filling depth is about 6mm and weather resistance is better than asphalt pavement specimen. CONCLUSIONS : The advanced hydrophobic - low viscosity filling treatment material is developed in this study (Part I) to improve the waterproof characteristics and high filling capacity and weather resistance for the pavement preventive maintenance.

순환자원을 활용한 Cement Zero형 ECO 파일채움재의 성능평가 (Performance evaluation of cement-zero ECO pile-filling material utilizing recycled resource)

  • 송상훤;윤성진;이영원;음현미;문경주;고형우
    • 한국건축시공학회:학술대회논문집
    • /
    • 한국건축시공학회 2013년도 추계 학술논문 발표대회
    • /
    • pp.8-10
    • /
    • 2013
  • Inorganic binding material was made by recycled resource and its applicability as pile-filling material was examined. The result was that the material had same liquidity with the liquidity of OPC and high reactivity with site soil. According to dynamic/static loading tests by site test-construction, the inorganic binding material met both design bearing capacity and settlement. Since the inorganic binding material showed same or better performance than OPC, the utilization possibility of the inorganic binding material made of recycled resource as pile-filling material was verified.

  • PDF

세공충진 음이온 전도성막의 제조 및 이를 이용한 고체알칼리 연료전지 성능 평가 (Pore-filling anion conducting membranes and their cell performance for a solid alkaline fuel cell)

  • 최영우;이미순;박구곤;임성대;양태현;김창수
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
    • /
    • pp.129.2-129.2
    • /
    • 2010
  • AEM which were used for solid alkaline fuel cell(SAFC) were prepared by photo polymerization in method pore-filling with various quaternary ammonium cationic monomers and crosslinkers without an amination process. Their specific thermal and chemical properties were characterized through various analyses and the physico-chemical properties of the prepared electrolyte membranes such as swelling behavior, ion exchange capacity and ionic conductivity were also investigated in correlation with the electrolyte composition. The polymer electrolyte membranes prepared in this study have a very wide hydroxyl ion conductivity range of 0.01 - 0.45S/cm depending on the composition ratio of the electrolyte monomer and crosslinking agent used for polymerization. However, the hydroxyl ion conductivity of the membranes was relatively higher at the whole cases than those of commercial products such as A201 membrane of Tokuyama. These pore-filling membranes have also excellent properties such as smaller dimensional affects when swollen in solvents, higher mechanical strength, lowest electrolyte crossover through the membranes, and easier preparation process compared of traditional cast membranes. The prepared membranes were then applied to solid alkaline fuel cell and it was found comparable fuel cell performance to A201 membrane of Tokuyama.

  • PDF

열사이펀의 형상비와 충전율에 따른 열전달 성능 해석 (ANALYSIS OF HEAT TRANSFER PERFORMANCE WITH ASPECT AND FILLING RATIOS IN THERMOSYPHON)

  • 김영철;최종욱;김성초
    • 한국전산유체공학회지
    • /
    • 제20권1호
    • /
    • pp.92-98
    • /
    • 2015
  • Thermal-fluid analysis is performed numerically to figure out the characteristics of heat transfer in a thermosyphon varying with the aspect ratio of geometry and the filling ratio of working fluid. The computational results are reasonable compared with the experimental data and visualized. The thermal resistance and the convective heat transfer coefficients are evaluated with the aspect ratio of thermosyphon and the filling ratio of working fluid, respectively. In conclusion, the thermal resistance decreases as the length of evaporator increases. However, the variation of a condenser length is nearly independent on the thermal resistance. In order to raise the performance of thermosyphon, the working fluid needs to be filled over 75%. In addition, Nusselt numbers in the evaporator and the condenser show 275 and 304, respectively.

적응 공간 다중화 MIMO 시스템을 위한 효율적인 전력 할당 알고리즘 (Efficient Power Allocation Algorithms for Adaptive Spatial Multiplexing MIMO Systems)

  • 신준호;김동건;박형래
    • 한국통신학회논문지
    • /
    • 제36권4C호
    • /
    • pp.232-240
    • /
    • 2011
  • Water-filling 알고리즘은 적응 MIMO 시스템의 ergodic 용량을 최대화하는 효율적인 전력 할당 방식이지만 이산 변조 지쉬discrete modulation index)를 사용하는 실제의 시스템의 경우 과도한 잉여 전력(residual power)으로 인해 스펙트럼 효율이 감소하는 단점이 있다. 본 논문에서는 water-filling 알고리즘의 잉여 전력을 효율적으로 재할당 함으로써 적응 MIMO 시스템의 스펙트럼 효율을 향상시키는 새로운 전력 할당 알고리즘을 제안한다. 알고리즘의 성능을 검증하기 위해 터보 코드가 적용된 적응 MIMO 시스템을 구성하고 다양한 환경에서 시뮬레이션을 수행한다 시뮬레이션 결과, 레일리이 페이딩 환경에서 SNR이 20dB일 때 제안된 알고리즘의 스펙트럼 효율이 기존의 water-filling 알고리즘에 비해 대략 8.9% 향상됨을 알 수 있었다.